Did You Know...
...that while attempting to develop a super strong glue, 3M employee Spencer Silver accidentally developed a glue that was so weak it would barely hold two pieces of paper together? However, his colleague Art Fry needed the glue. Fry sang with his church choir and marked the pages of his hymnal with small scraps of paper that often fell out. He used Silver's glue to hold the papers in place. Today we call this invention Post-it Notes.
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| Application No. | Application Title | Issue Date |
| 20120127254 | THERMAL PRINT HEAD AND METHOD OF MANUFACTURING THE SAME A thermal print head includes a substrate, a glaze layer formed on the substrate and provided with a heating resistor support portion extending in a primary scanning direction and having an arc-like cross-sectional shape when seen in a direction perpendicular to the pri... | 05/24/2012 |
| 20120127559 | HOLOGRAPHIC VISUALIZATION SYSTEM COMPRISING A HIGH DATA REFRESH RATE DND DRIVER ARRAY A DND chip is disclosed. In one aspect, the chip includes a 2D DND array of DND elements logically arranged in rows and columns, and a DND driver architecture for actuating the DND elements. The DND driver has a set of first drive lines along the rows and a set of secon... | 05/24/2012 |
| 20120126678 | Apparatus for Retaining an Object An apparatus including:
| 05/24/2012 |
| 20120103671 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortenin... | 05/03/2012 |
| 20120105942 | ELECTRONIC PAPER AND METHOD FOR PRODUCING SAME Electronic paper 100 according to the present invention includes a first substrate 10 with first electrodes 14, a second substrate 20 with second electrodes 24, and a powder sheet structure 50 arranged between the first substrat... | 05/03/2012 |
| 20120103666 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME An electronic device includes a first substrate on which a thin-film circuit layer is provided at a side of a first face, a second substrate on which a wiring layer is provided, and an isotropic conductive material which electrically connects a terminal portion of the t... | 05/03/2012 |
| 20120102730 | MIRROR ASSEMBLY WITH RECESSED MIRROR A mirror device and a method for manufacturing the mirror device are presented. The mirror device includes a mirror formed from a first substrate and a hinge/support structure formed from a second substrate. The hinge/support structure includes a recessed region and a t... | 05/03/2012 |
| 20120105081 | CAPACITIVE SENSOR, DEVICE AND METHOD Exemplary capacitive sensors may be capable of determining presence and location of a touch and capable of determining a fingerprint pattern.... | 05/03/2012 |
| 20120079716 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD Disclosed herein is a method of manufacturing a printed circuit board, including: providing a carrier including an insulation layer, first metal foils formed on both sides of the insulation layer, adhesive layers respectively formed on the first metal foils and made of ... | 04/05/2012 |
| 20120080220 | ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE An electronic device includes a circuit board including a first electrode and a second electrode; and an electronic component including a first terminal and a second terminal, wherein the first electrode includes a first pad portion to which the first terminal is connec... | 04/05/2012 |
| 20120069588 | Moving Light Table A moving light test system allows connecting moving lights to an interface board and conveying the lights and orienting and testing the lights while they are attached to the board. The lights can be mechanically and electrically connected to the board, and once connecte... | 03/22/2012 |
| 20120067637 | Interposer with microspring contacts and methods of making and using same An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below the interposer. The lateral offset between an anchor portion of a microspring disposed for contact at a bottom ... | 03/22/2012 |
| 20120072647 | Different types of memory integrated in one chip by using a novel protocol A semiconductor chip contains four different memory types, EEPROM, NAND Flash, NOR Flash and SRAM, and a plurality of major serial/parallel interfaces such as I2C, SPI, SDI and SQI in one memory chip. The memory chip features write-while-write and read-while-... | 03/22/2012 |
| 20120068960 | TOUCH SCREEN AND METHOD OF MANUFACTURING THE SAME Disclosed herein are a touch screen and a method of manufacturing the same. The touch screen includes: a transparent substrate; a transparent electrode formed on the transparent substrate and including a sensing part sensing a touch input and an extension part extending... | 03/22/2012 |
| 20120047726 | Wiring placement method of wirings having different length and semiconductor integrated circuit device A wiring placement method of placing a plurality of wirings of different lengths in parallel on a plane includes placing a longest wiring and a shortest wiring alongside each other among the plurality of wirings (a) placing a longest wiring from among remaining wires wh... | 03/01/2012 |
| 20120048948 | Method for Manufacturing a Card Based on a Substrate A method for manufacturing a card (102) based on a substrate (101), the method comprising a step of defining the perimeter of the card (102) within the substrate (101), the method also comprising a step of chamfering on a portion of the perim... | 03/01/2012 |
| 20120043129 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME In a circuit board, a laminate includes a plurality of laminated insulating material layers made of a flexible material. First external electrodes are provided on an upper surface of the laminate, and an electronic component is mounted thereon. Second external electrode... | 02/23/2012 |
