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| Application No. | Application Title | Issue Date |
| 20120019331 | PRINTED CIRCUIT BOARD A printed circuit board includes signal transmitting units that transmit signals, signal receiving units that receive signals, and a plurality of signal lines that connect the signal transmitting units and the signal receiving units. A resistor having a value Rp [Ω] of... | 01/26/2012 |
| 20110221505 | Distributed, diode mixer circuit A distributed, diode mixer circuit includes a plurality of passive diode mixer cores including at least first and second passive diode mixer cores including doubly-balanced diodes in symmetrical balanced configuration forms, each mixer core having a pair of differential... | 09/15/2011 |
| 20110199165 | CIRCUIT SUBSTRATE A circuit substrate includes a first pair of ground lines, a second pair of ground lines, a plurality of first connection lines, a plurality of second connection lines and a plurality of conductive pillars. The first and second pairs of ground lines are located on first... | 08/18/2011 |
| 20110181370 | APPARATUS ENABLING PARALLEL TRANSMISSIONS OVER TRANSMISSION LINES HAVING DIFFERENT LENGTHS A signal bus includes multiple interconnects for transporting electronic signals. The interconnects have different physical path lengths and different structures to equalize the different the physical path lengths, so that the electronic signals traverse the correspondi... | 07/28/2011 |
| 20110156833 | NETZFILTER FUR EINEN UMRICHTER ZUM ANSCHLUSS DES UMRICHTERS AN EIN 3-PHASIGES VERSORGUNGSNETZ NETWORK FILTER FOR A CONVERTER FOR CONNECTION OF THE CONVERTER TO A 3-PHASE SUPPLY NETWORK A network filter for connecting a converter to a 3-phase supply network includes in each phase a toroidal inductor which is connected in series with a commutation inductor at a respective first connection point, and a capacitor circuit having at least four capacitances,... | 06/30/2011 |
| 20110128086 | CIRCUIT BOARD WITH DECREASED CROSSTALK A circuit board includes a signal line plane and a reference plane. The signal line plane has at least a first transmission line and a second transmission line formed thereon. The reference plane has a conductive region and at least a non-conductive region. The first tr... | 06/02/2011 |
| 20110109399 | DEVICE FOR INDUCTIVE MULTI-INJECTION ON MULTIPLE CONDUCTORS The techniques described herein permit the application of methods for increasing the performance of a communications system on a medium made up of N conductors (21 to 2N) and a reference plane (4) by means of injecting signals ... | 05/12/2011 |
| 20110095838 | MULTICHANNEL INTERFACING DEVICE HAVING A TERMINATION CIRCUIT The invention relates to an interfacing device for transmission through interconnections used for sending a plurality of electrical signals. The interfacing device of the invention comprises signal terminals and a common terminal. A receivi... | 04/28/2011 |
| 20110037528 | Wave Guiding Structures for Crosstalk Reduction Various apparatus and methods of addressing crosstalk in a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first layer of a circuit board with a first signal trace and forming a second layer of the circuit board ... | 02/17/2011 |
| 20110025428 | COUPLING CANCELLATION SCHEME Methods and apparatus are disclosed, such as those involving an interconnection layout for an integrated circuit (IC). One such layout includes a plurality of differential pairs of lines. Each differential pair has two lines including one or more parallel portions exten... | 02/03/2011 |
| 20100327989 | MICRO-STRIP CROSSTALK COMPENSATION USING STUBS A micro-strip transmission line may include a plurality of conductors, wherein each conductor has a compensating portion and a remaining portion. The compensating portion can compensate for far-end crosstalk in the remaining portion. In one example, the compensating por... | 12/30/2010 |
| 20100289595 | DEVICE FOR INDUCTIVE MULTI-INJECTION ON MULTIPLE CONDUCTORS Which permits the application of methods for increasing the performance of a communications system on a medium made up of N conductors (21 to 2N) and a reference plane (4) by means of injecting signals (11 to ... | 11/18/2010 |
| 20100219904 | COMMUNICATION SYSTEM WITH FUNCTION OF PREVENTING SIGNAL REFLECTION AND NODE INCLUDED IN THE SAME The communication system includes a trunk line constituted of first and second signal lines for transmitting differential signals, a plurality of branch lines each branching from the trunk line and connected with a node, and at least one reflection prevention circuit co... | 09/02/2010 |
