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| Application No. | Application Title | Issue Date |
| 20100301884 | THIN-FILM PROBE SHEET AND METHOD OF MANUFACTURING THE SAME, PROBE CARD, AND SEMICONDUCTOR CHIP INSPECTION APPARATUS A semiconductor chip inspection apparatus largely reduces occurrence of damage due to foreign matter in an inspection process and improves durability at the same time of miniaturization is provided. As to a highly accurate thin-film probe sheet which performs: a contact... | 12/02/2010 |
| 20100295569 | RF PERFORMANCE TEST STRUCTURE WITH ELECTRONIC SWITCH FUNCTION An RF performance test structure is applied to test RF performance of an RF element via an RF measuring instrument. The RF performance test structure includes an antenna element, an RF test point and an electronic circuit switch chip. The RF test point connects to the R... | 11/25/2010 |
| 20100277197 | SYSTEM AND METHOD IMPLEMENTING SHORT-PULSE PROPAGATION TECHNIQUE ON PRODUCTION-LEVEL BOARDS WITH INCREMENTAL ACCURACY AND PRODUCTIVITY LEVELS A system and method for performing a test for characterizing high frequency operation of PCB boards. More particularly, a system and methodology is provided to implement a time-domain short pulse propagation (SPP) technique on the production line, on large, multi-layer,... | 11/04/2010 |
| 20100264947 | CLOSED-GRID BUS ARCHITECTURE FOR WAFER INTERCONNECT STRUCTURE An interconnect structure employs a closed-grid bus to link an integrated circuit tester channel to an array of input/output (I/O) pads on a semiconductor wafer so that the tester channel can concurrently communicate with all of the I/O pads. The interconnect structure ... | 10/21/2010 |
| 20100264946 | TEST AND MEASUREMENT INSTRUMENT AND METHOD OF CONFIGURING USING A SENSED IMPEDANCE A test and measurement instrument including a port including a plurality of connections; an impedance sense circuit configured to sense an impedance coupled to a connection of the plurality of connections; and a controller configured to setup the test and measurement in... | 10/21/2010 |
| 20100264948 | DIFFERENTIAL SIGNAL PROBING SYSTEM A probe measurement system comprises a probe with a linear array of probe tips enabling a single probe to be used when probing a test structure with a differential signal... | 10/21/2010 |
| 20100264949 | FLEXURE BAND AND USE THEREOF IN A PROBE CARD ASSEMBLY A flexure band can comprise structures configured to have elastic properties. Such a band can be stretched but will return generally to its original shape after forces that stretched the band are removed. The flexure band can hold one or more temperature control devices... | 10/21/2010 |
| 20100259288 | APPARATUS AND METHOD FOR TERMINATING PROBE APPARATUS OF SEMICONDUCTOR WAFER A probe apparatus and method of terminating a probe that probes a semiconductor device with a signal cable from a tester side by side at a proximal end of the probe and a distal end of the signal cable. In one embodiment, the probe apparatus includes: a chassis; a diele... | 10/14/2010 |
| 20100259287 | SEMICONDUCTOR TEST EQUIPMENT A test head (3) has test electrodes (5) for electrical connection between a test unit (4) and interface board terminals (6). The state of electrical connection of the test electrodes (5) to the interface board terminals (6) is a... | 10/14/2010 |
| 20100253374 | Method and apparatus for Terminating A Test Signal Applied To Multiple Semiconductor Loads Under Test Apparatus for terminating a test signal applied to multiple semiconductor loads under test is described—for example apparatus for interfacing a test signal between a tester and a semiconductor device under test (DUT). In some examples, a probe card assembly may includ... | 10/07/2010 |
| 20100253377 | ACTIVE WAFER PROBE A probe suitable for probing a semiconductor wafer that includes an active circuit. The probe may include a flexible interconnection between the active circuit and a support structure. The probe may impose a relatively low capacitance on the device under test.... | 10/07/2010 |
| 20100253379 | Method and Apparatus for Probing a Wafer A semiconductor wafer resting on a contact element has a spatially distributed force applied to its frontside and an equal and opposing force applied to its backside. The contact element comprises a solid immersion lens (SIL), and has an area less than the area of the w... | 10/07/2010 |
