Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
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| Application No. | Application Title | Issue Date |
| 20120129291 | METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT A method for producing a micromechanical component is described. The method includes providing a substrate having a layer system including an insulating material situated on the substrate, a conductive layer section and a protective layer structure connected to the cond... | 05/24/2012 |
| 20120038061 | SEMICONDUCTOR CHIP WITH OFFSET PADS A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip ... | 02/16/2012 |
| 20120032284 | FILM FOR RESIN SPACER, LIGHT-RECEIVING DEVICE AND METHOD FOR MANUFACTURING SAME, AND MEMS DEVICE AND METHOD FOR MANUFACTURING SAME According to one aspect of the present invention, a film for a resin spacer (10) comprises an adhesive layer (12) made of a resin composition and a cover film (14) covering a surface of the adhesive layer (12). In the above-described film for... | 02/09/2012 |
| 20120025355 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device re... | 02/02/2012 |
| 20120027544 | SYSTEM AND METHOD OF MONITORING AN ENVIRONMENTAL PARAMETER ALONG A PREDETERMINED ROUTE A monitoring system has a vehicle and a monitoring device. The vehicle is movable along a predetermined route, and the monitoring device is detachably mounted to the vehicle. The vehicle has a photonic device configured to read position information according to detectio... | 02/02/2012 |
| 20120009716 | PACKAGE PROCESS OF BACKSIDE ILLUMINATION IMAGE SENSOR In a package process of backside illumination image sensor, a wafer including a plurality of pads is provided. A first carrier is processed to form a plurality of blind vias therein. The first carrier is adhered to the wafer so that the blind vias face to the pads corre... | 01/12/2012 |
| 20110317371 | ELECTRONIC COMPONENT PACKAGE AND FABRICATION METHOD THEREOF An electronic component package is described. The electronic component package includes a first electronic component package module mounted on a surface of a packaging layer. A second electronic component package module laminated on a bottom of the first electronic comp... | 12/29/2011 |
| 20110318143 | VACUUM PROCESSING APPARATUS A vacuum processing apparatus includes a first lock chamber and a second lock chamber coupled to a back face side of the atmospheric transfer chamber in parallel, a first transfer chamber coupled to a rear side of the first lock chamber, a second transfer chamber couple... | 12/29/2011 |
| 20110306153 | METHOD OF MANUFACTURING MEMS DEVICE A method of manufacturing an MEMS device includes: forming a covering structure having an MEMS structure and a hollow portion, which is located on a periphery of the MEMS structure and is opened to an outside, on a substrate; and performing surface etching for the MEMS ... | 12/15/2011 |
| 20110291251 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTIPLE ROW LEADS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming a first lead adjacent and staggered to a second lead, the first lead having a first external connection portion with a first external conductive layer and a first internal connection por... | 12/01/2011 |
| 20110291276 | MAGNETICALLY SINTERED CONDUCTIVE VIA The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic components of the microelectronic packages may have sintered conductive vias comprising sintered metal and magnetic particles.... | 12/01/2011 |
| 20110287562 | METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD SUBSTRATE, METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD, AND METHOD OF MANUFACTURING LIQUID DISCHARGE HEAD ASSEMBLY A method of manufacturing a liquid discharge head substrate, includes forming an etching mask layer having an opening in a shape corresponding to a plurality of second portions on a second plane of the substrate, forming a recess to be a first portion by etching the sub... | 11/24/2011 |
| 20110278703 | Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die A semiconductor wafer has a plurality of semiconductor die separated by a saw street. The wafer is mounted to dicing tape. The wafer is singulated through the saw street to expose side surfaces of the semiconductor die. An ESD protection layer is formed over the semicon... | 11/17/2011 |
| 20110281389 | Micromachine and Method for Manufacturing the Same A structure which prevents thinning and disconnection of a wiring is provided, in a micromachine (MEMS structure body) formed with a surface micromachining technology. A wiring (upper auxiliary wiring) over a sacrificial layer is electrically connected to a different wi... | 11/17/2011 |
