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| Application No. | Application Title | Issue Date |
| 20130119564 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1):
| |
| 20130099396 | WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate re... | 04/25/2013 |
| 20130062790 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following components (A) to (E), in which the component (D) is contained in an amount of from 0.1 to 1.5% by weight of the whole of the epoxy resin composition: (A... | 03/14/2013 |
| 20130062748 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULANT AND SEMICONDUCTOR DEVICE USING THE SAME According to the present invention, an epoxy resin composition for semiconductor encapsulant including (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a compound in which a copolymer of a 1-alkene having 5 to 80 carbon atoms and maleic anhydride... | 03/14/2013 |
| 20120319306 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME Disclosed are an epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, (D) a hydrocarbon compound having structures of formula (1) and formula (2), and (E) a hydrocarbon compound havi... | 12/20/2012 |
| 20120273957 | CHIP-PACKAGING MODULE FOR A CHIP AND A METHOD FOR FORMING A CHIP-PACKAGING MODULE A chip-packaging module for a chip is provided, the chip-packaging module including an isolation material configured to cover a chip on at least one side, the isolation material having a first surface proximate to a first side of a chip, and said isolation material havi... | 11/01/2012 |
| 20120199992 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MOLD RELEASING AGENT Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an α... | 08/09/2012 |
| 20120181710 | Semiconductor Chip and Method for Fabricating the Same A semiconductor chip includes a first main face and a second main face opposed to the first main face. Side faces connect the first and second main faces. The side faces are at least partially covered with an anti-EBO compound and/or a surface energy reducing compound.... | 07/19/2012 |
| 20120168969 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH AN ENCAPSULANT PREPARED FROM THE COMPOSITION An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device, the composition including an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an additive, wherein the epoxy resin includes an epoxy resin represen... | 07/05/2012 |
| 20120161339 | FIBER-CONTAINING RESIN SUBSTRATE, SEALED SUBSTRATE HAVING SEMICONDUCTOR DEVICE MOUNTED THEREON, SEALED WAFER HAVING SEMICONDUCTOR DEVICE FORMED THEREON, A SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS A fiber-containing resin substrate for collectively sealing a semiconductor devices mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor devices forming surface of a wafer having semiconductor devices formed thereon, includ... | 06/28/2012 |
| 20120153513 | THERMOSETTING ENCAPSULATION ADHESIVE SHEET A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an ... | 06/21/2012 |
| 20120080810 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE The present invention provides a thin and bendable semiconductor device utilizing an advantage of a flexible substrate used in the semiconductor device, and a method of manufacturing the semiconductor device. The semiconductor device has at least one surface covered by ... | 04/05/2012 |
| 20120074599 | METHOD OF FORMING WAFER LEVEL MOLD USING GLASS FIBER AND WAFER STRUCTURE FORMED BY THE SAME According to example embodiments, a wafer level mold may be formed by a method including attaching a substrate to a lower side of a wafer on which a semiconductor chip is arranged, applying molding liquid to an upper and at least one lateral side of the semiconductor ch... | 03/29/2012 |
| 20120061861 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorga... | 03/15/2012 |
| 20120001350 | RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) include... | 01/05/2012 |
| 20110309531 | MOLDED BEAM FOR OPTOELECTRONIC SENSOR CHIP SUBSTRATE A substrate on which a plurality of epoxy over molded integrated circuit dies are formed includes a beam formed on the substrate for providing stiffness to the substrate. The beam includes structure having a cross-sectional shape, for example, substantially in the shape... | 12/22/2011 |
| 20110272829 | EPOXY RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ELEMENT ENCAPSULATION AND OPTICAL-SEMICONDUCTOR DEVICE USING THE SAME The present invention relates to an epoxy resin composition for optical-semiconductor element encapsulation, including the following ingredients (A), (B) and (C): (A) an epoxy resin; (B) a curing agent including a phenol resin (b1) represented by the following general f... | 11/10/2011 |
| 20110241228 | EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF An epoxy resin composition for a underfilling of a semiconductor comprising an epoxy resin, an acid anhydride, a curing accelerator and a flux agent as essential components, wherein the curing accelerator is a quaternary phosphonium salt, as well as a semiconductor devi... | 10/06/2011 |
| 20110241229 | ENCAPSULATED NANOPARTICLES In various embodiments, the present invention relates to production of encapsulated nanoparticles by dispersing said nanoparticles and an encapsulating medium in a common solvent to form a first solution system and applying a stimulus to said first solution system to in... | 10/06/2011 |
| 20110198762 | PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC A method of panelized packaging is described in which a plurality of die units are placed on a dielectric film. The dielectric film is then cured to lock the plurality of die units in place, which are then encapsulated. The cured dielectric film is then patterned utiliz... | 08/18/2011 |
| 20110163461 | ELECTRONIC PACKAGING Provided is an epoxy resin composition comprising: (A) an epoxy compound represented by the general formula (1): wherein R1 to R9 represent each independently a hydrogen atom, an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, a substitut... | 07/07/2011 |
