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| Application No. | Application Title | Issue Date |
| 20120126433 | METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES IN LOWER NODE DESIGNS A method for manufacturing an integrated circuit including producing layers that form one or more electrical and/or electronic elements on a semiconductor material substrate. Then, producing ILD layers above the layers forming one or more electrical and/or electronic el... | 05/24/2012 |
| 20120025404 | FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE The present invention relates to a film for flip chip type semiconductor back surface to be formed on the back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface having a tensile storage elastic ... | 02/02/2012 |
| 20120025398 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing an encapsulation system having a mold chase with a buffer layer attached thereto; forming a base integrated circuit package including: providing a base substrate, connecting an exposed... | 02/02/2012 |
| 20110304016 | WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE A wiring board includes a structure in which a plurality of wiring layers are stacked with insulating layers interposed therebetween, a plurality of pads for mounting an electronic component, the pads being formed on an outermost insulating layer on one surface side of ... | 12/15/2011 |
| 20110304062 | CHIP PACKAGE STRUCTURE, CHIP PACKAGE MOLD CHASE AND CHIP PACKAGE PROCESS A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gat... | 12/15/2011 |
| 20110285035 | SEALED CAVITY Embodiments disclosed herein generally include methods of sealing a cavity in a device structure. The cavity may be opened by etching away sacrificial material that may define the cavity volume. Material from below the cavity may be sputter etched and redeposited over a... | 11/24/2011 |
| 20110272798 | CHIP UNIT AND STACK PACKAGE HAVING THE SAME A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and secon... | 11/10/2011 |
| 20110248412 | CHIP IDENTIFICATION FOR ORGANIC LAMINATE PACKAGING AND METHODS OF MANUFACTURE A chip identification for organic laminate packaging and methods of manufacture is provided. The method includes forming a material on a wafer which comprises a plurality of chips. The method further includes modifying the material to provide a unique identification for... | 10/13/2011 |
| 20110241222 | Semiconductor Package and Manufacturing Method A polymer layer is generated on a wafer. The wafer is then separated into semiconductor chips. At least two semiconductor chips are placed on a carrier with the polymer layer facing the carrier. The at least two semiconductor chips are covered with an encapsulating mate... | 10/06/2011 |
| 20110241226 | METHOD FOR PRODUCING A MICROFLUID COMPONENT, AS WELL AS MICROFLUID COMPONENT A method for producing a microfluid component includes: Producing a single polymer layer made of at least one plastic or a plastic composite and having a microfluid structure, fitting the polymer layer with at least one semiconductor element, and/or with at least one el... | 10/06/2011 |
| 20110215484 | Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements... | 09/08/2011 |
| 20110210454 | Phase Separated Curable Compositions A curable composition, suitable for underfill encapsulant, has two distinct phase domains after cure, a continuous phase and a discontinuous phase, in which one phase has a modulus value of 2 GPa or greater, and the second phase has a modulus value at least 1 Gpa less t... | 09/01/2011 |
| 20110204528 | POSTIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, AND ELECTRONIC COMPONENT A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid... | 08/25/2011 |
| 20110186985 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged withi... | 08/04/2011 |
| 20110180943 | Thin Film Wafer Level Package Anchor designs for thin film packages are disclosed that, in a preferred embodiment are a combination of SiGe-filled trenches and Si-oxide-filled spacing. Depending on the release process, additional manufacturing process steps are performed in order to obtain a desired... | 07/28/2011 |
| 20110175242 | METHOD OF FORMING A SEMICONDUCTOR DIE In one embodiment, semiconductor die having non-rectangular shapes and die having various different shapes are formed and singulated from a semiconductor wafer.... | 07/21/2011 |
| 20110163445 | Electronic Packages With Fine Particle Wetting and Non-Wetting Zones Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made he... | 07/07/2011 |
| 20110147954 | SEMICONDUCTOR DEVICE, AND RESIN COMPOSITION USED FOR SEMICONDUCTOR DEVICE A semiconductor device of the present invention (1) has a substrate (2); a semiconductor element (3) provided on at least one side of the substrate (2); a first resin (4) obtained by curing a first resin composition which fills a gap b... | 06/23/2011 |
| 20110132449 | MULTILAYER FILM FOR ENCAPSULATING OXYGEN AND/OR MOISTURE SENSITIVE ELECTRONIC DEVICES The present invention refers to a multilayer barrier film capable of encapsulating a moisture and/or oxygen sensitive electronic or optoelectronic device, the barrier film comprises at least one nanostructured layer comprising reactive nanoparticles capable of interacti... | 06/09/2011 |
| 20110121439 | SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD OF PACKAGING A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a por... | 05/26/2011 |
| 20110121468 | SEMICONDUCTOR PACKAGE AND METHOD OF MAKING SAME An improved semiconductor package includes thermal tape placed over a top side of a die that is attached to a substrate with an underfill material. The tape extends to the substrate. The tape deforms with heat and entraps the die and underfill material. Air bubbles are ... | 05/26/2011 |
