Bizarre Patents
An electrified table cloth for preventing crawling insects from gaining access to the consumer's food or drink.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20120126347 | PACKAGES AND METHODS FOR PACKAGING Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted t... | 05/24/2012 |
| 20120126391 | Methods for Embedding Conducting Material and Devices Resulting from Said Methods Disclosed are methods for forming semiconductor devices and the semiconductor devices thus obtained. In one embodiment, the method may include providing a semiconductor wafer comprising a surface, forming on the surface at least one device, forming a release layer at le... | 05/24/2012 |
| 20120104592 | SEMICONDUCTOR MODULE HAVING A SEMICONDUCTOR CHIP STACK AND METHOD A semiconductor module having a semiconductor chip stack and a method for producing the same is disclosed. In one embodiment, a thermally conductive layer with anisotropically thermally conductive particles is arranged between the semiconductor chips. The anisotropicall... | 05/03/2012 |
| 20120003791 | Method for Packaging Electronic Devices and Integrated Circuits The present invention relates to the field of electronic devices and their associated driver and/or controller integrated circuits and in particular to the mechanical packaging of electronic devices and to the packaging of electronic devices and their associated driver ... | 01/05/2012 |
| 20120001275 | SEMICONDUCTOR DEVICE A semiconductor device in which intrusion of the cutting water and cutting wastes in the singulation process can be prevented, and reliability is improved includes: a substrate; at least one semiconductor element having a piezoelectric conversion function and mounted on... | 01/05/2012 |
| 20110309486 | Method of Etching and Singulating a Cap Wafer A method of forming a capped die forms a cap wafer having a top side and a bottom side. The bottom side is formed with 1) a plurality of device cavities having a first depth, and 2) a plurality of second cavities that each have a greater depth than the first depth. At l... | 12/22/2011 |
| 20110298063 | Micromechanical Component A method is described for manufacturing a micromechanical component. The method includes providing a first substrate, forming a first connecting structure on the first substrate, and forming a microstructure on the first substrate after forming the first connecting stru... | 12/08/2011 |
| 20110287587 | METHOD FOR FABRICATING HEAT DISSIPATION PACKAGE STRUCTURE A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation se... | 11/24/2011 |
| 20110280266 | SEMICONDUCTOR LASER APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS This semiconductor laser apparatus includes a semiconductor laser chip and a package sealing the semiconductor laser chip. The package has a base portion mounted with the semiconductor laser chip, a sealing member and a window member. The semiconductor laser chip is sea... | 11/17/2011 |
| 20110266641 | SILICON CONDENSER MICROPHONE HAVING AN ADDITIONAL BACK CHAMBER AND A FABRICATION METHOD THEREFOR A fabrication method of a silicon condenser microphone having an additional back chamber. The method includes applying an adhesive on a substrate and mounting a chamber container thereon by using a mounter; curing the adhesive holding the chamber container; applying an ... | 11/03/2011 |
| 20110234472 | Integrated Circuit Package Assembly Including Wave Guide Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured... | 09/29/2011 |
| 20110233765 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME A semiconductor device includes a first bump that is located over a surface of a semiconductor element, and is formed on a first bump formation face distanced from a back surface of the semiconductor element at a first distance, and a second bump that is located over th... | 09/29/2011 |
| 20110221069 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME A semiconductor device includes a semiconductor element having a first surface on which an electrode terminal is formed, and a second surface located opposite to the first surface. The semiconductor device further includes a first insulating layer in which the semicondu... | 09/15/2011 |
| 20110198743 | Method of Manufacturing a Semiconductor Device with a Carrier Having a Cavity and Semiconductor Device A method includes providing a carrier having a first cavity, providing a dielectric foil with a metal layer attached to the dielectric foil, placing a first semiconductor chip in the first cavity of the carrier, and applying the dielectric foil to the carrier.... | 08/18/2011 |
