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| Application No. | Application Title | Issue Date |
| 20120001319 | FLUID COOLED ENCAPSULATED MICROELECTRONIC PACKAGE An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips.... | 01/05/2012 |
| 20110024892 | THERMALLY ENHANCED HEAT SPREADER FOR FLIP CHIP PACKAGING A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first surface being coupled to a substrate; a thermal interface material disposed in t... | 02/03/2011 |
| 20110012252 | POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole ... | 01/20/2011 |
| 20100327423 | SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface adjacent to the first surface. A first electrode line with two ends are provide... | 12/30/2010 |
| 20100171213 | SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE A semiconductor device comprises a mounting substrate, a semiconductor element provided above said mounting substrate, a package substrate provided above said mounting substrate with said semiconductor element therebetween and electrically connected to said semiconducto... | 07/08/2010 |
| 20100148358 | SEMICONDUCTOR DEVICE WITH A HIGH THERMAL DISSIPATION EFFICIENCY A semiconductor device having a higher thermal dissipation efficiency includes a thermally conducting structure attached to a surface of the semiconductor device via soldering. The thermally conducting structure is essentially formed of a thermally conducting material a... | 06/17/2010 |
| 20100133685 | DIRECT SEMICONDUCTOR CONTACT EBULLIENT COOLING PACKAGE The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surroun... | 06/03/2010 |
| 20100127390 | Cooling Structures and Methods Cooling structures and methods, methods of manufacturing semiconductor devices, and semiconductor devices are disclosed. In one embodiment, a cooling structure for a semiconductor device includes at least one channel defined between a first workpiece and a second workpi... | 05/27/2010 |
| 20100117209 | MULTIPLE CHIPS ON A SEMICONDUCTOR CHIP WITH COOLING MEANS The present invention is directed to a method of packaging multiple semiconductor chips on a second semiconductor chips with a built-in efficient cooling means. One embodiment is to place two multiple chip stacks on opposing sides of a vapor chamber for transferring hea... | 05/13/2010 |
| 20100102441 | SEMICONDUCTOR DEVICE Between a logic LSI (4) arranged on one side of a DRAM (1) and jointed to the DRAM and a radiating member (6) arranged on the other side of the DRAM (1) for irradiating the heats of the DRAM (1) and the logic LSI (4), there is d... | 04/29/2010 |
| 20100038774 | ADVANCED AND INTEGRATED COOLING FOR PRESS-PACKAGES A heat sink for cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises at least one thermally conductive material and defines multiple inlet manifolds co... | 02/18/2010 |
| 20090314062 | Fluid Actuator, and Heat Generating Device and Analysis Device Using the Same A fluid actuator includes a piezoelectric body (31), a fluid channel (2) having the piezoelectric body (31) on a part of the inner wall thereof and enabling a fluid to move inside, and a surface acoustic wave generation portion (101) for driv... | 12/24/2009 |
| 20090160048 | Semiconductor Unit, and Power Conversion System and On-Vehicle Electrical System Using the Same A semiconductor device includes a semiconductor chip and leads electrically connected to the electrodes of the semiconductor chip. A hollow radiator base houses the semiconductor device which is molded with high-thermal-conductivity resin having an electrical insulating... | 06/25/2009 |
| 20090146293 | FLOW DISTRIBUTION MODULE AND A STACK OF FLOW DISTRIBUTION MODULES A flow distribution module (5) for distributing a flow of cooling fluid across a surface. Is adapted to be connected to another at least substantially identical module (5). Makes it possible to provide a cooling unit which may be customized to meet specifi... | 06/11/2009 |
| 20090146294 | GASKET SYSTEM FOR LIQUID-METAL THERMAL INTERFACE Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included be... | 06/11/2009 |
| 20090126922 | Heat transfer device The invention is for an apparatus and method for removal of waste heat from heat-generating components including high-power solid-state analog electronics such as being developed for hybrid-electric vehicles, solid-state digital electronics, light-emitting diodes for so... | 05/21/2009 |
| 20090108435 | ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE ASSEMBLY AND METHOD OF FABRICATING THE ASSEMBLY An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connect... | 04/30/2009 |
| 20090108439 | Fluid cooled encapsulated microelectronic package An encapsulated microelectronic package includes a fluid conducting cooling tube directly coupled to one or more semiconductor chips, with the encapsulant being molded over the semiconductor chips and portions of the cooling tube in proximity to the semiconductor chips.... | 04/30/2009 |
| 20090096086 | Cooling system for semiconductor devices In one embodiment, the present invention includes a socket for a semiconductor package, where the socket has a frame with a segmented design, where socket streets are located between the segments. One or more of the streets may include a conduit to enable thermal transf... | 04/16/2009 |
| 20090085198 | NANOTUBE BASED VAPOR CHAMBER FOR DIE LEVEL COOLING The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the... | 04/02/2009 |
| 20090072386 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY A semiconductor package includes a main body having a semiconductor device accommodating portion accommodating a basic circuit including a semiconductor device, external connection terminal members protruding outside the main body, and a cooling structure reducing heat ... | 03/19/2009 |