| 20110273857 | CONTACT SPRINGS FOR SILICON CHIP PACKAGES A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having a silicon chip and an array of contact pads provided by conductive material. A plurality of conductive springs are affixed to the array of contact ... | 11/10/2011 |
| 20110272788 | Computer system wafer integrating different dies in stacked master-slave structures A stacked 3D integrated circuit structure is manufactured with a common image design for dies which allows diced master dies to cut from the common wafer and diced slave dies cut to be cut from a wafer which has the common image design. In an embodiment is stacked to fo... | 11/10/2011 |
| 20110269269 | LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS The present inventions relate generally to methods for packaging integrated circuits using thin foils that form electrical interconnects for the package. The foil includes a base layer (such as copper) with an optional plating layer (such as silver) suitable for improvi... | 11/03/2011 |
| 20110260267 | MEMS DEVICES AND FABRICATION THEREOF A MEMS device and method, comprising: a substrate; a beam; and a cavity located therebetween; the beam comprising a first beam layer and a second beam layer, the first beam layer being directly adjacent to the cavity, the second beam layer being directly adjacent to the... | 10/27/2011 |
| 20110256729 | Showerhead for CVD Depositions A CVD showerhead that includes a circular inner showerhead and at least one outer ring showerhead. At least two process gas delivery tubes are coupled to each showerhead. Also, a dual showerhead that includes a circular inner showerhead and at least one outer ring showe... | 10/20/2011 |
| 20110248778 | DEVICES COMPRISING COLOSSAL MAGNETOCAPACITIVE MATERIALS AND RELATED METHODS Semiconductor devices include a transistor having a gate structure located close to a channel region that comprises a colossal magnetocapacitive material. The gate structure is configured to affect electrical current flow through the channel region between a source and ... | 10/13/2011 |
| 20110241138 | MAGNETORESISTIVE RANDOM ACCESS MEMORY ELEMENT AND FABRICATION METHOD THEREOF A magnetoresistive random access memory (MRAM) element includes a bottom electrode embedded in a first insulating layer; an annular reference layer in a first via hole of a second insulating layer on the first insulating layer, the annular reference layer being situated... | 10/06/2011 |
| 20110234550 | ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME An organic electroluminescent display device includes: first and second substrates facing and spaced apart from each other, the first and second substrates including at least one pixel region having first, second and third sub-pixel region; a gate line and a data line o... | 09/29/2011 |
| 20110233695 | Magnetoresistive Random Access Memory (MRAM) With Integrated Magnetic Film Enhanced Circuit Elements A Magnetoresistive Random Access Memory (MRAM) integrated circuit includes a substrate, a magnetic tunnel junction region, a magnetic circuit element, and an integrated magnetic material. The magnetic tunnel junction region is disposed on the substrate, and includes a f... | 09/29/2011 |
| 20110230001 | MULTIBIT ELECTRO-MECHANICAL MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME A multibit electro-mechanical memory device comprises a substrate, a bit line on the substrate, a first interlayer insulating film on the bit line, first and second lower word lines on the first interlayer insulating film, the first and second lower word lines separated... | 09/22/2011 |
| 20110227026 | NON-VOLATILE STORAGE WITH METAL OXIDE SWITCHING ELEMENT AND METHODS FOR FABRICATING THE SAME Non-volatile storage elements having a reversible resistivity-switching element and techniques for fabricating the same are disclosed herein. The reversible resistivity-switching element may be formed by depositing an oxygen diffusion resistant material (e.g., heavily d... | 09/22/2011 |
| 20110227061 | SEMICONDUCTOR OXIDE NANOFIBER-NANOROD HYBRID STRUCTURE AND ENVIRONMENTAL GAS SENSOR USING THE SAME Provided is an environmental gas sensor including an insulating substrate, a metal electrode formed above the insulating substrate, and a sensing layer formed of a semiconductor oxide nanofiber-nanorod hybrid structure above the metal electrode. The environmental gas se... | 09/22/2011 |
| 20110198713 | MICROMECHANICAL COMPONENT HAVING A REAR VOLUME In a method for manufacturing a micromechanical component, a cavity is produced in the substrate from an opening at the rear of a monocrystalline semiconductor substrate. The etching process used for this purpose and the monocrystalline semiconductor substrate used are ... | 08/18/2011 |
