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| Application No. | Application Title | Issue Date |
| 20120043854 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electr... | 02/23/2012 |
| 20110273815 | ELECTRONIC COMPONENT In an electronic component, a first capacitor conductor includes a first exposed portion exposed between insulating layers at a surface of a laminate including a first shorter side and two longer sides. A second capacitor conductor includes a second exposed portion expo... | 11/10/2011 |
| 20110266040 | MULTILAYER CERAMIC CAPACITOR, PRINTED CIRCUIT BOARD INCLUDING THE SAME, METHODS OF MANUFACTURING THEREOF There are provided a multilayer ceramic capacitor, a printed circuit board including the same, a method of manufacturing the multilayer ceramic capacitor, and a method of manufacturing the printed circuit board. The method of manufacturing a multilayer ceramic capacitor... | 11/03/2011 |
| 20110149468 | THREE-DIMENSIONAL CAPACITOR AND TOPOLOGICAL DESIGN METHOD FOR SUCH A CAPACITOR A three-dimensional capacitor is formed from a multilayer of superposed electrodes. The electrodes are formed within respective metallization levels of an integrated circuit. At least two additional superposed electrodes are formed on top of the multilayer. Each additio... | 06/23/2011 |
| 20110141655 | MULTILAYER CERAMIC CAPACITOR Disclosed is multilayer ceramic capacitor. The multilayer ceramic capacitor includes a capacitive part including dielectric layers and first and second internal electrodes alternately laminated therein, wherein the dielectric layers include first ceramic particles havin... | 06/16/2011 |
| 20110102969 | MULTILAYER CAPACITOR, MOUNTING STRUCTURE THEREOF, AND METHOD OF MANUFACTURING SAME A multilayer capacitor 1 comprises a capacitor element body 2 constituted by a plurality of dielectric layers 10; inner electrodes 3, 4, disposed within the capacitor element body 2, having main electrode parts 31, 41 separated ... | 05/05/2011 |
| 20110096464 | MULTILAYER CAPACITOR Disclosed is a multilayer capacitor capable of improving adhesiveness of layers of an element body and improving reliability. Outer edge 12a, 12c, and 12d of a second principal-surface electrode portion 12 are respectivel... | 04/28/2011 |
| 20110096463 | MULTILAYER CAPACITOR Disclosed is a multilayer capacitor capable of improving reliability and further reducing ESL. In a width direction, a second principal-surface electrode portion is greater than a first principal-surface electrode portion, and a fifth principal-surface electrode portion... | 04/28/2011 |
| 20110049674 | INTERDIGITATED VERTICAL PARALLEL CAPACITOR An interdigitated structure may include at least one first metal line, at least one second metal line parallel to the at least one first metal line and separated from the at least one first metal line, and a third metal line contacting ends of the at least one first met... | 03/03/2011 |
| 20110037536 | CAPACITANCE ELEMENT AND RESONANCE CIRCUIT A capacitance element includes a first electrode, a second electrode, a third electrode, a fourth electrode, a first dielectric portion, a second dielectric portion, and a third dielectric portion. To the first electrode, a signal having a first polarity is applied. To ... | 02/17/2011 |
| 20110002082 | HIGH CAPACITANCE MULTILAYER WITH HIGH VOLTAGE CAPABILITY New designs for multilayer ceramic capacitors are described with high voltage capability without the need of coating the part to resist surface arc-over. One design combines a high overlap area for higher capacitance whilst retaining a high voltage capability. A variati... | 01/06/2011 |
| 20100309606 | Capacitor Arrangement And Method For Making Same One or more embodiments relate to a semiconductor chip including a capacitor arrangement, the capacitor arrangement comprising: a first capacitor; and a second capacitor stacked above the first capacitor, the first capacitor and the second capacitor coupled in series be... | 12/09/2010 |
| 20100309605 | THREE-TERMINAL METAL-OXIDE-METAL CAPACITOR An MOM capacitor includes a first metal plate; a second metal plate in close proximity to the first metal plate; a third metal plate in close proximity to the first metal plate, and at least one oxide layer interposed between the first, second and three vertical metal p... | 12/09/2010 |
| 20100302704 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being... | 12/02/2010 |
| 20100271752 | LAMINATED CERAMIC ELECTRONIC COMPONENT In a laminated ceramic electronic component including a ceramic element body including a plurality of effective sections, each of which constitutes a circuit element such as a laminated capacitor unit, bumps generated between the effective portions and a gap interposed ... | 10/28/2010 |
| 20100254070 | MULTILAYER CHIP CAPACITOR A multilayer chip capacitor includes: a capacitor body having first and second side surfaces and a bottom surface; a plurality of first and second internal electrodes in the capacitor body; first and second external electrodes having a first polarity and formed on the f... | 10/07/2010 |
| 20100243307 | LEADED MULTI-LAYER CERAMIC CAPACITOR WITH LOW ESL AND LOW ESR A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectri... | 09/30/2010 |
| 20100238605 | MULTILAYER CHIP CAPACITOR AND METHOD OF FABRICATING THE SAME A multilayer chip capacitor includes: a capacitor main body; a plurality of first and second inner electrodes; and m (m≧3) number of first and second outer electrodes. The plurality of first and second inner electrodes are connected with two outer electrodes positione... | 09/23/2010 |
| 20100232086 | MULTILAYER CAPACITOR There are a plurality of types of first internal electrodes and each type of first internal electrode includes a first main electrode portion and a first lead portion. A second internal electrode includes a plurality of second main electrode portions forming respective ... | 09/16/2010 |
| 20100220426 | MULTILAYER CERAMIC ELECTRONIC COMPONENT A multilayer ceramic capacitor includes first internal electrodes extending to a first end surface of a ceramic element assembly, a plurality of second internal electrodes extending to a second end surface, floating internal electrodes arranged so as to overlap the firs... | 09/02/2010 |
