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| Application No. | Application Title | Issue Date |
| 20120127626 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked on top of each other, at least one internal electrode formed on a corresponding ... | 05/24/2012 |
| 20120106025 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME There is provided a multilayer ceramic capacitor and a method of manufacturing the same. There is provided a multilayer ceramic capacitor, including: a ceramic body having a plurality of dielectric layers stacked therein and including a first side and a second side oppo... | 05/03/2012 |
| 20120081832 | Chip Capacitor Precursors A capacitive precursor includes electrically conductive material layers stacked on a substrate. The electrically conductive layers provide first and second patterns. The patterns each include overlaying areas free of the electrically conductive material. The first pair ... | 04/05/2012 |
| 20120069487 | STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME [Problem to be Solved] A problem to be solved is to provide a stacked structure and a method of manufacturing the same that make generation of insulation breakdown unlikely, while providing a high dielectric constant and a high quality. ... | 03/22/2012 |
| 20120045685 | ELECTRIC STORAGE DEVICE To provide an electric storage device whose negative electrode can be doped with lithium ions in a short time and whose resistance can be lowered. An electric storage device including a unit that is obtained by alternately stacking a positive-electrode sheet 9 an... | 02/23/2012 |
| 20120039014 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the compo... | 02/16/2012 |
| 20120039015 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component ma... | 02/16/2012 |
| 20120033342 | STACKED FILM CAPACITOR AND METHOD OF PRODUCING THE SAME A stacked film capacitor including a resin protective film having excellent durability is provided which can stably secure desired properties. The stacked film capacitor includes a capacitor element 12 including a plurality of dielectric layers 14, 18a ... | 02/09/2012 |
| 20120019978 | CERAMIC ELECTRONIC COMPONENT A ceramic electronic component includes a plurality of first reinforcement layers. The plurality of first reinforcement layers are arranged in a first outer layer portion so as to extend in the length direction and in the width direction, and are stacked in the thicknes... | 01/26/2012 |
| 20120014034 | HIGH POWER DENSITY CAPACITOR AND METHOD OF FABRICATION A ductile preform for making a drawn capacitor includes a plurality of electrically insulating, ductile insulator plates and a plurality of electrically conductive, ductile capacitor plates. Each insulator plate is stacked vertically on a respective capacitor plate and ... | 01/19/2012 |
| 20120009478 | CRYSTALLINE CARBONACEOUS MATERIAL WITH CONTROLLED INTERLAYER SPACING AND METHOD OF PREPARING SAME A crystalline carbonaceous material with a controlled interlayer spacing and a method of manufacturing the same. In one embodiment, a crystalline carbonaceous material has a layered structure including a plurality of layers and where a filler is present between the laye... | 01/12/2012 |
| 20120002346 | Metalized film capacitor Disclosed is a metalized film capacitor having excellent safety preservation ability and an excellent withstand voltage at high temperatures. This capacitor has a structure for which a split electrode section wherein a split electrode is formed by spliting a metalized f... | 01/05/2012 |
| 20110317327 | Multi-layered ceramic capacitor There is provided a multi-layered ceramic capacitor with reduced internal resistance by forming internal electrode groups including internal electrodes having different lengths. The multi-layered ceramic capacitor of the present invention includes a sintered ceramic bod... | 12/29/2011 |
| 20110310526 | CAPACITORS WITH HIGH ENERGY STORAGE DENSITY AND LOW ESR Electrostatic capacitors with high capacitance density and high-energy storage are implemented over conventional electrolytic capacitor anode substrates using highly conformal contact layers deposited by atomic layer deposition. Capacitor films that are suitable for ene... | 12/22/2011 |
| 20110299220 | Electrical Multi-Layered Component and Circuit Arrangement Comprising the Same An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side su... | 12/08/2011 |
| 20110292564 | POWER STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME To provide a method for forming an electrode for a storage battery, including the step of: forming a metal layer which is over a current collector and has an edge portion; and forming a crystalline silicon layer, which is over the etched metal layer and includes a silic... | 12/01/2011 |
| 20110292565 | CAPACITOR STRUCTURE A capacitor structure includes a plurality of conductive line levels located over the substrate. Each of the conductive line levels includes a first conductive line and a second conductive line. The first conductive lines in the conductive line levels form a first condu... | 12/01/2011 |
| 20110287270 | METHOD FOR FORMING A BORON-CONTAINING THIN FILM AND MULTILAYER STRUCTURE To provide a method for forming a boron-containing thin film, by which a uniform boron thin film with good adhesion can be formed on the surface of a processing object, and also to provide a multilayer structure. An electrolysis apparatus includes an anode 1, a p... | 11/24/2011 |
| 20110267738 | MULTI-LAYER CERAMIC CAPACITOR AND PRODUCTION METHOD THEREOF The present invention relates to a multi-layer ceramic capacitor printed simultaneously with internal electrode and external electrode by employing an inkjet printing. A method for manufacturing the multi-layer ceramic capacitor comprising first external electrode, diel... | 11/03/2011 |
| 20110253989 | ORGANIC ELECTRONIC CIRCUIT The invention concerns an organically electronic circuit (1, 2, 3), having a main substrate (80, 80a, 80b) and an organic electronic assembly (10, 11, 12) in the form of a multilayer film body with electrically conducting and se... | 10/20/2011 |
| 20110235233 | ELECTRONIC DEVICE AND METHOD FOR PRODUCING ELECTRONIC DEVICE To provide electronic device and method for producing electronic device having high mechanical strength. An electronic device comprised of a plurality of internal electrode layers and dielectric layers alternately laminated wherein particle... | 09/29/2011 |
