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| Application No. | Application Title | Issue Date |
| 20120104588 | METHOD FOR MANUFACTURING LEADFRAME, PACKAGING METHOD FOR USING THE LEADFRAME AND SEMICONDUCTOR PACKAGE PRODUCT A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die moun... | 05/03/2012 |
| 20120104584 | SEMICONDUCTOR DEVICE PACKAGES WITH PROTECTIVE LAYER AND RELATED METHODS A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configur... | 05/03/2012 |
| 20120104586 | Direct Contact Flip Chip Package with Power Transistors Some exemplary embodiments of an advanced direct contact leadless package and related structure and method, especially suitable for packaging high current semiconductor devices, have been disclosed. One exemplary structure comprises a mold compound enclosing a first con... | 05/03/2012 |
| 20120104583 | SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second di... | 05/03/2012 |
| 20120104587 | Direct Contact Semiconductor Package with Power Transistor Some exemplary embodiments of an advanced direct contact leadless package and related structure and method, especially suitable for packaging high current semiconductor devices, have been disclosed. One exemplary structure comprises a mold compound enclosing a first con... | 05/03/2012 |
| 20120104585 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming signal contacts; forming a power bar having a power bar terminal, the power bar terminal formed in a staggered position relative to the signal contacts; depositing a terminal pad on the ... | 05/03/2012 |
| 20120080781 | DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AND MOLD LOCKING APERTURE A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged abo... | 04/05/2012 |
| 20120080705 | EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, LEAD FRAME OBTAINED USING THE SAME FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin ... | 04/05/2012 |
| 20120068318 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADDLE MOLDING AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a hole, a recess, and a pad, the hole over the recess; mounting an integrated circuit to the package paddle; forming a lead having a bottom surface coplanar wit... | 03/22/2012 |
| 20120068317 | TSOP WITH IMPEDANCE CONTROL A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial port... | 03/22/2012 |
| 20120068323 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MAKING A SEMICONDUCTOR DEVICE PACKAGE A method of manufacturing an electronic device is provided. The method comprises providing a carrier sheet, etching the lead frame material sheet to form a recess on a first surface of the lead frame material sheet, placing an electronic chip into the recess of the carr... | 03/22/2012 |
| 20120068321 | SEMICONDUCTOR DEVICE The invention enhances resistance to a surge in a semiconductor device having a semiconductor die mounted on a lead frame. An N type embedded layer, an epitaxial layer and a P type semiconductor layer are disposed on the front surface of a P type semiconductor substrate... | 03/22/2012 |
| 20120068320 | Integrated Power Converter Package With Die Stacking An integrated circuit for implementing a switch-mode power converter is disclosed. The integrated circuit comprises at least a first semiconductor die having an electrically quiet surface, a second semiconductor die for controlling the operation of said first semiconduc... | 03/22/2012 |
| 20120068319 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACK INTERCONNECT AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming a connection carrier having base device pads and base interconnect pads on a carrier top side of the connection carrier; connecting a base integrated circuit to the base device pads and ... | 03/22/2012 |
| 20120068322 | PACKAGE SUBSTRATE, MODULE AND ELECTRIC/ELECTRONIC DEVICES USING THE SAME A package substrate includes: a first conductive layer having plural first terminal pattern portions connected to a semiconductor part loaded on a first principal surface through plural first external connection conductors, which is formed on the first principal surface... | 03/22/2012 |
| 20120049337 | SEMICONDUCTOR DEVICE A non-insulated DC-DC converter has a power MOSFET for a highside switch and a power MOS•ET for a lowside switch. In the non-insulated DC-DC converter, the power MOS•ET for the highside switch and the power MOS•ET for the lowside switch, driver circuits that contr... | 03/01/2012 |
| 20120049336 | Semiconductor package for forming a leadframe package A method is disclosed for attaching an interconnection plate to semiconductor die within leadframe package. A base leadframe is provided with die pad for attaching semiconductor die. An interconnection plate is provided for attachment to the base leadframe and semicondu... | 03/01/2012 |
| 20120049335 | SINGULATION METHOD FOR SEMICONDUCTOR PACKAGE WITH PLATING ON SIDE OF CONNECTORS A method of singulating semiconductor packages, the method comprising: providing a plurality of semiconductor dies coupled to a single common leadframe, wherein a molding compound at least partially encases the semiconductor dies and the leadframe; singulating the plura... | 03/01/2012 |
| 20120043628 | PACKAGED DEVICE INCLUDING A WELL FOR CONTAINING A DIE A packaged device includes a package defining a well having a well top, a die positioned in the well of the package, and a retaining substrate attached to the package over the well top. The retaining substrate holds the die in direct contact with a portion of the packag... | 02/23/2012 |
| 20120043651 | LEADFRAME, LEADFRAME TYPE PACKAGE AND LEAD LANE A leadframe for a leadframe type package includes a chip base, and leads constituting lead lanes. One lead lane includes a pair of first differential signal leads, a pair of second differential signal leads, a pair of third differential signal leads between which and th... | 02/23/2012 |
