Famous Patents
The first commercial microwave oven was nearly 6 feet tall and weighed in at 750 pounds.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20110285004 | DEVICES INCLUDING, METHODS USING, AND COMPOSITIONS OF REFLOWABLE GETTERS Methods for protecting circuit device materials, optoelectronic devices, and caps using a reflowable getter are described. The methods, devices and caps provide advantages because they enable modification of the shape and activity of the getter after sealing of the devi... | 11/24/2011 |
| 20110156190 | ELECTRONIC COMPONENT An electronic component includes a base member comprising a main surface, a cap member on the base member, a first concave portion between the main surface and the cap member, a second concave portion on the main surface, an element on the main surface and above the sec... | 06/30/2011 |
| 20100013071 | ORGANIC LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF The present invention relates to an organic light emitting device and a manufacturing method thereof. A manufacturing method of an organic light emitting device according to an exemplary embodiment of the present invention includes forming a thin film structure on a fir... | 01/21/2010 |
| 20090079054 | Semiconductor device, structure of mounting the same, and method of removing foreign matter from the same A semiconductor device includes a package defining an enclosed inner space, a semiconductor chip having a movable portion on one side and housed in the closed inner space of the package, and a catching member located in the closed inner space of the package to catch and... | 03/26/2009 |
| 20090026598 | Wafer Level Packaging Integrated Hydrogen Getter A wafer-level package that employs one or more integrated hydrogen getters within the wafer-level package on a substrate wafer or a cover wafer. The hydrogen getters are provided between and among the integrated circuits on the substrate wafer or the cover wafer, and ar... | 01/29/2009 |
| 20090001537 | Gettering material for encapsulated microdevices and method of manufacture A method for providing improved gettering in a vacuum encapsulated microdevice is described. The method includes designing a getter alloy to more closely approximate the coefficient of thermal expansion of a substrate upon which the getter alloy is deposited. Such a get... | 01/01/2009 |
| 20080283989 | Wafer level package and wafer level packaging method Provided are a wafer level package and a wafer level packaging method, which are capable of performing an attaching process at a low temperature and preventing contamination of internal devices. In the wafer level package, a device substrate includes a device region, wh... | 11/20/2008 |
| 20080128878 | Method and Apparatus for Carbon Dioxide Gettering for a Chip Module Assembly A chip module assembly includes a CO2 getter exposed through a gas-permeable membrane to a chip cavity of a chip module. One or more chips is/are enclosed within the cavity. The CO2 getter comprises a liquid composition including 1,8-diaza-bicyclo-... | 06/05/2008 |
| 20070158784 | Semiconductor Device and Manufacturing Method Thereof In manufacturing a semiconductor device, the first gettering layer is formed on the backside of a wafer, and the second gettering layers are then formed on the backside and side surfaces of a chip, allowing these gettering layers to serve as trapping sites against metal... | 07/12/2007 |
| 20070138636 | METHOD OF FORMING A SEMICONDUCTOR STRUCTURE HAVING METAL MIGRATION SEMICONDUCTOR BARRIER LAYERS A semiconductor structure includes a semiconductor substrate, a semiconductor active region, a semiconductor contact layer, at least one metal migration semiconductor barrier layer, and a metal contact. The metal migration semiconductor barrier layer may be embedded wit... | 06/21/2007 |
| 20070080335 | Gettering using voids formed by surface transformation One aspect of this disclosure relates to a semiconductor structure, comprising a gettering region proximate to a device region in a semiconductor wafer. The gettering region includes a precisely-determined arrangement of a plurality of precisely-formed voids through a s... | 04/12/2007 |
| 20060157786 | Semiconductor device and manufacturing method thereof A semiconductor device of the present invention includes: an SOI substrate that is a semiconductor wafer on which a semiconductor active layer is formed via a laminated insulating film; an insulating film which is arranged in a device isolation region surrounding an ele... | 07/20/2006 |
| 20060138642 | Micromechanical getter anchor One embodiment provides an anchor to hold getter materials in place within a micromechanical device package substrate, said anchor comprising: a first cavity face; and a second cavity face. The cavity faces define an anchor cavity and mechanically retain a getter away f... | 06/29/2006 |