| 20100207700 | MICRO-STRIP TRANSMISSION LINE STRUCTURE OF A SERPENTINE TYPE A micro-strip transmission line capable of reducing far-end crosstalk is provided. The micro-strip transmission line having a serpentine shape is capable of reducing the far-end crosstalk of the transmission line by increasing capacitive coupling between neighboring tra... | 08/19/2010 |
| 20100109790 | Multilayer Complementary-conducting-strip Transmission Line Structure A multilayer complementary-conducting-strip transmission line (CCS TL) structure is disclosed herein. The multilayer CCS TL structure includes a substrate, and n signal transmission lines being parallel and interlacing with n-1 mesh ground plane(s), therein a plurality ... | 05/06/2010 |
| 20100026408 | SIGNAL TRANSFER FOR ULTRA-HIGH CAPACITY CIRCUITS The present invention provides high performance, low power signal transfer methods for linking large numbers of integrated chips into ultra-high capacity circuits; Example application of the present invention including ultra-high capacity memory systems, and router syst... | 02/04/2010 |
| 20100001806 | SIGNAL TRANSMISSION LINES A pair of signal transmission lines includes an aggressor line and a victim line parallel to the aggressor line. A plurality of time delay modules is linked in the aggressor line. A plurality of time delay modules is linked in the victim line. A total delay time of the ... | 01/07/2010 |
| 20090315633 | Design Structure, Structure and Method for Providing an On-Chip Variable Delay Transmission Line With Fixed Characteristic Impedance A design structure, structure, and method for providing an on-chip variable delay transmission line with a fixed characteristic impedance. A method of manufacturing a transmission line structure includes forming a signal line of the transmission line structure, forming ... | 12/24/2009 |
| 20090315635 | TRANSMISSION CIRCUIT A transmission circuit includes a plurality of transmission lines connected in a ring to propagate signals among a plurality of devices. The plurality of transmission lines have a predetermined same propagation delay, and a predetermined transmission line impedance, and... | 12/24/2009 |
| 20090315634 | EMULATION OF ANISOTROPIC MEDIA IN TRANSMISSION LINE In one exemplary embodiment, a transmission line geometry or structure may readily be realized as periodic printed coupled/uncoupled microstrip lines on dielectric and/or suitable biased ferromagnetic substrates. An example of a transmission line geometry or structure m... | 12/24/2009 |
| 20090267702 | PRINTED CIRCUIT BOARD FOR DECREASING WIRELESS WIDE AREA NETWORK NOISE A printed circuit board (PCB) capable of decreasing wireless wide area network (WWAN) noise generated due to internal signal interference occurring in the PCB is disclosed. The PCB printed circuit board includes a first layer, a second layer, and at least one insulating... | 10/29/2009 |
| 20090251232 | COPLANAR WAVEGUIDE STRUCTURES AND DESIGN STRUCTURES FOR RADIOFREQUENCY AND MICROWAVE INTEGRATED CIRCUITS Coplanar waveguide structures and design structures for radiofrequency and microwave integrated circuits. The coplanar waveguide structure includes a signal conductor and ground conductors generally coplanar with the signal conductor. The signal conductor is disposed be... | 10/08/2009 |
| 20090237172 | TRANSMISSION LINE SYSTEMS AND APPARATUSES Systems having three coupled transmission lines designed in such a way that any two of which taken together can be used as a differential transmission line with a roughly equal differential mode characteristic impedance while achieving high level of common mode characte... | 09/24/2009 |
| 20090189708 | COUPLING CANCELLATION SCHEME Methods and apparatus are disclosed, such as those involving an interconnection layout for an integrated circuit (IC). One such layout includes a plurality of differential pairs of lines. Each differential pair has two lines including one or more parallel portions exten... | 07/30/2009 |
| 20090066437 | High speed electrical interconnect and method of manufacture Fundamental interconnect systems for connecting high-speed electronics elements are provided. The interconnect systems consists of signal line, dielectric system with open trench or slot filled up with air or lower dielectric loss material, and the ground plane. The sig... | 03/12/2009 |
| 20080297271 | MULTI-PHASE LAYOUT STRUCTURE AND METHOD The present invention provides a multi-phase layout structure and method. The layout structure comprises: a first layout layer; a second layout layer substantially parallel to the first layout layer; a plurality of traces, each transmitting a signal, and the plurality o... | 12/04/2008 |