| 20110115067 | SEMICONDUCTOR CHIP PACKAGE WITH MOLD LOCKS A semiconductor chip package includes a base comprising a die attach region and a mold-lock forming region surrounding the die attach region; a die mounted onto the base within the die attach region; a plurality of line-shaped trenches in the mold-lock forming region; a... | 05/19/2011 |
| 20110115101 | ELECTRONIC CIRCUIT An electronic circuit includes at least two organic components interconnected by conductor tracks and having a common carrier substrate. The components and the conductor tracks are formed from layer portions. An uppermost layer portion, remote from the carrier substrate... | 05/19/2011 |
| 20110117232 | SEMICONDUCTOR CHIP PACKAGE WITH MOLD LOCKS A semiconductor chip package is provided. A semiconductor chip package includes a base comprising a top surface and a bottom surface, the top surface comprising a die attach region and a through-hole forming region surrounding the die attach region, a die attached on th... | 05/19/2011 |
| 20110109000 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME Provided are a semiconductor package and a method of forming the same. The semiconductor package includes a stress reliever disposed on a part (more specifically, a weak part) of a semiconductor chip. The stress reliever relieves thermal and/or physical stresses caused ... | 05/12/2011 |
| 20110101517 | MOLDED SEMICONDUCTOR PACKAGE HAVING A FILLER MATERIAL An integrated circuit is attached to a package substrate. The integrated circuit is electrically connected to the package substrate using a plurality of bond wires connected between a plurality of bond posts and a plurality of bond pads. A first plurality of the bond pa... | 05/05/2011 |
| 20110101505 | Semiconductor Die Separation Method According to the invention, die shift is reduced or substantially eliminated, by cutting the wafer in two stages. In some embodiments a first wafer cutting procedure is carried out prior to thinning the wafer to the prescribed die thickness; and in other embodiments the... | 05/05/2011 |
| 20110074037 | SEMICONDUCTOR DEVICE A device has a semiconductor chip, a wiring board, a support which supports the semiconductor chip on the wiring board and forms a gap between the semiconductor chip and the wiring board, and a sealing resin injected into the gap and covering the semiconductor chip.... | 03/31/2011 |
| 20110074048 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME A semiconductor device of the present invention includes: a base material (5); a semiconductor element (2) mounted on the base material (5); a solder resist (11a) covering a prescribed region of the base material (5); and a molding res... | 03/31/2011 |
| 20110068442 | RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME In a resin-sealed semiconductor device, an inner lead including a bend portion formed by lifting has a protruding shape located on one side and an inclined vertical surface shape located on the other side (inside) in an external connection terminal direction. A cutaway ... | 03/24/2011 |
| 20110062602 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; connecting a base component directly to the base substrate; mounting a stack component over the base component; attaching a flattened exposed interconnect directly on... | 03/17/2011 |
| 20110062603 | Encapsulation architectures for utilizing flexible barrier films An article and method of using spacer layer regions is provided, containing a gas compound, to reduce gas permeation through barrier films overlying a substrate comprising creating a spacer layer between one or more of the barrier films, wherein the spacer layer compris... | 03/17/2011 |
| 20110049730 | Device Comprising an Encapsulation Unit A device in accordance with one embodiment comprises a component (1) and an encapsulation arrangement (2) for the encapsulation of the component (1) with respect to moisture and/or oxygen, wherein the encapsulation arrangement (2) has a first... | 03/03/2011 |
| 20110049701 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME The semiconductor device includes a substrate; a semiconductor chip mounted over the substrate; resin encapsulating the semiconductor chip; and a heat dissipation material that is arranged over the semiconductor chip and in contact with the resin, wherein the resin incl... | 03/03/2011 |
| 20110036400 | BARRIER LAYER A method for manufacturing a photovoltaic module may include coating a portion of a substrate with a coating material; depositing a barrier material layer on a least a portion of an edge of the substrate; and curing the barrier material layer, where the barrier material... | 02/17/2011 |
| 20110031615 | Semiconductor device A semiconductor device having a structure that can reduce stress due to difference in coefficients of thermal expansion and prevent or suppress generation of cracks, and a semiconductor device manufacturing method, are provided. The semiconductor device includes a singl... | 02/10/2011 |
| 20110031614 | METHODS FOR FABRICATING SEMICONDUCTOR COMPONENTS AND PACKAGED SEMICONDUCTOR COMPONENTS Packaged semiconductor components and methods for manufacturing packaged semiconductor components. In one embodiment a semiconductor component comprises a die having a semiconductor substrate and an integrated circuit. The substrate has a first side, a second side, a si... | 02/10/2011 |
| 20110024923 | Wafer level hermetic bond using metal alloy with keeper layer Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate... | 02/03/2011 |
| 20110024922 | SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin se... | 02/03/2011 |
| 20110018007 | ELECTRONIC DEVICE, DISPLAY APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD Provided is a solution for narrowing of a light emitting region, increasing of leak current at an edge of a functional layer, peeling of the functional layer, or the like caused by non-uniform thickness of the functional layer at the edges thereof. Provided is an electr... | 01/27/2011 |