| 20110201155 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE To provide a technology capable of preventing the deterioration of the reliability of semiconductor devices caused by the gasification of a part of components of the material constituting a wiring substrate. A wiring layer constituting a ci... | 08/18/2011 |
| 20110193192 | Stacked-Die Electronics Package with Planar and Three-Dimensional Inductor Elements An apparatus and a method for producing three-dimensional integrated circuit packages. In one embodiment, an electronics package with at least two dice are stacked one atop another is disclosed. A top die is of smaller size compared with a bottom die such that after a d... | 08/11/2011 |
| 20110180917 | MICROELECTRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METHOD FOR FORMING THE SAME A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate (22) is provided. The semiconductor substrate (22) has first and second opposing sides (24, 26) and first and second portions (... | 07/28/2011 |
| 20110171784 | SUBASSEMBLY THAT INCLUDES A POWER SEMICONDUCTOR DIE AND A HEAT SINK HAVING AN EXPOSED SURFACE PORTION THEREOF The semiconductor assembly includes a first subassembly having a heat sink. Solder material is disposed on the exposed portion of a first surface of heat sink. A power semiconductor die is located on the first surface of the heat sink and is thermally coupled thereto by... | 07/14/2011 |
| 20110147779 | LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME A light emitting diode (LED) package and a method of manufacturing a LED package is provided. The LED package includes a case having first and second lead frames disposed through the case; an LED chip disposed on the case, the LED chip having first and second electrodes... | 06/23/2011 |
| 20110133337 | AREA REDUCTION FOR SURFACE MOUNT PACKAGE CHIPS Using side-wall conductor leads deposited on the side-walls of a base substrate to form package level conductor leads for active circuits manufactured on silicon substrate(s) stacked on the base substrate, the preferred embodiments of the present invention significantly... | 06/09/2011 |
| 20110129966 | SEMICONDUCTOR DEVICE HAS ENCAPSULANT WITH CHAMFER SUCH THAT PORTION OF SUBSTRATE AND CHAMFER ARE EXPOSED FROM ENCAPSULANT AND REMAINING PORTION OF SURFACE OF SUBSTRATE IS COVERED BY ENCAPSULANT A semiconductor device and a fabrication method thereof are provided. An opening having at least one slanted side is formed on a substrate. At least one chip and at least one passive component are mounted on the substrate. An encapsulant having a cutaway corner is forme... | 06/02/2011 |
| 20110124143 | PACKAGED DEVICE AND METHOD OF MANUFACTURING THE SAME A packaged device includes a package having an inner surface defining a closed internal space, a device chip fixed to the package in the internal space, and a parylene film covering at least a part of the inner surface of the package and/or at least a part of a surface ... | 05/26/2011 |
| 20110097854 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE Foreign matter formed over (or adhered to) a surface of a lead is reliably removed. A laser beam is applied to a residual resin (sealing body) which is formed in (or adhered to) a region surrounded by a sealing body (a first sealing body), a lead exposed (projected) fro... | 04/28/2011 |
| 20110092009 | PACKAGE, IN PARTICULAR FOR MEMS DEVICES AND METHOD OF MAKING SAME A package includes a substrate provided with a passing opening and a MEMS device. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated sensitive to the chemical/physical variations of a fluid. The active surface of the MEMS devic... | 04/21/2011 |
| 20110092024 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME A stacked semiconductor package includes a semiconductor chip module including at least two semiconductor chips, each semiconductor chip having a first face, a second face opposite to the first face, and a circuit part. A through portion passes through the first and sec... | 04/21/2011 |
| 20110090662 | METHOD AND APPARATUS FOR IMPROVING POWER NOISE OF BALL GRID ARRAY PACKAGE An apparatus and method of improving power noise of a Ball Grid Array (BGA) package are provided. The method includes securing a space for a passive element mounting pad, on which a passive element can be mounted, adjacent to a power pad on a Printed Circuit Board (PCB)... | 04/21/2011 |