| 20120044025 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an el... | 02/23/2012 |
| 20120046887 | TWO-PIN COUPLING SLIDER A slider has a first conductive trace and a second conductive trace. The first conductive trace has one or more sub-traces. The width of a first sub-trace of the first conductive trace is larger than the width of a second sub-trace of the first conductive trace adjacent... | 02/23/2012 |
| 20120042510 | METHOD OF FABRICATING A METALLIC MICROSTRUCTURE AND MICROSTRUCTURE OBTAINED IN ACCORDANCE WITH THIS METHOD The present invention concerns a method of fabricating a plurality of metallic microstructures, characterized in that it includes the steps consisting in:
| 02/23/2012 |
| 20120042511 | METHOD OF PRODUCING CIRCUIT BOARD Provided is a method of producing a circuit board that can stably provide normal circuit boards by preventing the solder detachment and the generation of needle-like crystals during the formation of solder bumps. The method of producing a circuit board includes steps of... | 02/23/2012 |
| 20120043126 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protec... | 02/23/2012 |
| 20120042509 | METHOD FOR MANUFACTURING PROBE CARD A method for manufacturing a probe card includes inserting an attaching portion of each probe into one of first through holes provided on a probe substrate at least in a row, inserting a probe tip portion of each probe into second through holes respectively provided on ... | 02/23/2012 |
| 20120037405 | FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provid... | 02/16/2012 |
| 20120038384 | PROBE BOARD AND METHOD OF MANUFACTURING THE SAME There are provided a probe board and a method of manufacturing the same. The probe board includes a ceramic substrate having an uneven portion in one surface thereof, one or more electrode pads placed on the uneven portion, and a buffer portion placed along an outer cir... | 02/16/2012 |
| 20120039056 | Component arrangement and method for production thereof The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second co... | 02/16/2012 |
| 20120038969 | ELECTRONIC PAPER DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME There are provided an electronic paper display device and a method for manufacturing the same. The electronic paper display device includes a first substrate having a first electrode made of transparent material and formed thereon; a second substrate arranged opposite t... | 02/16/2012 |
| 20120039055 | DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD Provided is a device mounting structure that includes: a interposer substrate including a substrate and a plurality of through-hole interconnection; a first device including a plurality of electrodes arranged so as to face the first principal surface of the substrate; a... | 02/16/2012 |
| 20120030939 | Wired circuit board and producing method thereof A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a term... | 02/09/2012 |
| 20120030938 | Method of manufacturing printed circuit board A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of th... | 02/09/2012 |
| 20120031655 | Multi-Layer Circuit Assembly And Process For Preparing The Same A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centime... | 02/09/2012 |
| 20120032916 | CAPACITIVE TOUCH MEMBER, MANUFACTURING METHOD THEREFOR, AND CAPACITIVE TOUCH DETECTION APPARATUS [Object] To provide a capacitive touch member having a flexible shape or a stereoscopic shape and includes a light transmissive detection electrode, a manufacturing method therefor, and a capacitive touch detection apparatus including the capacitive touch member. 02/09/2012 | |
| 20120033395 | PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD FOR MANUFACTURING THE SAME A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A ... | 02/09/2012 |
| 20120025787 | APPARATUS AND ASSOCIATED METHODS An apparatus comprises a rigid-flex circuit board and an electrolyte, the rigid-flex circuit board comprising first and second rigid regions physically and electrically connected to one another by a flexible region, the flexible region comprising first and second sectio... | 02/02/2012 |
| 20120026448 | DISPLAY PANEL, DISPLAY APPARATUS HAVING THE SAME, AND METHOD THEREOF A display panel includes a source-pad portion, a first source fan-out portion and source lines. The source-pad portion has a group of pads to which a driving signal is applied from an external source. The source fan-out portion has output lines that are extended from th... | 02/02/2012 |
| 20120026573 | ELECTROCHROMIC WINDOW FABRICATION METHODS Methods of manufacturing electrochromic windows are described. An electrochromic device is fabricated to substantially cover a glass sheet, for example float glass, and a cutting pattern is defined based on one or more low-defectivity areas in the device from which one ... | 02/02/2012 |
| 20120026692 | ELECTRONICS SUBSTRATE WITH ENHANCED DIRECT BONDED METAL A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enh... | 02/02/2012 |
| 20120024593 | PRINTED CIRCUIT BOARD UNIT, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD UNIT, AND ELECTRIC APPARATUS A printed circuit board unit includes a first substrate, a second substrate, and a spacer. The second substrate is coupled to the first substrate via a solder material. The second substrate has different coefficient of thermal expansion from the first substrate. The spa... | 02/02/2012 |
| 20120020039 | SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at l... | 01/26/2012 |
| 20120018198 | ELECTRONIC COMPONENT AND PRINTED WIRING BOARD An electronic component including a substrate having a surface and one or more trench portions opening on the surface, a capacitor portion having a lower electrode formed on the surface of the substrate and on the wall surface of the trench portion, a dielectric layer f... | 01/26/2012 |
