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| Application No. | Application Title | Issue Date |
| 20120043652 | SEMICONDUCTOR POWER MODULE A semiconductor power module includes an active element and a passive element serving as semiconductor elements each having a first electrode on a front surface and a second electrode on a back surface thereof, a heat pipe having a first region defined as arrangement pa... | 02/23/2012 |
| 20110304037 | SEMICONDUCTOR DEVICE A semiconductor device includes an enclosure of insulating material having an introduction portion and a discharge portion for an insulating refrigerant and also having an opening, filters mounted on the introduction portion and the discharge portion, respectively, so a... | 12/15/2011 |
| 20110233758 | SEMICONDUCTOR DEVICE A semiconductor devices includes a first die pad having the conductivity connected to one end of a DC power source, a second die pad having the conductivity connected to the other end of the DC power source, a first switching element provided on the first die pad, recei... | 09/29/2011 |
| 20110108979 | SEMICONDUCTOR DEVICE AND DISPLAY APPARATUS In a COF of an embodiment of the present invention, the smaller distance to edges of a heat-releasing member an area of the heat-releasing member has, the larger openings the area has. Accordingly, a volume per area (an area per length) of the heat-releasing member decr... | 05/12/2011 |
| 20110031613 | SEMICONDUCTOR PACKAGE HAVING A HEAT DISSIPATION MEMBER A semiconductor package having a heat dissipation member capable of efficiently conveying excess heat away from semiconductor chips is presented. The semiconductor package includes a semiconductor chip, through-electrodes, and a heat dissipation member. The semiconducto... | 02/10/2011 |
| 20100090336 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE A semiconductor element cooling structure includes first and second semiconductor elements; a heat sink having a mounting surface on which the semiconductor elements are mounted and a cooling medium channel formed inside, through which a cooling medium for cooling the s... | 04/15/2010 |
| 20100044856 | ELECTRONIC PACKAGE WITH A THERMAL INTERPOSER AND METHOD OF MANUFACTURING THE SAME An electronic package includes a die including a thermal interface material through which a primary heat flux path is enabled for conducting heat from the die, an organic substrate, and a thermal interposer provided between the organic substrate and the die, the thermal... | 02/25/2010 |
| 20090309214 | Circuit Module Turbulence Enhancement Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat spreaders employed by circuit modules constructed according to traditiona... | 12/17/2009 |
| 20090294955 | COOLING DEVICE WITH A PREFORMED COMPLIANT INTERFACE An integrated circuit package includes: a substrate; an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level; a cooling device located over the electronic circuit; a compliant interface disposed between the el... | 12/03/2009 |
| 20090212418 | THERMAL INTERFACE MATERIAL DESIGN FOR ENHANCED THERMAL PERFORMANCE AND IMPROVED PACKAGE STRUCTURAL INTEGRITY An electronic package comprising a semiconductor device, a heat spreader layer, and a thermal interface material layer located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer having heat conductiv... | 08/27/2009 |
| 20090194870 | Method and Apparatus for Solid State Cooling System The disclosure relates to a Point Cooler based on a combination of principles, including large area, low current density PN junction cooling, and electron emission from heavily doped shallowly-depleted P tips. Using Junction Cooling rather than thermoelectric cooling en... | 08/06/2009 |
| 20090108429 | Flip Chip Packages with Spacers Separating Heat Sinks and Substrates A package structure includes a substrate; a die over and flip bonded on the substrate; a heat sink over the die; and one or more spacer separating the heat sink from the substrate.... | 04/30/2009 |
| 20090096087 | MICROELECTRONIC ASSEMBLY AND METHOD OF PREPARING SAME A microelectronic assembly includes a die (110, 210) having a surface (111, 211), a heat sink (120, 220) removably attached to the die, a thermally conductive layer (130, 230) between the die and the heat sink, and an anti-adhesion layer (... | 04/16/2009 |
| 20090085438 | PIEZOELECTRIC FAN, COOLING DEVICE CONTAINING SAME, AND METHOD OF COOLING A MICROELECTRONIC DEVICE USING SAME A piezoelectric fan includes a piezoelectric actuator patch (110, 210, 310) and a blade (120, 220, 320) attached to the piezoelectric actuator patch. The blade has a hole (121, 127, 221) in it, and a door (122, 128, 222) is adjacent to the ho... | 04/02/2009 |
| 20090072387 | CURVILINEAR HEAT SPREADER/LID WITH IMPROVED HEAT DISSIPATION A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least ... | 03/19/2009 |
| 20090057883 | Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package A method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package is disclosed. In one embodiment, a method includes forming a dam structure on an outer area of a substrate surface of a semiconductor package and blocking a flow of a mo... | 03/05/2009 |
| 20090039503 | SEMICONDUCTOR DEVICE The invention provides a heat radiating structure which reduces a mechanical stress applied to an electronic part mounted on a printed circuit board including a semiconductor package. The heat radiating structure is constructed by a semiconductor package mounted on a pr... | 02/12/2009 |
| 20090020868 | Integrated circuit package and system interface An apparatus for enhancing the performance of an IC package and media interface. Adding a fissure to a Flip-Chip type package improves the crosstalk performance of the package for both high and low frequencies. The wall of the fissure can be implemented with a heat spre... | 01/22/2009 |
| 20090001561 | High Thermal Performance Packaging for Circuit Dies A circuit die is disposed into a region defined by a mold. A molding material is then introduced into the region to encapsulate the circuit die. Prior to substantial curing of the molding material, at least a portion of the molding material is removed from over a surfac... | 01/01/2009 |
| 20080290507 | CHIP EMBEDDED PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF The chip embedded printed circuit board and a fabricating method thereof are disclosed, wherein a circuit pattern is formed by depositing a metal layer on a support layer, a semiconductor chip is packaged on a support layer to wrap the semiconductor chip and the circuit... | 11/27/2008 |