| 20100206624 | Electric Multilayer Component An electric multilayer component includes a stack of dielectric layers and electrode layers arranged side by side. External contacts have different polarities that are arranged at an outer surface of the stack and are flip-chip contact-connectable. The electrode layers ... | 08/19/2010 |
| 20100188798 | MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING SAME A multilayer capacitor which can prevent chattering noises from occurring and improve the packaging density and packaging yield, and a method of manufacturing a multilayer capacitor are provided. Even when an electrostrictive vibration is g... | 07/29/2010 |
| 20100188799 | CONTROLLED ESR LOW INDUCTANCE CAPACITOR Multilayer capacitors incorporate both low inductance (ESL) and controlled Equivalent Series Resistance (ESR) features into a cost-effective unitary device. Internal electrode patterns generally include one or more pairs of mother electrodes adapted for external connect... | 07/29/2010 |
| 20100157507 | ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a ... | 06/24/2010 |
| 20100128413 | MULTILAYER CAPACITOR In a capacitor body, a single second capacitor unit is interposed between two first capacitor units. The width direction dimension of each of extended portions of first and second internal electrodes included in the first capacitor unit is larger than the width directio... | 05/27/2010 |
| 20100128412 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF In a laminated ceramic electronic component in which, by directly carrying out a plating process on an outer surface of a component main body, an external electrode is formed thereon, an attempt is made to improve the adhesion strength between a plated film forming the ... | 05/27/2010 |
| 20100123994 | CERAMIC ELECTRONIC COMPONENT In a ceramic electronic component having a thin structure, the occurrence of cracks due to stress applied when the ceramic component is being mounted or in a mounted state are prevented. Each of first and second external terminal electrodes has a substantially rectangul... | 05/20/2010 |
| 20100123213 | METAL-INSULATOR-METAL CAPACITORS Metal-insulator-metal capacitors are provided that are formed in integrated circuit dielectric stacks. A line-plate-line capacitor is provided that alternates layers that contain metal plates with layers that contain straight or angled parallel lines of alternating pola... | 05/20/2010 |
| 20100118467 | LAMINATED CERAMIC ELECTRONIC COMPONENT In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of ... | 05/13/2010 |
| 20100091427 | MULTILAYER CHIP CAPACITOR A multilayer chip capacitor includes: a capacitor body having a plurality of dielectric layers laminated therein and comprising first and second capacitor units; and first to fourth external electrodes formed on an outer surface of the capacitor body, wherein the first ... | 04/15/2010 |
| 20100079925 | MULTILAYER CAPACITOR A multilayer capacitor which can inhibit impedance from decreasing near a resonance frequency is provided. The multilayer capacitor comprises a dielectric matrix, a plurality of first and second inner electrodes, a pair of terminal electrod... | 04/01/2010 |
| 20100067170 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME A ceramic electronic component that is hardly influenced by a stress generated when an external electrode containing a metal sintered compact is formed at the end of the ceramic component body, and a method for manufacturing the same are provided. A laminated ceramic ca... | 03/18/2010 |
| 20100053842 | STACKED MULTILAYER CAPACITOR A capacitor device mountable on a plane of a substrate includes an electrically conductive bottom plate adapted to be mounted substantially parallel to, and in electrical contact at the plane of the substrate and a first multilayer capacitor having substantially paralle... | 03/04/2010 |
| 20100039750 | MULTILAYER CAPACITOR A multilayer capacitor comprises a capacitor element body constituted by a plurality of laminated dielectric layers; first and second signal terminal electrodes and a ground terminal electrode which are arranged on an outer surface of the capacitor element body; and a g... | 02/18/2010 |
| 20100033894 | HIGH VOLTAGE CAPACITORS A multilayer ceramic capacitor component includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers, first and second external terminals attached to the ceramic capacitor body. The plurality of electrode... | 02/11/2010 |
| 20100027189 | MULTILAYER CAPACITOR An element body has a major capacitance forming portion to form a first capacitance, and a minor capacitance forming portion to form a plurality of second capacitances smaller than the first capacitance. The major capacitance forming portion includes a first internal el... | 02/04/2010 |
| 20100027190 | Multilayer Capacitor and Method for Adjusting Equivalent Series Impedance of Same A multilayer capacitor operable to allow adjustment of its equivalent series resistance substantially independent of its equivalent series inductance is disclosed. The multilayer capacitor can be used in decoupling circuits such as power supply decoupling circuits. The ... | 02/04/2010 |
| 20090316330 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF A multilayer ceramic electronic component includes dummy conductor patterns on a ceramic green sheet laminated in an earlier stage of the lamination and sheet-by-sheet crimping process that have widths that are less than the widths of dummy conductor patterns on a ceram... | 12/24/2009 |
| 20090310276 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME A multilayer ceramic electronic component includes external terminal electrodes that are formed by direct plating on the first and second side surfaces of a ceramic body including stacked ceramic layers and inner conductors. The external terminal electrodes include base... | 12/17/2009 |
| 20090310277 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of side surfaces that connect the first main surface to the second main surf... | 12/17/2009 |