| 20090057881 | MICROELECTRONIC PACKAGE AND METHOD OF COOLING SAME A microelectronic package comprises a chip stack (110) that includes a substrate (111), a first die (112) over the substrate and a second die (113) over the first die, a first underfill layer (114) between the substrate and the first d... | 03/05/2009 |
| 20090057882 | Fluid cooled semiconductor power module having double-sided cooling A semiconductor power module includes one or more power semiconductor power devices sandwiched between a fluid conducting base and a fluid conducting cover joined to the base. Fluid coolant entering the base diverges into a first flow path through the base and a second ... | 03/05/2009 |
| 20090039502 | HEATSINK AND SEMICONDUCTOR DEVICE WITH HEATSINK A heatsink carries a UV-ray light emitting diode. Flow passages for causing circulation of a fluid that cools the UV-ray light emitting diode are opened in the heatsink. Supply ports and discharge ports are opened in a mount surface of a header where supply and discharg... | 02/12/2009 |
| 20090032938 | Electronic Package With Direct Cooling Of Active Electronic Components A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic components ... | 02/05/2009 |
| 20090001560 | Embedded Heat Pipe In A Hybrid Cooling System One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between the base and the housing, where a heat transfer liquid may be circulated t... | 01/01/2009 |
| 20080303138 | INSULATED GATE BIPOLAR TRANSISTOR An insulated gate bipolar transistor includes bump pad connectors to provide thermal contact with a heat spreader for dissipating heat away form the insulated gate bipolar transistor.... | 12/11/2008 |
| 20080303137 | SEMICONDUCTOR DEVICES WITH LAYERS HAVING EXTENDED PERIMETERS FOR IMPROVED COOLING AND METHODS FOR COOLING SEMICONDUCTOR DEVICES A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor includes a first surface, and the first surface defines a first area. The de... | 12/11/2008 |
| 20080290506 | Semiconductor module and inverter device A semiconductor module includes a base plate; a plurality of substrates placed on one surface of the base plate, with each substrate of the plurality of substrates including a switching element, a diode element, and a connection terminal area; and a parallel flow formin... | 11/27/2008 |
| 20080277779 | Microelectronic package and method of manufacturing same A microelectronic package comprises a substrate (110), a die (120) having a front side (121) and a back side (122) located over the substrate, a thermally conducting layer (130) on the back side of the die, a microchannel (140) ... | 11/13/2008 |
| 20080272474 | APPARATUS FOR INTEGRATED CIRCUIT COOLING DURING TESTING AND IMAGE BASED ANALYSIS An apparatus for implementing integrated circuit cooling during testing and image-based analysis thereof includes a lid configured to define a cavity surrounding an integrated circuit die, the die mounted to a module substrate. One or more fluid passages are defined wit... | 11/06/2008 |
| 20080272484 | Liquid cooled power electronic circuit comprising a stacked array of directly cooled semiconductor chips A stacked array of channeled semiconductor chips defining a power electronic circuit is mounted in a sealed container provided with inlet and outlet passages for liquid coolant. Leadframe terminals supported by the container engage selected terminals of the semiconducto... | 11/06/2008 |
| 20080272485 | Liquid cooled power electronic circuit comprising stacked direct die cooled packages A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking... | 11/06/2008 |
| 20080258295 | Self-Contained Cooling Mechanism for Integrated Circuit Using a Reversible Endothermic Chemical Reaction A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that re... | 10/23/2008 |
| 20080251911 | System and method having evaporative cooling for memory A system, in one embodiment, may include an in-line memory module with a plurality of memory circuits disposed on a circuit board, wherein the circuit board may have an edge connector with a plurality of contact pads. The system also may include a heat spreader disposed... | 10/16/2008 |
| 20080230894 | Carbon nanotubes for active direct and indirect cooling of electronics device A system for cooling a semiconductor device is disclosed. The system includes a lid encasing the semiconductor device, a first plurality of carbon nanotubes disposed within the lid, and a fluid system configured to pass a fluid through the lid. Furthermore, a second sys... | 09/25/2008 |
| 20080196870 | LIQUID SUBMERSION COOLING SYSTEM A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic de... | 08/21/2008 |
| 20080191236 | Cooling Device for a Light-Emitting Semiconductor Device and a Method of Manufacturing Such a Cooling Device A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The ceramic plate (15) is adapted for forming an integr... | 08/14/2008 |
| 20080179736 | Chip cooling channels formed in wafer bonding gap One embodiment in accordance with the invention is a system that can include a first wafer and a second wafer. The first wafer and the second wafer can be bonded together by a wafer bonding process that forms a gap between the first wafer and the second wafer. The gap c... | 07/31/2008 |
| 20080111151 | Power Module, Method of Producing Same, and Air Conditioner A power module includes a power semiconductor, a non-power semiconductor, one resin substrate and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and... | 05/15/2008 |