| 20120038034 | Semiconductor Device and Method of Forming Vertical Interconnect in FO-WLCSP Using Leadframe Disposed Between Semiconductor Die A semiconductor device has a plurality of semiconductor die or components mounted over a carrier. A leadframe is mounted over the carrier between the semiconductor die. The leadframe has a plate and bodies extending from the plate. The bodies of the leadframe are dispos... | 02/16/2012 |
| 20120038035 | SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME A semiconductor package may include a package substrate having a first surface and a boundary that may be defined by edges of the package substrate. The package further includes a first semiconductor chip having a front surface and a back surface. The back surface of a ... | 02/16/2012 |
| 20120032316 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MOLD, AND SEALING DEVICE A rear surface opposite to one plane of a die pad is formed to be exposed from one plane of a sealing resin. In addition, a concave portion disposed to be parallel with at least a first side of an outermost edge of a central structure and a second side adjacent to the f... | 02/09/2012 |
| 20120032317 | Self-Aligning Structures and Method for Integrated Chips A lead frame having a die thereon connects a conductive area on the die to a lead frame contact using a conductive clip that includes a structural portion that is received with a recess-like “tub” formed in the lead frame contact. The end of the clip received in the... | 02/09/2012 |
| 20120032315 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having a single integral structure with a paddle central portion surrounded by a paddle peripheral portion; forming a terminal adjacent the package paddle; mounting an... | 02/09/2012 |
| 20120025361 | SEMICONDUCTOR DEVICE, LEAD FRAME ASSEMBLY, AND METHOD FOR FABRICATING THE SAME A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the le... | 02/02/2012 |
| 20120025210 | OPTICAL MODULE ENCLOSING LEAD FRAME AND SEMICONDUCTOR OPTICAL DEVICE MOUNTED ON THE LEAD FRAME WITH TRANSPARAENT MOLD RESIN An optical module with a new arrangement is disclosed. The optical module molds devices with a resin transparent to light subject to the device mounted on the lead frame and electrically connected with the lead frame by the bonding wire. The lead frame provides a screen... | 02/02/2012 |
| 20120025358 | SEMICONDUCTOR ELEMENT WITH SEMICONDUCTOR DIE AND LEAD FRAMES A semiconductor element to be mounted on a circuit carrier includes a semiconductor die and at least one lead frame. In order to reduce the size required for mounting a semiconductor die on a circuit carrier, a semiconductor element includes a semiconductor die and at l... | 02/02/2012 |
| 20120025360 | SEMICONDUCTOR ENCAPSULATION AND METHOD THEREOF A semiconductor encapsulation comprises a lead frame further comprising a chip carrier and a plurality of pins in adjacent to the chip carrier. A plurality of grooves opened from an upper surface of the chip carrier partially dividing the chip carrier into a plurality o... | 02/02/2012 |
| 20120018867 | SUBSTRATE FOR SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE Provided is a manufacturing method of a semiconductor element substrate including: a step of forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal,... | 01/26/2012 |
| 20120018864 | BONDING STRUCTURE AND METHOD A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform.... | 01/26/2012 |
| 20120018865 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISLAND TERMINALS AND EMBEDDED PADDLE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having an upper structure, upper protrusions, and a base side facing away from the upper structure and the upper protrusions; forming tie bars in the leadframe with an open... | 01/26/2012 |
| 20120018863 | MICROELECTRONIC ELEMENTS WITH REAR CONTACTS CONNECTED WITH VIA FIRST OR VIA MIDDLE STRUCTURES A microelectronic unit includes a microelectronic element, e.g., an integrated circuit chip, having a semiconductor region of monocrystalline form. The semiconductor region has a front surface extending in a first direction, an active circuit element adjacent the front ... | 01/26/2012 |
| 20120018866 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISLAND TERMINALS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a package paddle having an upper hole below a paddle top side, the upper hole bounded by an upper non-horizontal side with a curve surface; forming a terminal adjacent the package padd... | 01/26/2012 |
| 20120012992 | SEMICONDUCTOR DEVICE A semiconductor device having an improved whisker resistance in an exterior plating film is disclosed. The semiconductor device includes a tab with a semiconductor chip fixed thereto, plural inner leads, plural outer leads formed integrally with the inner leads, a plura... | 01/19/2012 |
| 20120012993 | DIE PACKAGE INCLUDING SUBSTRATE WITH MOLDED DEVICE A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second ... | 01/19/2012 |
| 20120007225 | SEMICONDUCTOR DEVICE In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger... | 01/12/2012 |
| 20120007224 | SEMICONDUCTOR DEVICE In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger... | 01/12/2012 |
| 20120007216 | Multi-Chip Package Module And A Doped Polysilicon Trench For Isolation And Connection A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bot... | 01/12/2012 |
| 20120001310 | PACKAGE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE A package for a semiconductor device according to the present invention includes at least one through hole 6 provided on at least one of lead frames 1 and 2. Thus when resin is injected to form a mounting region 4 of a semiconductor element w... | 01/05/2012 |
