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| Application No. | Application Title | Issue Date |
| 20090212899 | Low Pressure Transducer Using Beam and Diaphragm A low-pressure transducer including a disc-shaped metal diaphragm to which a fluid pressure is applied, wherein the diaphragm contains a raised beam formed by thinning the entire exterior surface of the diaphragm except for the beam; and at least one silicon strain gage... | 08/27/2009 |
| 20070024409 | SEMICONDUCTOR DEVICE A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, a board having the chip fixed to a first region on the upper face thereof, and an adhesive portion formed in a second region on the bottom face of ... | 02/01/2007 |
| 20060255901 | Production of microelectromechanical systems (mems) using the high-temperature silicon fusion bonding of wafers The invention relates to a method for manufacturing MEMS devices, in which the sensor and the electronics for processing the sensor signal are monolithically integrated. ... | 11/16/2006 |
| 20050134425 | Systems and methods for measuring component matching Systems and methods for measuring a contour match between adjacent components are disclosed. In one embodiment, at least two pressure sensors are located between adjacent components. Each pressure sensor is adapted to obtain a pressure measurement at a location a predet... | 06/23/2005 |