| 20100253375 | ANCHORING CARBON NANOTUBE COLUMNS A technique for anchoring carbon nanotube columns to a substrate can include use of a filler material placed onto the surface of the substrate into area between the columns and surrounding a base portion of each of the columns.... | 10/07/2010 |
| 20100253376 | LEAK DETECTOR COMPRISING A POSITION DETERMINING SYSTEM FOR THE HAND-OPERATED PROBE The leak detector comprises a basic unit that is connected to a probe by a hose. The probe tip is placed against test zones of the test object. In case that test gas escapes from the test object, this is detected by a test gas detector in the base unit. According to the... | 10/07/2010 |
| 20100244868 | Wireless Clamp-on Current Probe A Wireless Clamp-on Current Probe and an embedded system which includes a digital RF transceiver allows for remote test and measurement equipment to receive data from a current probe without regard to cabling issues such as size, physical wear, weight, cost, electrical ... | 09/30/2010 |
| 20100244869 | PROBE FOR ELECTRICAL INSPECTION, METHOD FOR FABRICATING THE SAME, AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE An aspect of the present disclosure, there is provided An electrical inspection probe, including, a leading end portion of the electrical inspection probe, the leading end portion contacting with a solder bump located outward the electrical inspection probe, a base mate... | 09/30/2010 |
| 20100244870 | DOPANT PROFILE MEASUREMENT MODULE, METHOD AND APPARATUS An apparatus comprises: a first signal source; a dopant profile measurement module (DPPM) configured to receive a portion of the signal from the signal source; a probe tip connected to the reflective coupler; a load connected in parallel with the probe tip; and a second... | 09/30/2010 |
| 20100244867 | Structures and Processes for Fabrication of Probe Card Assemblies with Multi-Layer Interconnect Based upon a layout of a semiconductor wafer comprising a plurality of integrated circuits at pre-defined locations, each integrated circuit comprising a set of electrical connection pads, a probe chip contactor is established, having a unit standard cell on the probe s... | 09/30/2010 |
| 20100244866 | SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD OF USE A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge t... | 09/30/2010 |
| 20100244871 | SPACE TRANSFORMER CONNECTOR PRINTED CIRCUIT BOARD ASSEMBLY Space transformer connectors for coupling printed circuit boards and/or other electrical connections are disclosed. A scalar design of a multilayer space transformer connector allows for a variety of pad-array field connections. A conductive elastomer interface provides... | 09/30/2010 |
| 20100237886 | PROBE CARD A probe card is provided. The probe card can serialize, analogise and divide a digital signal by a parallel-to-serial converter, a parallel-to-serial converter, and a power divided unit respectively. The probe card can increase signal channels, and is not restricted by ... | 09/23/2010 |
| 20100225342 | PROBE CARD AND MICROSTRUCTURE INSPECTING APPARATUS A probe card 4 connected with an evaluation unit for evaluating a characteristic of a microstructure formed on a wafer 8 by outputting a test sound wave to a movable section 16a of the microstructure, includes: a probe 4a, which... | 09/09/2010 |
| 20100225343 | Probe card, semiconductor testing device including the same, and fuse checking method for probe card A probe card according to an exemplary aspect of the present invention includes: a force terminal supplied with a first power supply voltage; a probe needle that supplies a voltage corresponding to the first power supply voltage to a semiconductor integrated circuit to ... | 09/09/2010 |
| 20100225344 | PROBING APPARATUS WITH GUARDED SIGNAL TRACES A probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on ... | 09/09/2010 |
| 20100219852 | PROBE CARD A probe card includes a probe head that holds a plurality of probes; a flat wiring board that has a wiring pattern corresponding to a circuit structure; an interposer that is stacked on the wiring board and relays wirings of the wiring board; a space transformer that is... | 09/02/2010 |
| 20100219853 | Method of Testing a Display Panel and Apparatus for Performing the Method In a test method of a display panel, a test signal and a test voltage are generated according to a test control signal. A display area of the display panel is tested based on the test signal and the test voltage. A driving voltage line and an on/off voltage line formed ... | 09/02/2010 |
| 20100213957 | APPARATUS FOR TESTING ELECTRONIC DEVICES An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows fo... | 08/26/2010 |