| 20080218285 | High-speed digital transmission signle line A high-speed digital transmission signal line providing better dynamic resistance to be applied in an LVDS transmission system and functioning as an electronic line, an optical line, and a serial advanced technology attachment (SATA) includes a conductive layer in thick... | 09/11/2008 |
| 20080116988 | Flexible interconnect cable for an electronic assembly A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed el... | 05/22/2008 |
| 20080061900 | Signal transmission circuit and method thereof A signal transmission circuit and method thereof are provided. The signal transmission circuit may include a plurality of signal transmission lines, each of the plurality of signal transmission lines configured to transfer data via signal currents and a reference transm... | 03/13/2008 |
| 20070285187 | SEMICONDUCTOR DEVICE INTERCONNECTING UNIT, SEMICONDUCTOR DEVICE AND HIGH-FREQUENCY MODULE A semiconductor device interconnecting unit configured to input/output a high-frequency signal having a millimeter wave band to/from a semiconductor device is provided. The semiconductor or device interconnecting unit includes a part of a band pass filter configured to ... | 12/13/2007 |
| 20070268087 | High speed, controlled impedance air dielectric electronic backplane systems A novel backplane interconnection system that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10 GHz and beyond. The invention provides high performan... | 11/22/2007 |
| 20070241836 | Efficient Wired Interface For Differential Signals A plurality of differential signal transmitters can transmit data signals differentially through a plurality of conductive signal lines. Ones of the signal lines can be shared between transmitters, and others of the signal lines need not be shared between transmitters. ... | 10/18/2007 |
| 20070236303 | Serpentine guard trace for reducing crosstalk of micro-strip line on printed circuit board A serpentine guard trace for reducing far-end crosstalk of a micro strip transmission line is provided. The serpentine guard trace reduces receiving-end crosstalk caused by an electromagnetic interference of a signal of a nearby transmission line when transmitting a hig... | 10/11/2007 |
| 20070152768 | Connector with reduced crosstalk In some embodiments, an circuit card includes an electronic circuit substrate, a ground plane on the electronic circuit substrate, first and second differential signal pads on the electronic circuit substrate, a ground return signal pad associated with the first and sec... | 07/05/2007 |
| 20070075800 | Device for indivisual control of multiple circuit-unit using single cable and method thereof Disclosed is a control device and method for individually controlling plural circuit-units connected along a single cable. The control device comprises a central unit, a cable emanatintg from the central unit, and plural circuit-units connected to the cable in parallel ... | 04/05/2007 |
| 20070046389 | Reduced cross-talk signaling circuit and method Signaling between two or more ICs use a signaling scheme wherein a reference signal is generated at the driver side and the receiver side. The driver side reference signal is coupled to the receiver side reference signal with a transmission line channel forming a refere... | 03/01/2007 |
| 20070040627 | Transmission line pair and transmission line group A transmission line pair has two transmission lines placed adjacent to each other in parallel to a signal transmission direction of the transmission lines as a whole. Each of the transmission lines includes a first signal conductor which is placed on one surface of a su... | 02/22/2007 |
| 20070040626 | Flexible interconnect cable with coplanar waveguide A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line ... | 02/22/2007 |
| 20070018748 | Low pass filter and electronic device The electronic device (100) of the invention comprises a semiconductor device (30) and a low-pass filter (20), which are present in a stacked configuration, and which together include a phase locked loop. The low-pass filter is preferably embodied b... | 01/25/2007 |
| 20060290438 | MICROSTRIP LINE DIELECTRIC OVERLAY A printed circuit board has a dielectric constant different from the dielectric constant of free space, with at least two microstrip lines routed adjacent to one another on a surface of the printed circuit board. A dielectric coating is applied to at least one of the at... | 12/28/2006 |
