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| Application No. | Application Title | Issue Date |
| 20120080785 | SEMICONDUCTOR COOLING APPARATUS In some embodiments, a semiconductor cooling apparatus includes a monolithic array of cooling elements. Each cooling element of the monolithic array of cooling elements is configured to thermally couple to a respective semiconductor element of an array of semiconductor ... | 04/05/2012 |
| 20120049341 | Semiconductor Package Structures Having Liquid Cooler Integrated with First Level Chip Package Modules Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include struct... | 03/01/2012 |
| 20120018873 | METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING A method and a package for circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; a metal foil disposed on the c... | 01/26/2012 |
| 20120001318 | SEMICONDUCTOR DEVICE A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally conn... | 01/05/2012 |
| 20110316143 | SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD THEREOF A semiconductor module is provided which includes a semiconductor unit which is made by a resin mold. The resin mold has formed therein a coolant path through which a coolant flows to cool a semiconductor chip embedded in the resin mold. The resin mold also includes hea... | 12/29/2011 |
| 20110316142 | SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP A semiconductor module is provided which includes a resin molded package which is made by a resinous mold assembly. The resin molded package is clamped by covers through a fastener to make the semiconductor module. The resinous mold assembly has formed therein a coolant... | 12/29/2011 |
| 20110298121 | POWER SEMICONDUCTOR DEVICE A power semiconductor device according to the present invention includes a heat sink made of Cu and having a thickness of 2 to 3 mm, an insulating substrate bonded on the heat sink with interposition of a first bonding layer (under-substrate solder), and a power semicon... | 12/08/2011 |
| 20110215457 | Dummy TSV to Improve Process Uniformity and Heat Dissipation In a stack of chips which each include active circuit regions, a plurality of through-silicon via (TSV) structures are formed for thermally conducting heat from the multi-chip stack by patterning, etching and filling with thermally conductive material a plurality of TSV... | 09/08/2011 |
| 20110180925 | Microfabricated Pillar Fins For Thermal Management An electrical package with improved thermal management. The electrical package includes a die having an exposed back surface. The package further includes a plurality of fins extending outwardly from the back surface for dissipating heat from the package. The die can be... | 07/28/2011 |
| 20110180809 | SEMICONDUCTOR DEVICE MODULE A P-side package unit and a N-side package unit are arranged on a main surface of a metal heatsink such that a main surface extends in a direction perpendicular to the main surface of the heatsink. Each of the P-side package unit and the N-side package unit is fixed by ... | 07/28/2011 |
| 20110156244 | HEAT SINK AND INTEGRATED CIRCUIT ASSEMBLY USING THE SAME An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, th... | 06/30/2011 |
| 20110140262 | MODULE PACKAGE WITH EMBEDDED SUBSTRATE AND LEADFRAME An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The a... | 06/16/2011 |
| 20110068463 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH QUAD FLAT NO-LEAD PACKAGE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a base array having terminals and an open region; attaching a coverlay layer directly on the base array; placing a component in the open region and directly on the coverlay layer; form... | 03/24/2011 |
| 20110037167 | METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING A method of assembling a bent circuit chip package and a circuit chip package having a bent structure. The circuit chip package includes: a substrate having a first coefficient of thermal expansion (CTE); a circuit chip, having a second CTE, mounted onto the substrate; ... | 02/17/2011 |
| 20110037168 | Semiconductor Device and Method of Providing a Thermal Dissipation Path Through RDL and Conductive Via A semiconductor device has a conductive via formed around a perimeter of the semiconductor die. First and second conductive layers are formed on opposite sides of the semiconductor die and thermally connected to the conductive via. An insulating layer is formed over the... | 02/17/2011 |
| 20110031612 | POWER SEMICONDUCTOR CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state wher... | 02/10/2011 |
| 20110018123 | Semiconductor package and method of manufacturing the same The present invention relates to a semiconductor package and a method of manufacturing the same. The semiconductor package may include: an insulator that has first and second opening parts; an active element that is disposed inside the first opening part; a passive elem... | 01/27/2011 |
| 20110018126 | LOW NOISE HIGH THERMAL CONDUCTIVITY MIXED SIGNAL PACKAGE An improved microelectronic assembly (100) and packaging method includes a device package for housing a semiconductor die or chip, (105), an array of passive electronic components (305-355) operating in cooperation with the flip chip semicond... | 01/27/2011 |
| 20110012257 | HEAT SPREADER FOR SEMICONDUCTOR PACKAGE A semiconductor package including a substrate, a die attached to the substrate and a heat spreader. The heat spreader has a heat dissipating portion with an upper surface, a lower surface and a perimeter. The lower surface overlies and is spaced apart from the die to pr... | 01/20/2011 |
| 20100301470 | STUD BUMPS AS LOCAL HEAT SINKS DURING TRANSIENT POWER OPERATIONS A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A pluralit... | 12/02/2010 |