| 20110057298 | Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging lead-count, wherein the method lends itself to better automation of the manufacturing line and improved quality and reliability of the packages produced therefrom... | 03/10/2011 |
| 20110057273 | System with Recessed Sensing or Processing Elements Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication w... | 03/10/2011 |
| 20110018076 | MEMS Component, Method for Producing a MEMS Component, and Method for Handling a MEMS Component A MEMS component includes a substrate in which at least one cavity is present. The cavity is closed off toward an active side of the substrate. An inactive side is arranged opposite the active side of the substrate, and the substrate is covered with a covering film on t... | 01/27/2011 |
| 20110012247 | SOCKET TYPE MEMS BONDING A method for fabricating an integrated circuit device is disclosed. The method includes providing a first substrate; bonding a second substrate to the first substrate, the second substrate including a microelectromechanical system (MEMS) device; and bonding a third subs... | 01/20/2011 |
| 20100236817 | PACKAGE SUBSTRATE WITH A CAVITY, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF A method of making a package substrate includes providing a cladding sheet comprising a first metal layer, a second metal layer and an intermediate layer between the first and second metal layers; etching away a portion of the first metal layer to expose a portion of th... | 09/23/2010 |
| 20100237462 | Package Level Tuning Techniques for Propagation Channels of High-Speed Signals Various semiconductor chip carrier substrate circuit tuning apparatus and methods are disclosed. In one aspect, a method of manufacturing is provided that includes assembling a semiconductor chip carrier substrate with a first input/output site adapted to electrically c... | 09/23/2010 |
| 20100193940 | Wafer level package and method of manufacturing the same The present invention relates to a wafer level package and a method of manufacturing the same. The wafer level package includes a first substrate including a first region and second regions with grooves around the first region; a semiconductor device positioned in the f... | 08/05/2010 |
| 20100164083 | PROTECTIVE THIN FILM COATING IN CHIP PACKAGING A protective thin film coating for device packaging. A dielectric thin film coating is formed over die and package substrate surfaces prior to applying a molding compound. The protective thin film coating may reduce moisture penetration from the bulk molding compound or... | 07/01/2010 |
| 20100032789 | PASSIVE TEMPERATURE COMPENSATION OF SILICON MEMS DEVICES The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element comprising a semiconducting material, and at least one trench formed in the resonator element and filled with a material comprising oxi... | 02/11/2010 |
| 20100029047 | METHOD OF FABRICATING PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR COMPONENTS EMBEDDED THEREIN A method for fabricating a printed circuit board having semiconductor components embedded therein is provided. A carrier board having at least a predetermined hole area is provided. A plurality of through holes are formed in the surround of the predetermined hole area o... | 02/04/2010 |
| 20100013087 | EMBEDDED DIE PACKAGE AND PROCESS FLOW USING A PRE-MOLDED CARRIER An embedded die package includes a carrier with an electrical device in the cavity of the carrier, a first dielectric layer covering the sides and top of the electrical device except for vias over selected bonding pads of the electrical device, a plurality of metal cond... | 01/21/2010 |
| 20100014269 | SEMICONDUCTOR MODULE AND METHOD A semiconductor module and a method. One embodiment provides a housing with a housing frame and a pluggable carrier which is plugged in the housing frame. The pluggable carrier is equipped with a lead which includes an internal portion which is arranged inside the housi... | 01/21/2010 |
| 20100003784 | METHOD FOR MOUNTING ELECTRONIC COMPONENT ON PRINTED CIRCUIT BOARD A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and... | 01/07/2010 |
| 20100001291 | ELECTRONIC DEVICE AND MANUFACTURING THEREOF An electronic device and manufacturing thereof. One embodiment provides a carrier and multiple contact elements. The carrier defines a first plane. A power semiconductor chip is attached to the carrier. A body is formed of an electrically insulating material covering th... | 01/07/2010 |
