Class 257/722 - With fins

Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the cooling means has fins, i.e.,
No. of applications: 36
Last issue date: 12/31/2009

Application No.	Application Title	Issue Date
20090321924	Power Semiconductor Module A power semiconductor module includes: a power semiconductor device; a first heat dissipation plate; a second heat dissipation plate; a first channel; a second channel; a first channel wall; a second channel wall; a first refrigerant outlet provided on the first channel...	12/31/2009
20090294956	Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, t...	12/03/2009
20090289344	Semiconductor device A semiconductor device includes an insulating substrate; at least one semiconductor element mounted on a first principal surface of the insulating substrate; and a heat radiator joined through a solder member to a second principal surface of the insulating substrate opp...	11/26/2009
20080237847	Power semiconductor module, and power semiconductor device having the module mounted therein A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a plural...	10/02/2008
20080179043	Heat sink fin with joining structure A heat sink fin with joining structure is provided, the heat sink fin is joined with and spaced from other heat sink fins mutually, so as to from a heat sink. The heat sink fin includes a plate and at least one inserting piece. The plate has at least one inserted slot f...	07/31/2008
20080093733	CHIP PACKAGE AND MANUFACTURING METHOD THEREOF A chip package including a carrier, at least one chip, a heat spreader, and a thermal interface material (TIM) is provided. The chip is disposed on the carrier and is electrically connected to the carrier. The heat spreader is disposed on the carrier, wherein the heat s...	04/24/2008
20080083982	METHOD AND SYSTEM FOR INITIATING PROXIMITY WARNING ALARM FOR ELECTRONIC DEVICES AND PROHIBITING OPERATION THEREOF A system for tracking the location of electronic devices and prohibiting unauthorized operation thereof includes a control unit, configured for wireless communication with an electronic device, the electronic device having a basic input/output system (BIOS) associated t...	04/10/2008
20080073070	Highly efficient heat dissipating composite material and a heat dissipating device made of such material A heat dissipating device made of highly efficient heat dissipating composite material consists of an aluminum heat dissipating member, and a copper heat conducting member; the aluminum heat dissipating member has many fins on one side; both the aluminum heat dissipatin...	03/27/2008
20080053648	STRUCTURE FOR COOLING A SURFACE An apparatus for cooling a surface having a metal structure made of a material with high thermal conductivity, and designed to provide efficient cooling of the surface while minimizing mechanical stress between the metal structure and the surface. ...	03/06/2008
20080024997	STAGGERED MEMORY LAYOUT FOR IMPROVED COOLING IN REDUCED HEIGHT ENCLOSURE A plurality of memory lies within the airflow created by the cooling fans and includes modules arranged in a plurality of pairs of memory modules aligned in substantially the same direction as airflow. Each pair has a first memory module and a second memory module, the ...	01/31/2008
20080017365	HEAT SINK A heat sink includes a heat-conductive base comprising a top surface; and a plurality of combined fins extending up from the top surface of the heat-conductive base, every two adjacent fins being spaced from each other with a passage formed therebetween, and the passage...	01/24/2008
20080011453	Heat-Dissipating Device For Memory And Method For Manufacturing The Same A heat-dissipating device for a memory and a method for manufacturing the same are disclosed herein. A primary feature is to provide an integrally manufactured heat sink. The heat sink is made of a metal plate with a certain thickness. A plurality of protrusions is prov...	01/17/2008
20070277959	Heat dissipating device A heat dissipating device for use with a heat-producing element in an electronic product includes a flat-plate heat collector and a plurality of parallelly arranged fins, both of which are made of a copper material to provide excellent heat conductivity. The fins are fi...	12/06/2007
20070251677	HEAT DISSIPATION APPARATUS WITH GUILDING PLATES FOR GUIDING AIRFLOW FLOWING THROUGH A FIN ASSEMBLY A heat dissipation apparatus (10) for dissipating heat from a heat generating electronic component includes a fin assembly (14) thermally connecting with the heat-generating electronic component to absorb heat therefrom, and a heat-dissipating fan (12	11/01/2007
20070246824	Heat sink design using clad metal According to some embodiments, an outer metal is cladded to a core metal to create a cladded heat sink fin, the cladded heat sink fin is inserted in a groove of a heat sink base, and the outer metal is heated to a reflow temperature of the outer metal. Embodiments may a...	10/25/2007
20070241452	Electronic device with a movable mechanism An electronic device with a movable mechanism mainly comprises a plurality of rolling elements at appropriate positions on the case thereof, so as to support the electronic device and to move it along a plane. Several fixing stands are installed vertically at appropriat...	10/18/2007
20070240868	Air-guiding structure for heat-dissipating fin An air-guiding structure for a heat-dissipating fin is manufactured by providing plural sets of air-guiding portions on each heat-dissipating fin. Each air-guiding-portion includes a plurality of thorns made by stamping. The thorns are arranged non-linearly and oriented...	10/18/2007