| 20100213956 | PROBE FOR CURRENT TEST, PROBE ASSEMBLY AND PRODUCTION METHOD THEREOF A probe for current test comprising: a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board; a solder layer formed on at least one side face of said connection portion; and a guide portion formed on the connection p... | 08/26/2010 |
| 20100207652 | METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME A method of testing a wafer capable of minimizing the asymmetrical thermal deformation of a probe card when a wafer is tested using a probe card and of minimizing the number of times of tests to effectively test a large area wafer and a probe card for the same is presen... | 08/19/2010 |
| 20100207651 | TEST ACCESS COMPONENT FOR AUTOMATIC TESTING OF CIRCUIT ASSEMBLIES A reliable and durable method of testing of printed circuit boards is presented. Test access components are placed in contact regions for providing electrical connectivity between test probes and the printed circuit board. In some cases, a test access component may be a... | 08/19/2010 |
| 20100207649 | IN SITU AND REAL TIME MONITORING OF INTERCONNECT RELIABILITY USING A PROGRAMMABLE DEVICE In one embodiment, the reliability of the L2 power and/or ground sub-arrays of contacts of a functional integrated circuit device is verified by applying a reference voltage to a selected contact in sub-array and sequentially measuring the voltage at other contacts in t... | 08/19/2010 |
| 20100207650 | TEST APPARATUS AND TEST METHOD Provided is a test apparatus for testing a device under test, comprising a multi-strobe generating section that generates, for each prescribed test cycle, a multi-strobe that includes a plurality of strobes arranged at prescribed time intervals; a data detecting section... | 08/19/2010 |
| 20100201387 | Safety-Enhanced Component and Circuit Tester Circuit testers used with digital logic and its associated components are described. The circuit testers better protect the user, better protect the equipment, and provide testers in a form that is easy and safe to use. The tester includes a body member with a hand guar... | 08/12/2010 |
| 20100201386 | PROBE BOARD, TEST FIXTURE, METHOD FOR MAKING A PROBE BOARD, AND METHOD FOR TESTING A PRINTED CIRCUIT BOARD (PCB) Probe board for testing a target Printed Circuit Board, PCB (4) preferably to be used in a test fixture (1), provided with probes for contacting target points on the target PCB (4), wherein the probe board comprises at least one probe board PCB (... | 08/12/2010 |
| 20100201388 | ELECTRICAL PROBE Methods, devices, and systems for probing electrical circuits without loading the circuits are described herein. One embodiment of an electrical probe includes a coaxial cable having an inner conductor and an outer conductor, an extension portion of the inner conductor ... | 08/12/2010 |
| 20100194415 | PROBE NEEDLE MATERIAL, PROBE NEEDLE AND PROBE CARD EACH USING THE SAME, AND INSPECTION PROCESS Disclosed is a probe needle material used for producing a probe needle which is used in contact with an inspection object to inspect electrical characteristics of the inspection object, comprising not less than 0.1% by volume but not more than 3.5% by volume of at least... | 08/05/2010 |
| 20100182030 | Knee Probe Having Reduced Thickness Section for Control of Scrub Motion An improved knee probe for probing electrical devices and circuits is provided. The improved knee probe has a reduced thickness section to alter the mechanical behavior of the probe when contact is made. The reduced thickness section of the probe makes it easier to defl... | 07/22/2010 |
| 20100182029 | ELECTRICAL TESTING DEVICE AND ELECTRICAL TESTING METHOD FOR ELECTRONIC DEVICE An electrical testing device has a first probe that electrically contacts with an inspection device, a second probe that is electrically connected to the first probe and electrically contacts with an external terminal of a test object, a cylinder that houses the first p... | 07/22/2010 |
| 20100182027 | TEST LEAD PROBE WITH RETRACTABLE INSULATIVE SLEEVE The present invention is directed to a test probe having an indexable probe tip. In one embodiment, an insulative sleeve extends from the test probe and surrounds a portion of the exposed probe tip. The insulative sleeve is moveable relative to the probe tip and may be ... | 07/22/2010 |
| 20100182031 | Layered Probes With Core The present invention is a probe for testing an electrical device under test comprising a core layer that is highly conductive.... | 07/22/2010 |