| 20110147954 | SEMICONDUCTOR DEVICE, AND RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE A semiconductor device of the present invention (1) has a substrate (2); a semiconductor element (3) provided on at least one side of the substrate (2); a first resin (4) obtained by curing a first resin composition which fills a gap b... | 06/23/2011 |
| 20100308477 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE USING THE SAME The present invention relates to an epoxy resin composition for semiconductor encapsulation, which includes the following components (A) to (E): (A) a bifunctional epoxy resin, (B) a curing agent, (C) an imidazole compound represented by the formula (1), in which R... | 12/09/2010 |
| 20100308476 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE A semiconductor chip is temporarily fixed on a circuit board by having a thermosetting adhesive film in between. A sealing resin film is provided with a mold release film, and a thermosetting sealing resin layer, which is laminated on the mold release film and has a fil... | 12/09/2010 |
| 20100164127 | EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED PRODUCT THEREOF, AND PHOTOSEMICONDUCTOR DEVICE USING THE SAME The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid a... | 07/01/2010 |
| 20100148379 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE PRODUCED BY USING THE SAME An epoxy resin composition for semiconductor encapsulation, which comprises: (A) an epoxy resin having at least two epoxy groups in a molecule thereof; (B) a compound having at least two phenolic hydroxyl groups in a molecule thereof; and (C) particles of a compound rep... | 06/17/2010 |
| 20100148380 | THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE A thermosetting epoxy resin composition comprising (A) a reaction mixture of a triazine derivative epoxy resin and an acid anhydride at a ratio of the epoxy group equivalent to the acid anhydride equivalent of 0.6 to 2.0; (B) an internal mold release agent; (C) a reflec... | 06/17/2010 |
| 20090261484 | LIQUID RESIN COMPOSITION, SEMI-CONDUCTOR DEVICE, AND PROCESS OF FABRICATING THE SAME A liquid resin composition for use as a sealing resin which reduces wear on a dicing blade or grinder employed for signularization or grinding. The liquid resin composition includes hollow and/or porous particles as a filler, and is adapted in use to be applied on a sub... | 10/22/2009 |
| 20090230570 | RESIN COMPOSITION AND SEMICONDUCTOR DEVICE EMPOLYING THE SAME The present invention provides a resin composition for sealing a semiconductor device. The resin composition is in liquid state at room temperature, and can be supplied from a dispenser. The composition is advantageous in regard to molding time, viscosity, moldability a... | 09/17/2009 |
| 20090166897 | ENCAPSULATING RESIN COMPOSITION FOR PREAPPLICATION, SEMICONDUCTOR DEVICE MADE WITH THE SAME, AND PROCESS FOR PRODUCING THE SAME An encapsulation resin composition for preapplication, comprising (a) an epoxy resin, and (b) a curing agent having flux activity, wherein the tack after B-staging is at least 0 gf/5 mmφ and at most 5 gf/5 mmφ, and the melt viscosity at 130° C. is at least 0.01 Pa·s... | 07/02/2009 |
| 20090096114 | Epoxy Resin Composition and Semiconductor Device An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 ... | 04/16/2009 |
| 20080258318 | Semiconductor device Disclosed herewith is a semiconductor device capable of suppressing the peeling-off that might occur between an island and a resin layer due to a difference of the shrinkage between those items, thereby the reliability of the semiconductor device is improved. The semico... | 10/23/2008 |
| 20080255283 | THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE A thermosetting epoxy resin composition is provided comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst. In one embodiment, (B) a... | 10/16/2008 |
| 20080224334 | Molded Beam for Optoelectronic Sensor Chip Substrate A substrate on which a plurality of epoxy over molded integrated circuit dies are formed includes a beam formed on the substrate for providing stiffness to the substrate. The beam includes structure having a cross-sectional shape, for example, substantially in the shape... | 09/18/2008 |
| 20080136048 | Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device Using the Same An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The e... | 06/12/2008 |
| 20080128922 | Epoxy resin composition for encapsulating semiconductor and semiconductor device There is provided an epoxy resin composition for encapsulating a semiconductor comprising an epoxy resin (A), wherein the epoxy resin (A) including: a crystalline epoxy resin (a1) having a melting point of 50° C. to 150° C., an epoxy resin (a2) represent... | 06/05/2008 |
| 20080083995 | EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND THIN SEMICONDUCTOR DEVICE An epoxy resin composition for encapsulating a semiconductor device is provided. This composition contains the following components (A), (C), (D), (E), (F) and (G) as critical components:
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| 20080054441 | CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME A method for fabricating chip package includes providing a semiconductor chip with a bonding pad, comprising an adhesion/barrier layer, connected to a pad through an opening in a passivation layer, next adhering the semiconductor chip to a substrate using a glue materia... | 03/06/2008 |
| 20080012156 | ENCAPSULANT COMPOSITION AND ELECTRONIC PACKAGE UTILIZING SAME An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface... | 01/17/2008 |
| 20070264817 | Via Line Barrier and Etch Stop Structure A semiconductor device and a method for making the semiconductor device having a barrier layer in a via hole region and a barrier layer in a via line region. The barrier layer in the via line region is initially thicker than the barrier layer in the via hole region, pri... | 11/15/2007 |