| 20080277780 | Electrical circuit device An electrical circuit device includes an electrical circuit that includes a plurality of electrically connected components including a component that necessitates heat measures, a substrate that physically connects main components among the plural components of the elec... | 11/13/2008 |
| 20080265271 | LIGHT-EMITTING ELEMENT PACKAGE AND LIGHT SOURCE APPARATUS USING THE SAME A light-emitting element package including a heat conductive layer having a first surface and a second surface, a dielectric layer disposed on the first surface of the heat conductive layer and having an opening exposing the heat conductive layer, two electrodes dispose... | 10/30/2008 |
| 20080237846 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF A BGA substrate which has a back surface to which a heat radiating plate 5 is attached and an opening for accommodating a relay wiring substrate therein, which is provided in the center of its surface, is used. The relay wiring substrate to which an ASIC chip and... | 10/02/2008 |
| 20080230895 | SEMICONDUCTOR PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME A method for manufacturing semiconductor packages is provided. The upper surface of a substrate has a plurality of slots and surface mount devices are positioned across the slots. In this circumstance, the space below the surface mount devices can be filled up with seal... | 09/25/2008 |
| 20080211088 | SEMICONDUCTOR DEVICE The semiconductor device includes a substrate, a first semiconductor element, a second semiconductor element, a first heat sink and a second heat sink. The first and the second semiconductor elements are provided on the substrate. The maximum power consumption of the fi... | 09/04/2008 |
| 20080191339 | MODULE WITH SILICON-BASED LAYER The invention concerns a module comprising a carrier element, a semiconductor device mounted on said carrier element and a silicon-based insulating layer. The silicon-based insulating layer is arranged on the side of the carrier element opposite to the semiconductor dev... | 08/14/2008 |
| 20080179737 | Semiconductor device A semiconductor device according to the present invention includes an island provided on one surface of a resin substrate, an external terminal provided on the other surface of the substrate, a thermal pad provided on the other surface of the substrate in opposed relati... | 07/31/2008 |
| 20080178028 | CONTROLLING POWER CHANGE FOR A SEMICONDUCTOR MODULE The present invention provides a method for controlling power change for a semiconductor module. Specifically, under the present invention power is applied to, or removed from a semiconductor module between a lower power state such as a zero power, nap or sleep state an... | 07/24/2008 |
| 20080164604 | Heat dissipating semiconductor package A heat dissipating semiconductor package is disclosed, including a chip carrier; at least a semiconductor chip mounted and electrically connected to the chip carrier; and a heat dissipating member mounted on the semiconductor chip with a thermal interface material (TIM)... | 07/10/2008 |
| 20080088010 | ELECTRONIC DEVICE WITH INTEGRATED MICROMECHANICAL CONTACTS AND COOLING SYSTEM An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of ... | 04/17/2008 |
| 20080054450 | CHIP PACKAGE STRUCTURE AND HEAT SINK FOR CHIP PACKAGE A chip package structure including a circuit substrate, a chip, a heat sink, and at least one electrical connector is provided. The circuit substrate has a carrying surface and at least one contact disposed on the carrying surface. The chip is disposed on the carrying s... | 03/06/2008 |
| 20080054442 | SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD A power semiconductor arrangement and method is disclosed. One embodiment provides a power semiconductor module. An insulator is arranged between the module and a cooling element, increasing clearances between the power semiconductor module and the cooling element. ... | 03/06/2008 |
| 20080036077 | Package structure and heat sink module thereof A package structure and a heat sink module thereof are provided. The package structure includes a substrate, a chip and a heat sink module. The chip is disposed on the substrate. The heat sink module includes a supporting ring and a heat sink plate. The supporting ring ... | 02/14/2008 |
| 20070296078 | Semiconductor Module Having Low Thermal Load At least one bearing body in a power semiconductor module has a surface section on which a first semiconductor component and at least one additional semiconductor component are arranged adjacent to each other. The semiconductor components have contact surfaces, oriented... | 12/27/2007 |
| 20070152325 | Chip package dielectric sheet for body-biasing A chip package includes a thermal interface material disposed between a die backside and a heat sink. A dielectric sheet is also disposed between the die backside and the heat sink. The dielectric sheet diminishes overall heat transfer from the die to the heat sink by a... | 07/05/2007 |
| 20070152352 | MICRO-FABRICATED DEVICE WITH THERMOELECTRIC DEVICE AND METHOD OF MAKING A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the su... | 07/05/2007 |
| 20070152321 | Fluxless heat spreader bonding with cold form solder The formation of electronic assemblies including a heat spreader coupled to at least one die is described. One embodiment relates to a method including positioning a solder on a heat spreader. The method also includes forming a solid state diffusion bond between the sol... | 07/05/2007 |
| 20070145574 | High performance reworkable heatsink and packaging structure with solder release layer and method of making A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are solde... | 06/28/2007 |
| 20070102809 | Methods of fabricating a composite carbon nanotube thermal interface device Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit d... | 05/10/2007 |
| 20070075419 | Semiconductor device having metallic lead and electronic device having lead frame A semiconductor device includes: first to fourth vertical type semiconductor elements having first and second electrodes; a metallic lead; a resin mold; a circuit board; an electric circuit on the circuit board; and an electronic chip on the circuit board. The electroni... | 04/05/2007 |
