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| Application No. | Application Title | Issue Date |
| 20090096503 | SEMICONDUCTOR DEVICE COMPRISING A HOUSING CONTAINING A TRIGGERING UNIT A housing for a semiconductor device is disclosed. In an exemplary embodiment of the present invention, the housing comprises a semiconductor substrate that is arranged between two contact elements, one contact element forming an anode contact element and another contac... | 04/16/2009 |
| 20070228413 | SEMICONDUCTOR MODULE A semiconductor module having a current connection element designed for a high current carrying capability is disclosed. In one embodiment, the current connection element includes a plurality of metal layers which rest directly on one another. ... | 10/04/2007 |
| 20070131966 | Programmable memory cell in an integrated circuit chip A memory cell for reducing the cost and complexity of modifying a revision identifier (ID) or default register values associated with an integrated circuit (IC) chip, and a method for manufacturing the same. The cell, which may be termed a “Meta-Memory Cell” (MMCEL)... | 06/14/2007 |
| 20070040186 | Power semiconductor packaging method and structure A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has one o... | 02/22/2007 |
| 20060284211 | POWER SEMICONDUCTOR MODULE The power semiconductor module includes a module package housing power semiconductor devices therein and a magnetic core set around the module package, such that magnetic core surrounds the power semiconductor devices such as IGBTs. Alternatively, the magnetic core is b... | 12/21/2006 |
| 20060175630 | Electronic power module comprising a rubber seal and corresponding production method An aim of an embodiment is to reduce the volume of power modules, especially for electronic motor control devices. An area is formed between cooling elements with the aid of an annular shaped rubber seal. A semi-conductor device is sealed with a sealing compound therein... | 08/10/2006 |
| 20060043414 | RECTIFICATION CHIP TERMINAL STRUCTURE A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit b... | 03/02/2006 |
| 20050167696 | Silicon nitride insulating substrate for power semiconductor module An aspect of the present invention provides a power module for automotive switching applications including a plurality of semiconductor chips and a unitary silicon nitride substrate. The plurality of semiconductor chips are attached to the silicon nitride substrate and ... | 08/04/2005 |
| 20050012112 | Semiconductor device wiring structure A semiconductor device wiring structure is provided to reduce the wiring inductance and curtail the generation of interfering electromagnetic waves. A semiconductor chip having an anode electrode and a cathode electrode provided on two oppositely-facing main surfaces is... | 01/20/2005 |