| 20110194228 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR To increase the dielectric constant of a dielectric ceramic containing ABO3 (A being Ba alone or further containing at least one of Ca and Sr, and B is Ti alone or or further contains at least one of Zr and Hf) as its main constituent and containing Re (Re is... | 08/11/2011 |
| 20110193448 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are fo... | 08/11/2011 |
| 20110188169 | Electric double layer capacitor cell, electric double layer capacitor package having the same, and methods of manufacturing the same There are provided an electric double layer capacitor cell, an electric double layer capacitor package having the same, and methods of manufacturing the same. An electric double layer capacitor cell according to an aspect of the invention may include: a plurality of ele... | 08/04/2011 |
| 20110170228 | DIELECTRIC CERAMIC COMPOSITION AND MONOLITHIC CERAMIC CAPACITOR There is provided a dielectric ceramic composition suitable for, for example, a car-mounted monolithic ceramic capacitor used in a high-temperature environment. It is represented by the composition formula: 100(Ba1-xCax)mTiO3+... | 07/14/2011 |
| 20110157763 | CAPACITOR FOR INCORPORATION IN WIRING BOARD, WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, AND CERAMIC CHIP FOR EMBEDMENT A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated dire... | 06/30/2011 |
| 20110151803 | Fringe Capacitor Circuit Capacitive circuits are implemented with desirable quality factors in various implementations. According to an example embodiment, a fringe capacitor includes two capacitive circuits (e.g., plates), respectively having a plurality of capacitive fingers extending from an... | 06/23/2011 |
| 20110149465 | ELECTRIC DOUBLE LAYER CAPACITOR AND METHOD FOR MANUFACTURING THE SAME An electric double layer capacitor 200 is configured such that a positive electrode 206, a separator 205, and a negative electrode 207 stacked in this order are contained in a container, and a portion between the positive electrode 206... | 06/23/2011 |
| 20110141653 | ENERGY CONDITIONER WITH TIED THROUGH ELECTRODES The application discloses energy conditioners that include A, B, and G master electrodes in which the A and B electrodes include main body electrodes with conductive paths that cross inside the energy conditioner and which has A and B tabs at one end of the main body el... | 06/16/2011 |
| 20110141654 | NICKEL POWDER OR ALLOY POWDER COMPRISING NICKEL AS MAIN COMPONENT, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE AND LAMINATED CERAMIC CAPACITOR There are provided a nickel powder or an alloy powder comprising nickel as a main component, in which the nickel powder or the alloy powder has an average particle size D50 of 30 to 300 nm, a diffraction peak from the (111) plane of the nickel powder or the a... | 06/16/2011 |
| 20110128665 | Ceramic Capacitors for High Temperature Applications A ceramic capacitor having a ceramic dielectric layer positioned between a first electrode layer and a second electrode layer and methods of manufacturing the same are provided. The ceramic dielectric layer includes a niobium doped barium titanate, a sodium bismuth tita... | 06/02/2011 |
| 20110116209 | CAPACITOR AND METHOD FOR FABRICATING THE SAME A capacitor includes a lower electrode, a first dielectric layer formed over the lower electrode, a second dielectric layer formed over the first dielectric layer, wherein the second dielectric layer includes an amorphous high-k dielectric material, a third dielectric l... | 05/19/2011 |
| 20110116210 | CAPACITOR AND ITS MANUFACTURING METHOD A method for manufacturing a capacitor includes the steps of: sequentially laminating, on a substrate, a lower electrode layer, a dielectric layer and an upper electrode layer; forming a patterned mask layer on the upper electrode layer; patterning at least the upper el... | 05/19/2011 |
| 20110110014 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR Changes in states giving rise to electrode breakage and ball formation are made less likely during firing step for sintering the laminated body, and the improvement in DC bias characteristics is achieved in laminated ceramic electronic components with a laminated body w... | 05/12/2011 |
| 20110110012 | BIPOLAR LAYERED TYPE ELECTRIC DOUBLE LAYER CAPACITOR There is provided a bipolar layered type electric double layer capacitor capable of suppressing upsizing of the capacitor unit and enhancing sealability of adjacent capacitor cells. The present invention relates to a bipolar layered type electric double layer capacitor ... | 05/12/2011 |
| 20110110013 | STACKED ELECTRIC DOUBLE LAYER CAPACITOR A stacked electric double layer capacitor includes a capacitor unit, an aluminum laminate film, and a current collector terminal. The capacitor unit includes a pressure plate, and a current collector plate arranged inside the pressure plate. The aluminum laminate film w... | 05/12/2011 |
| 20110095397 | Semiconductor Structures Including Dielectric Layers and Capacitors Including Semiconductor Structures Semiconductor structures including a first conductive layer; a dielectric layer on the first conductive layer; a second conductive layer on the dielectric layer; and a crystallized seed layer in at least one of a first portion between the first conductive layer and the ... | 04/28/2011 |
| 20110090615 | CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one sid... | 04/21/2011 |
| 20110090616 | INTEGRATED CIRCUIT AND METHOD INCLUDING STRUCTURING A MATERIAL A method of making an integrated circuit including structuring a material. The method includes providing an arrangement of three-dimensional bodies. The material is arranged between the bodies and structured directed radiation. The projection pattern of the three-dimens... | 04/21/2011 |
| 20110090024 | Switched Capacitor Array Having Reduced Parasitics A switched capacitor includes a capacitor and a switch. The capacitor is coupled between a p-node and an n-node and includes interleaved p-fingers and n-fingers. A number of the p-fingers is greater than a number of the n-fingers. The switch is coupled between the n-nod... | 04/21/2011 |