| 20100283143 | Die Exposed Chip Package This disclosure describes a chip package. In one embodiment, a semiconductor chip package includes a thermal dissipater placed on top of an integrated-circuit die, the thermal dissipater having a same or similar coefficient of thermal expansion as that of the integrated... | 11/11/2010 |
| 20100244236 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package... | 09/30/2010 |
| 20100224991 | INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.... | 09/09/2010 |
| 20100224985 | Chip-Scale Packaging with Protective Heat Spreader A semiconductor package can include a semiconductor die having an integrated circuit, a first die surface, and an opposite second die surface. A packaging can be attached to the die and have a holder surface opposite the first die surface. A heat spreader can be configu... | 09/09/2010 |
| 20100213601 | INTEGRATED CIRCUIT MICRO-MODULE In one aspect, an integrated circuit package composed of a plurality of immediately adjacent stacked layers of cured, planarizing, photo-imageable dielectric is described. At least one interconnect layer is provided between a pair of adjacent dielectric layers. An integ... | 08/26/2010 |
| 20100213603 | INTEGRATED CIRCUIT MICRO-MODULE Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to an integrated circuit package in which one or more integrated circuits are embedded in a substrate and covered with a layer of photo-imageable ... | 08/26/2010 |
| 20100213604 | INTEGRATED CIRCUIT MICRO-MODULE Various apparatus and methods for improving the dissipation of heat from integrated circuit micro-modules are described. One aspect of the invention pertains to an integrated circuit package with one or more thermal pipes. In this aspect, the integrated circuit package ... | 08/26/2010 |
| 20100201432 | Multi-layered semiconductor apparatus Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at ... | 08/12/2010 |
| 20100193942 | Thermally Enhanced Semiconductor Package Disclosed are systems and methods for improving the thermal performance of integrated circuit packages. Aspects of the present invention include improved thermal package structures and methods for producing the same through the application of one or more thermal spreade... | 08/05/2010 |
| 20100187683 | 3-D ICs EQUIPPED WITH DOUBLE SIDED POWER, COOLANT, AND DATA FEATURES Three dimensional integrated circuits with double sided power, coolant, and data features and methods of constructing same are provided. According to some embodiments, an integrated circuit package can generally comprise one or more semiconductor wafers and opposing end... | 07/29/2010 |
| 20100187682 | ELECTRONIC PACKAGE AND METHOD OF ASSEMBLING THE SAME An electronic package (200) comprises a substrate (201), a first carrier layer arrangement (211) adapted to dissipate heat from at least one chip (217) mounted thereon, and a heat exchanger (221) mounted on the first carrier layer arra... | 07/29/2010 |
| 20100181663 | LOW COMPRESSIVE FORCE, NON-SILICONE, HIGH THERMAL CONDUCTING FORMULATION FOR THERMAL INTERFACE MATERIAL AND PACKAGE An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a compositio... | 07/22/2010 |
| 20100181664 | INTEGRATED CIRCUIT CHIP PACKAGE MODULE An integrated circuit (IC) package module includes a carrier, an IC chip, a number of wires, a number of pins, a seal member, and a thermal conductor. The IC chip is attached on a top surface of the carrier. The number of pins is connected to the IC chip via the number ... | 07/22/2010 |
| 20100176503 | SEMICONDUCTOR PACKAGE SYSTEM WITH THERMAL DIE BONDING A semiconductor package system includes providing a substrate having a plurality of thermal vias extending through the substrate. A solder mask is positioned over the plurality of thermal vias. A plurality of thermally conductive bumps is formed on at least some of the ... | 07/15/2010 |
| 20100164093 | HEAT DISSIPATION IN TEMPERATURE CRITICAL DEVICE AREAS OF SEMICONDUCTOR DEVICES BY HEAT PIPES CONNECTING TO THE SUBSTRATE BACKSIDE By providing heat dissipation elements or heat pipes in temperature critical areas of a semiconductor device, enhanced performance, reliability and packing density may be achieved. The heat dissipation elements may be formed on the basis of standard manufacturing techni... | 07/01/2010 |
| 20100155932 | BONDED SEMICONDUCTOR SUBSTRATE INCLUDING A COOLING MECHANISM A bonded substrate comprising two semiconductor substrates is provided. Each semiconductor substrate includes semiconductor devices. At least one through substrate via is provided between the two semiconductor substrates to provide a signal path therebetween. The bottom... | 06/24/2010 |
| 20100148357 | METHOD OF PACKAGING INTEGRATED CIRCUIT DIES WITH THERMAL DISSIPATION CAPABILITY A method (20) of packaging integrated circuit dies (70) includes obtaining (22) a heat spreader substrate (24) having a top surface (38) with cavities (30) formed therein, each of the cavities (30) having a cavity floor (... | 06/17/2010 |
| 20100140792 | GRAPHITE NANOPLATELETS FOR THERMAL AND ELECTRICAL APPLICATIONS This disclosure concerns a procedure for bulk scale preparation of high aspect ratio, 2-dimensional nano platelets comprised of a few graphene layers, Gn. n may, for example, vary between about 2 to 10. Use of these nano platelets in applications such as ther... | 06/10/2010 |
| 20100117222 | Void Reduction in Indium Thermal Interface Material Thermal interface materials and method of using the same in packaging are provided. In one aspect, a thermal interface material is provided that includes an indium preform that has a first surface and a second surface opposite to the first surface, an interior portion a... | 05/13/2010 |
| 20100109153 | HIGH BANDWIDTH PACKAGE Method and apparatus for constructing and operating a high bandwidth package in an electronic device, such as a data storage device. In some embodiments, a high bandwidth package comprises a first known good die that has channel functions, a second known good die that h... | 05/06/2010 |
