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| Application No. | Application Title | Issue Date |
| 20110157763 | CAPACITOR FOR INCORPORATION IN WIRING BOARD, WIRING BOARD, METHOD OF MANUFACTURING WIRING BOARD, AND CERAMIC CHIP FOR EMBEDMENT A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated dire... | 06/30/2011 |
| 20110121820 | HIGH VOLTAGE SENSING CAPACITOR AND INDICATOR DEVICE A high-voltage sensing capacitor as an interface apparatus that may be used to attach an indicator unit to a high-voltage AC electrical bus and to provide safety to maintenance personnel. The high-impedance nature of the sensing capacitor effectively isolates the indica... | 05/26/2011 |
| 20110102966 | MOLDED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME A molded capacitor includes a capacitor-element assembly, a package covering the capacitor-element assembly, and a supporter embedded in the package. The capacitor-element assembly includes a capacitor element having a first electrode, and a busbar joined to the electro... | 05/05/2011 |
| 20100271749 | DIELECTRIC BODY AND METHOD FOR PRODUCTION THEREOF A dielectric body and a method of producing the dielectric body are disclosed. In accordance with an embodiment of the present invention, the dielectric body using a polymer matrix and being expressed in the following Reaction Scheme 1 includes two or more kinds of cera... | 10/28/2010 |
| 20100271748 | Embedded capacitor, embedded capacitor sheet using the same and method of manufacturing the same Provided are an embedded capacitor, an embedded capacitor sheet using the embedded capacitor, and a method of manufacturing the same that may increase a surface area to thereby increase a capacity for each unit area and may provide an embedded capacitor in a sheet to th... | 10/28/2010 |
| 20100202095 | CASE MOLD TYPE CAPACITOR AND METHOD FOR MANUFACTURING THE SAME The case mold type capacitor has a capacitor element, a pair of terminals, and molding resin. Each terminal of the pair is connected to a first electrode and a second electrode of the capacitor element, respectively. The capacitor element is embedded in the molding resi... | 08/12/2010 |
| 20100142118 | COPPER-CLAD LAMINATE WITH CAPACITOR, PRINTED CIRCUIT BOARD HAVING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE PRINTED CIRCUIT BOARD A copper-clad laminate with a capacitor, a printed circuit board having the same and a semiconductor package having the printed circuit board are presented. The copper-clad laminate with the capacitor includes a first and second conductive layers, a film body, and thick... | 06/10/2010 |
| 20100085680 | CRYSTALLINE ENCAPSULANTS This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.... | 04/08/2010 |
| 20100067168 | COMPOSITE ORGANIC ENCAPSULANTS This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.... | 03/18/2010 |
| 20090251846 | EMBEDDED CAPACITOR An embedded capacitor including a dielectric layer disposed between opposing faces of electrodes, in which the dielectric layer includes a high-loss dielectric layer and one or more insulating layers in contact with the high-loss dielectric layer. The dielectric layer m... | 10/08/2009 |
| 20090201624 | COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT PACKAGE USING COMPONENT-EMBEDDED SUBSTRATE A component-embedded substrate includes a chip capacitor. The chip capacitor includes a ceramic laminate body and a plurality of terminal electrodes. The component-embedded substrate has a first principal surface and a second principal surface. At least two of the plura... | 08/13/2009 |
| 20090101956 | EMBEDDED TRENCH CAPACITOR HAVING A HIGH-K NODE DIELECTRIC AND A METALLIC INNER ELECTRODE A deep trench is formed in a semiconductor substrate and a pad layer thereupon, and filled with a dummy node dielectric and a dummy trench fill. A shallow trench isolation structure is formed in the semiconductor substrate. A dummy gate structure is formed in a device r... | 04/23/2009 |
| 20080310073 | Method for Forming Oxide Dielectric Layer, and Capacitor Layer Forming Material Provided with Oxide Dielectric Layer Obtained by the Forming Method The present invention has an object to provide a method for forming an oxide dielectric layer, which dielectric layer is formed by applying the sol-gel method, and is hardly damaged by an etching solution and excellent in dielectric characteristics such as a large elect... | 12/18/2008 |
| 20080174932 | CAPACITOR ASSEMBLY, DISPLAY DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING CAPACITOR ASSEMBLY A capacitor assembly includes a first electrode, a second electrode, a dielectric portion, a body and a conductive cover. The second electrode overlaps the first electrode. The dielectric portion is interposed between the first and second electrodes. The body surrounds ... | 07/24/2008 |
| 20080130196 | Capacitor Layer Forming Material and Printed Wiring Board Having Embedded Capacitor Layer Obtained by using the Capacitor Layer Forming Material It is an object of the present invention to provide a capacitor layer forming material which is applicable to printed wiring boards manufactured through a high-temperature processing of 300° C. to 400° C. of a fluorine-contained resin substrate, a liquid crystal polym... | 06/05/2008 |
| 20080049375 | Tunable inter-digital capacitor and method of manufacturing the same Provided are a tunable inter-digital capacitor (IDC) and a method of manufacturing the same. The tunable IDC includes: a first dielectric layer formed on a substrate and having electrode pattern grooves of an IDC including a ground line and a signal line formed therein;... | 02/28/2008 |
| 20070291440 | Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components Disclosed is an organic encapsulant composition that, when applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards, allows the capacitor to resist printed wiring board chemicals and survive accelerated life testing conducted under high hum... | 12/20/2007 |
| 20070253141 | Electric double layer capacitor The present invention provides an electric double layer capacitor. An electric double layer capacitor element sandwiches a separator between a cathode and an anode, arranged inside a container comprising a concave shaped containing portion and lid. A first conductive la... | 11/01/2007 |
