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| Application No. | Application Title | Issue Date |
| 20130113090 | POWER MODULE, ELECTRICAL POWER CONVERTER, AND ELECTRIC VEHICLE In order to prevent an increase in temperature of a discharge resistance discharging an electric charge accumulated in a smoothing capacitor, the present description discloses a power module. The power module has a first lead frame, a second lead frame, first and second... | 05/09/2013 |
| 20130105954 | SEMICONDUCTOR PACKAGE Disclosed herein is a semiconductor package, including: a substrate having a first surface and a second surface; at least one semiconductor device formed on the first surface of the substrate; first lead frames respectively formed at both sides of the first surface of t... | 05/02/2013 |
| 20130087899 | DIODE CELL MODULES Diode cell modules for use within photovoltaic systems, including lead frames including first leads extending from the first outlet terminal, second leads spaced from the first leads, second outlet terminals extending from the second leads, and diodes. In some examples,... | 04/11/2013 |
| 20130062745 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MOUNTING STRUCTURE AND POWER SEMICONDUCTOR DEVICE A semiconductor device includes a plurality of die pad sections, a plurality of semiconductor chips, each of which is arranged in each of the die pad sections, a resin encapsulation portion having a recess portion for exposing at least a portion of the die pad sections,... | 03/14/2013 |
| 20130056862 | Semiconductor Device and Method of Forming a Low Profile Dual-Purpose Shield and Heat-Dissipation Structure A semiconductor device has a substrate including a recess and a peripheral portion with through conductive vias. A first semiconductor die is mounted over the substrate and within the recess. A planar heat spreader is mounted over the substrate and over the first semico... | 03/07/2013 |
| 20130045572 | FLEXIBLE ROUTING FOR HIGH CURRENT MODULE APPLICATION In one aspect of the invention, an integrated circuit package is described. The integrated circuit package includes a substrate formed from a dielectric material that includes multiple electrical contacts and conductive paths. An upper lead frame is attached with and un... | 02/21/2013 |
| 20130026616 | POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF The present invention relates to a power device package module and a manufacturing method thereof. In one aspect of the present invention, a power device package module includes: a control unit a first lead frame, a control chip and a first coupling portion that are mou... | 01/31/2013 |
| 20130015565 | SUBSTRATE STRUCTURE, SEMICONDUCTOR DEVICE ARRAY AND SEMICONDUCTOR DEVICE HAVING THE SAME A substrate structure has a first surface and a second surface. A plurality of carrying members are formed on the first surface and a plurality of conductive traces are formed on the second surface. In addition, the substrate structure has a first, a second and a third ... | 01/17/2013 |
| 20130001759 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE Disclosed herein is a semiconductor package including: first power device; second power device formed in an upper portion of the first power device; a first lead frame formed in a lower portion of the first power device; a second lead frame formed in the upper portion o... | 01/03/2013 |
| 20130001758 | Power Semiconductor Package The present invention provides a power semiconductor package. The power semiconductor package comprises a dual lead frame assembly comprising a bottom lead frame having a first heat sink pad at its bottom surface and a top lead frame having a second heat sink pad at its... | 01/03/2013 |
| 20120313229 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF The invention discloses a package structure for better heat-dissipation or EMI performance. A first conductive element and a second conductive element are both disposed between the top lead frame and the bottom lead frame. The first terminal of the first conductive elem... | 12/13/2012 |
| 20120306064 | CHIP PACKAGE A chip package including a lead frame, a heat sink, a chip and a molding compound is provided. The lead frame includes a chip pad and a plurality of leads, wherein the chip pad has a first surface and a second surface opposite thereto. The heat sink has a third surface ... | 12/06/2012 |
| 20120280376 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead condu... | 11/08/2012 |
| 20120280375 | SEMICONDUCTOR PACKAGE AND RADIATION LEAD FRAME In a package wherein a lead part coupled to a semiconductor element by wire bonding, an element retention member to retain the semiconductor element on the top face side and radiate heat on the bottom face side, and an insulative partition part to partition the lead par... | 11/08/2012 |
| 20120243281 | POWER SEMICONDUCTOR DEVICE According to one embodiment, a power semiconductor device includes a first conductor, a second conductor, and a first semiconductor chip. The first conductor includes a first portion and a second portion. The first portion includes a first major surface and a second maj... | 09/27/2012 |
| 20120181677 | SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain em... | 07/19/2012 |
| 20120181676 | POWER SEMICONDUCTOR DEVICE PACKAGING Embodiments of the present invention relate to the use of stamping to form features on a lead frame of a semiconductor device package. In one embodiment, portions of the lead frame such as pins are moved out of the horizontal plane of a diepad by stamping. In certain em... | 07/19/2012 |
| 20120168919 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME A semiconductor package and a method of manufacturing the same, and more particularly, to a package of a power module semiconductor and a method of manufacturing the same. The semiconductor package includes a substrate including a plurality of conductive patterns spaced... | 07/05/2012 |
| 20120161302 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME A semiconductor device according to the present disclosure includes: a plate (13) having a through hole (15); a metal column (16) fixed to the through hole with an insulating member (17) interposed therebetween, and having a projection projec... | 06/28/2012 |
| 20120119341 | Semiconductor packages with reduced solder voiding An example semiconductor package with reduced solder voiding is described, which has a leadframe having an I/O pad and a thermal pad, a fabricated semiconductor die having a bond pad, where the fabricated semiconductor die is attached to a top surface of the thermal pad... | 05/17/2012 |