| 20110193044 | RESISTIVE MEMORY AND METHODS OF PROCESSING RESISTIVE MEMORY Resistive memory and methods of processing resistive memory are described herein. One or more method embodiments of processing resistive memory include conformally forming a cell material in an opening in an interlayer dielectric such that a seam is formed in the cell m... | 08/11/2011 |
| 20110194341 | SPIN-TORQUE BASED MEMORY DEVICE WITH READ AND WRITE CURRENT PATHS MODULATED WITH A NON-LINEAR SHUNT RESISTOR A spin-torque based memory device includes a write portion including a fixed ferromagnetic spin-polarizing layer, a spin-transport layer having a spin accumulation region formed above the fixed ferromagnetic spin-polarizing layer. The memory device further includes a re... | 08/11/2011 |
| 20110186943 | MEMS Package and Method for the Production Thereof A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier subst... | 08/04/2011 |
| 20110180808 | METHOD OF MAKING A MOUNTED GALLIUM NITRIDE DEVICE A method of making a mounted gallium nitride (GaN) device includes obtaining a device structure comprising a silicon layer, a silicon carbide (SiC) layer over the silicon layer, and a GaN layer over the SiC layer. The GaN layer is processed to form an active layer of ac... | 07/28/2011 |
| 20110169991 | IMAGE SENSOR WITH EPITAXIALLY SELF-ALIGNED PHOTO SENSORS An image sensor pixel includes a substrate doped to have a first conductivity type. A first epitaxial layer is disposed over the substrate and doped to also have the first conductivity type. A transfer transistor gate is formed on the first epitaxial layer. An epitaxial... | 07/14/2011 |
| 20110156178 | Micro-Electro-Mechanical System Having Movable Element Integrated into Leadframe-Based Package A MEMS may integrate movable MEMS parts, such as mechanical elements, flexible membranes, and sensors, with the low-cost device package, leaving the electronics and signal-processing parts in the integrated circuitry of the semiconductor chip. The package may be a leadf... | 06/30/2011 |
| 20110146911 | PLASMA PROCESSING SYSTEM WITH LOCALLY-EFFICIENT INDUCTIVE PLASMA COUPLING An inductively coupled plasma source is provided with a peripheral ionization source for producing a high-density plasma in a vacuum chamber for semiconductor wafer coating or etching. The source includes a segmented configuration having high and low radiation segments ... | 06/23/2011 |
| 20110147768 | ORGANIC LIGHT EMITTING DEVICE CONNECTION METHODS A light panel includes a light source having a generally planar, light emitting surface and a perimeter edge. A backsheet is disposed in substantially parallel relation with the light emitting surface, and an electrical feed-through region extends through the backsheet ... | 06/23/2011 |
| 20110151590 | APPARATUS AND METHOD FOR LOW-K DIELECTRIC REPAIR A method, a system and a computer readable medium for integrated in-vacuo repair of low-k dielectric thin films damaged by etch and/or strip processing. A repair chamber is integrated onto a same platform as a plasma etch and/or strip chamber to repair a low-k dielectri... | 06/23/2011 |
| 20110147803 | Gas Sensor And Flip-Chip Method For Its Manufacture A sensor element is described that includes at least one semiconductor component having a gas-sensitive layer which is attached to a substrate by the flip-chip method, the gas-sensitive layer facing the substrate and a supply arrangement being provided to supply a gas t... | 06/23/2011 |
| 20110143478 | MODULAR SYSTEM AND PROCESS FOR CONTINUOUS DEPOSITION OF A THIN FILM LAYER ON A SUBSTRATE A process and associated system for vapor deposition of a thin film layer on a photovoltaic (PV) module substrate is includes establishing a vacuum chamber and introducing the substrates individually into the vacuum chamber. The substrates are pre-heated as they are con... | 06/16/2011 |
| 20110129946 | High density spin-transfer torque MRAM process A STT-MRAM integration scheme is disclosed wherein the connection between a MTJ and CMOS metal is simplified by forming an intermediate via contact (VAC) on a CMOS landing pad, a metal (VAM) pad that contacts and covers the VAC, and a MTJ on the VAM. A dual damascene pr... | 06/02/2011 |
| 20110117514 | Silicon Firnaceware for Stressed Film A method of fabricating the semiconductor wafer processing fixtures for having longer longevity on high stressed film applications such as LPCVD-SiN, silicon carbide and other ceramics than that of non-processed parts. One aspect of the invention includes nitriding, oxi... | 05/19/2011 |