20070215336	Mesh-type heat dissipating structure A mesh-type heat dissipating structure includes a base and a plurality of heat dissipating fins disposed at intervals on the base, each of the heat dissipating fins having a plurality of meshes to increase the heat dissipating area of the heat dissipating structure, suc...	09/20/2007
20070215320	HEAT SINK WITH COMBINED FINS A heat sink (10) for removing heat from heat-generating devices includes a plurality of fins (12) interconnected together by a fastener (20) extending therethrough. Each fin comprises a main body (14) and a flange (16) bent from an edg...	09/20/2007
20070158824	Hybrid composite material substrate This invention relates to a hybrid composite material substrate. The substrate includes a conductive layer, an insulating layer, and a dispersion material extending from the conductive layer into the insulating layer. ...	07/12/2007
20070145574	High performance reworkable heatsink and packaging structure with solder release layer and method of making A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are solde...	06/28/2007
20070137849	HEATSINK WITH OFFSET FINS A heatsink assembly made of multiple heatsink sections to remove more heat than conventional heatsinks. The heatsink section's length is based upon the point at which the flow becomes steady. The fins and air channels of adjacent heatsink sections are arranged so that a...	06/21/2007
20070131406	Cooler A cooler includes a heat conducting member and a heat scattering member. The heat conducting portion is closely attached with a heat source. The heat scattering member has plural hollow cones respectively formed of sintered metallic particles with their size enlarged gr...	06/14/2007
20070131386	FIN UNIT FOR A COOLER A fin unit for a cooler includes a heat-conducting member, a plurality of helical elongate twisted fins and a fan. The heat-conducting member or a heat generator has its surface fixed with the plurality of helical elongated twisted fins. When the fan is started to opera...	06/14/2007
20070084595	HEAT DISSIPATION DEVICE A heat dissipation device includes a heat conducting member (10) adapted for contacting with a heat generating electronic device and a fin unit (30). The fin unit defines a central hole (300) therein and consists of a plurality of fins (31) a...	04/19/2007
20070029665	Method for the mitigation of hot spots in integrated circuits chip The invention relates to a method and apparatus for controlling the temperature of integrated circuit chips. Specifically, the invention relates to method and apparatus for controlling the temperature gradient across integrated circuit chips. ...	02/08/2007
20070012423	Liquid cooling jacket and liquid cooling device A heat receiving jacket in a liquid cooling device for electronic equipment, for transferring a heat from a heating portion in the electronic equipment to liquid refrigerant, is composed of a fin piece having a base portion formed thereon with thin fins which rise up fr...	01/18/2007
20060267192	Heat dissipation structure of an electronic device Disclosed is a heat dissipation structure, which includes a housing that houses a circuit board having active components, a heat sink formed integral with one side of the housing for supporting the circuit board and having radiation fins on the outside, a plurality of h...	11/30/2006
20060254750	HEAT-EMITTING ELEMENT COOLING APPARATUS AND HEAT SINK The present provides a heat-emitting element cooling apparatus which has a higher heat-emitting efficiency than that of conventional heat-emitting element cooling apparatus. A heat-emitting element cooling apparatus 1 includes a hea...	11/16/2006
20060227508	Heat sink assembly A heat sink assembly includes a base having first and second surfaces, and a dimension therebetween extending substantially perpendicular to each of the first and second surfaces. The base includes an opening extending therethrough and an insert received in the opening,...	10/12/2006
20060219386	Heat dissipating assembly with composite heat dissipating structure A heat dissipating assembly includes a fan and a composite heat dissipating structure. The composite heat dissipating structure includes a first heat sink and a second heat sink disposed adjacent to the first heat sink. The first and the second heat sinks include a plur...	10/05/2006
20060145336	Heat sink A heat sink is formed of a plurality of plate members stacked together. Each plate member includes a body, a first sidewall extending from a lateral side of the body, a second sidewall extending from another lateral side of the body, two retaining members which are prov...	07/06/2006
20060118948	Elevated heat dissipating device The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connected to...	06/08/2006
20060097385	Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same A mounting substrate for a semiconductor light emitting device includes a solid metal block having first and second opposing metal faces. The first metal face includes a cavity that is configured to mount at least one semiconductor light emitting device therein, and to ...	05/11/2006
20060043579	Transistor performance enhancement using engineered strains A semiconductor substrate having metal oxide semiconductor (MOS) devices, such as an integrated circuit die, is mechanically coupled to a stress structure to apply a stress that improves the performance of at least a portion of the MOS devices on the die. ...	03/02/2006
20050111189	Thermal solution for electronic devices A thermal solution for an electronic device, which is positioned between a heat source and an external surface of the electronic device and/or another component of the electronic device, where the thermal solution facilitates heat dissipation from the heat source while ...	05/26/2005

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Class 257/722 - With fins