| 20120112332 | RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME A resin-sealed semiconductor device includes a power element (1), a control element (4), a first lead frame (3) having a first die pad (3A) which holds the power element (1), a second lead frame (5) having a second die pad (5... | 05/10/2012 |
| 20120104582 | High Power Ceramic on Copper Package According to an embodiment of a high power package, the package includes a heat sink containing enough copper to have a thermal conductivity of at least 350 W/mK, an electrically insulating attached to the heat sink with an epoxy and a semiconductor chip attached to the... | 05/03/2012 |
| 20120098115 | Semiconductor device and method of manufacturing the same A semiconductor device has a substrate, a semiconductor chip mounted on the substrate, an encapsulating body encapsulating the semiconductor chip on the substrate, and a plurality of heat sink plates embedded in the encapsulating body so as to have a surface that is exp... | 04/26/2012 |
| 20120094438 | APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS A frame includes heat slug pads coupled together in a N×M matrix such that singulation of the heat slug pads consists of one or more parallel passes across the frame. Each heat slug pad has a top exposed surface and a bottom interfacing surface. The bottom interfacing ... | 04/19/2012 |
| 20120061811 | APPARATUS AND METHOD CONFIGURED TO LOWER THERMAL STRESSES An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a heat sink plate and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure is ar... | 03/15/2012 |
| 20120025359 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME A conventional semiconductor device has a problem that a frame constituting a heat sink is expensive and the heat sink is highly likely to come off a resin package. A semiconductor device of the present invention reduces the frame price because a heat sink is formed by ... | 02/02/2012 |
| 20120025358 | SEMICONDUCTOR ELEMENT WITH SEMICONDUCTOR DIE AND LEAD FRAMES A semiconductor element to be mounted on a circuit carrier includes a semiconductor die and at least one lead frame. In order to reduce the size required for mounting a semiconductor die on a circuit carrier, a semiconductor element includes a semiconductor die and at l... | 02/02/2012 |
| 20120018873 | METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING A method and a package for circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the c... | 01/26/2012 |
| 20120001309 | SEMICONDUCTOR APPARATUS A semiconductor apparatus according to aspects of the invention can include a metal base; resin case having a bonding plane facing metal base; a coating groove formed in bonding plane and holding adhesive for bonding resin case to metal base at a predetermined position,... | 01/05/2012 |
| 20110316131 | SEMICONDUCTOR DEVICE WITH HEAT SPREADER A BGA type semiconductor device includes: a substrate having wirings and electrodes; a semiconductor element disposed on the substrate, having a rectangular plan shape, and a plurality of electrodes disposed along each side of the semiconductor element; a plurality of w... | 12/29/2011 |
| 20110304032 | NO LEAD PACKAGE WITH HEAT SPREADER A no-lead electronic package including a heat spreader and method of manufacturing the same. This method includes the steps of selecting a matrix or mapped no-lead lead frame with die receiving area and leads for interconnect; positioning an integrated circuit device wi... | 12/15/2011 |
| 20110298113 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming a lead frame having contact pads and connection leads; coupling a base integrated circuit to the contact pads; coupling a chip interconnect between the base integrated circuit, the conne... | 12/08/2011 |
| 20110298112 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE A semiconductor module includes a semiconductor chip, a semiconductor frame, a circuit board, and a screw. The semiconductor frame has a main surface having a concave portion in which the semiconductor chip is mounted. The semiconductor frame is thermally and electrical... | 12/08/2011 |
| 20110278706 | Power Electronic Device Package A power electronic device package comprising a base member, a device layer, multiple leads, and an encapsulant is provided. The base member is thermally conductive for heat dissipation. The device layer comprises one or more power electronic devices mounted on the base ... | 11/17/2011 |
| 20110227206 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base device over the base substrate; attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate; applying a base enc... | 09/22/2011 |
| 20110169150 | Semiconductor Package with Single Sided Substrate Design and Manufacturing Methods Thereof A semiconductor package includes a substrate unit, a die electrically connected to first contact pads, and a package body covering a first patterned conductive layer and the die. The substrate unit includes: (1) the first patterned conductive layer; (2) a first dielectr... | 07/14/2011 |
| 20110163428 | SEMICONDUCTOR PACKAGES WITH EMBEDDED HEAT SINK Semiconductor packages and methods for making and using the same are described. The semiconductor packages contain a leadframe having an array of holes with a layout corresponding to the land pad array of the package, wherein the holes contain a thermally-conductive die... | 07/07/2011 |
| 20110156226 | INTERPOSER AND SEMICONDUCTOR DEVICE An interposer and a semiconductor device including the interposer are provided, which can prevent thermal warpage of an insulative substrate thereof. The interposer is provided with a semiconductor chip in a semiconductor device andmay be disposed between the semiconduc... | 06/30/2011 |
| 20110133320 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME A semiconductor package includes a metal plate, a power element, a lead frame having a die pad, a resin sheet having insulation properties, a control circuit that controls the power element, and a mold resin. The power element is mounted on the die pad, and the die pad ... | 06/09/2011 |
| 20110127658 | Muti Thickness Lead Frame A lead frame includes a lead frame 11 made by a rolled single-layer of copper and has a lead portion and a chip support portion. The thickness of the lead portion is the same as that of the chip support portion. A heat dispensing plate made of Aluminum is connect... | 06/02/2011 |
