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| Application No. | Application Title | Issue Date |
| 20110272452 | SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS USING MULTIPLE SOLDER WIRES An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate ... | 11/10/2011 |
| 20110180311 | SOLDER, ELECTRONIC PART, AND METHOD OF FABRICATING ELECTRONIC PART A solder material with favorable mechanical properties and high corrosion resistance is provided. The solder material is not apt to be melted in a re-heating process after the soldering process is performed. The solder material includes first solder powder, Cu powder, a... | 07/28/2011 |
| 20110132451 | SOLDER SUPPORTING LOCATION FOR SOLAR MODULES AND SEMICONDUCTOR DEVICE A soldered connection between an outer surface of a semiconductor device, connected to a substrate by means of an adhesive layer, and a connector in the form of a strip. In order that tensile forces acting on the connector do not cause the semiconductor device to become... | 06/09/2011 |
| 20110127080 | Electronic Assemblies without Solder and Methods for their Manufacture The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads ... | 06/02/2011 |
| 20110121059 | ELECTRICAL BOND CONNECTION SYSTEM An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At lea... | 05/26/2011 |
| 20100252311 | TERMINAL ASSEMBLY WITH REGIONS OF DIFFERING SOLDERABILITY An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed t... | 10/07/2010 |
| 20090134205 | Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus A soldering method for soldering an electronic component to a circuit board is disclosed. The soldering method includes placing the electronic component on the bonding portion of the circuit board with solder arranged between the electronic component and the bonding por... | 05/28/2009 |
| 20080277151 | Electronic Assemblies without Solder and Methods for their Manufacture The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads ... | 11/13/2008 |
| 20080261350 | SOLDER INTERCONNECTION ARRAY WITH OPTIMAL MECHANICAL INTEGRITY A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-me... | 10/23/2008 |
| 20080244900 | Flux for Soldering and Soldering Process There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a ... | 10/09/2008 |
| 20080217384 | ELLIPTIC C4 WITH OPTIMAL ORIENTATION FOR ENHANCED RELIABILITY IN ELECTRONIC PACKAGES An arrangement for the equipping of electronic packages with elliptical C4 connects possessing optimal orientation for enhanced reliability. Furthermore, disclosed is a method providing elliptical C4 connects which possesses optimal orientation for enhanced reliability,... | 09/11/2008 |
