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| Application No. | Application Title | Issue Date |
| 20120223066 | THERMAL PROCESSING APPARATUS AND METHOD OF CONTROLLING THE SAME A control unit can select a large-number control zone model in which the number of control zones, which are independently controlled, is large, and a small-number control zone model in which the number of control zones, which are independently controlled, is small. When... | 09/06/2012 |
| 20100252547 | SYSTEM AND METHOD FOR REDUCING OBJECT DEFORMATION DURING A PULSED HEATING PROCESS An approach for optimizing the thermal budget during a pulsed heating process is disclosed. A heat sink or thermal transfer plate is configured and positioned near an object, such as a semiconductor wafer, undergoing thermal treatment. The heat sink is configured to enh... | 10/07/2010 |
| 20100240224 | MULTI-ZONE SEMICONDUCTOR FURNACE A semiconductor furnace suitable for chemical vapor deposition processing of wafers. The furnace includes a thermal reaction chamber having a top, a bottom, a sidewall, and an internal cavity for removably holding a batch of vertically stacked wafers. A heating system i... | 09/23/2010 |
| 20100089903 | Cooking Appliance A cooking appliance, in particular, a cooking appliance which is mounted in an elevated manner, comprising a muffle which defines a cooking chamber and electric and/or electronic components which are arranged inside the door. The electric connection elements are formed ... | 04/15/2010 |
| 20100065546 | Cooking Appliance A cooking appliance, in particular, a cooking appliance which is mounted in an elevated manner, which comprises at least one muffle which defines a cooking chamber and which comprises a muffle opening, a door which is used to close the muffle opening and a drive device ... | 03/18/2010 |
| 20090302024 | Heat Processing Method and Heat Processing Apparatus The present invention is a heat processing method comprising: a placement step in which an object to be processed is placed on a stage disposed in a processing vessel whose inside atmosphere is capable of being discharged; and a heat processing step that is performed af... | 12/10/2009 |
| 20090250450 | Device for making a muffle A device for making a muffle, with which dental restoration parts can be produced with the aid of an embedding compound, at least one press blank and a pressing device, the device having a muffle base, a tubular sleeve surrounding the muffle base and at least one muffle... | 10/08/2009 |
| 20090188906 | HIGH-TEMPERATURE TUBE FURNACE FOR PYROLYSIS A high-temperature tube furnace for pyrolysis includes a twin-hole ceramic tube including a pyrolysis capillary concentrically arranged within a sintering heat tube which is concentrically arranged within a thermally insulated tube housing. At least one heating tube hol... | 07/30/2009 |
| 20090159585 | Cooking Appliance which is Mounted in an Elevated Manner A cooking appliance which is mounted in an elevated manner, comprising at least one muffle which defines a cooking chamber and which comprises a muffle opening on the base side thereof, a base door, which can be displaced, for closing the muffle opening and which compri... | 06/25/2009 |
| 20090159584 | Cooking Appliance which is Mounted in an Elevated Manner A cooking appliance which is mounted in an elevated manner, which comprises at least one muffle which defines a cooking chamber and which comprises a muffle opening which is on the base thereof, a base door which can be displaced and which is used to close the muffle op... | 06/25/2009 |
| 20090060480 | METHOD AND SYSTEM FOR CONTROLLING BAKE PLATE TEMPERATURE IN A SEMICONDUCTOR PROCESSING CHAMBER A method of operating a bake plate disposed in a semiconductor processing chamber having a face plate opposing the bake plate includes providing a temperature control signal to the bake plate and measuring a face plate temperature associated with the face plate. The met... | 03/05/2009 |
| 20090014428 | Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and extending member A heating apparatus comprises heating elements arranged of a sheet form and having notches or through holes provided therein, a side wall member made of an electrically conductive material and arranged to surround and define the heating space, and holding members dispos... | 01/15/2009 |
| 20080237211 | Dental firing furnace The present invention relates to a dental firing furnace having a firing space and at least one carrier for dental material, in particular a muffle, which can be loaded into the firing space, and, in particular, a pressing device for pressing a ceramic blank inserted in... | 10/02/2008 |
| 20080230534 | BAKE PLATE LID CLEANER AND CLEANING METHOD A method and system for positioning a wafer on a bake plate in a processing module that includes lowering a bake plate cover assembly over the wafer during a baking process, raising the bake plate cover assembly after the baking process, removing the wafer, determining ... | 09/25/2008 |
| 20080190910 | Heat Treatment Apparatus and Method of Manufacturing Substrates A heat treatment apparatus wherein a nozzle is accurately provided on an adaptor to prevent the nozzle from interfering with other part items and a possibility of breakage due to heat expansion of the nozzle can be reduced. The heat treatment apparatus (10) is pr... | 08/14/2008 |
| 20080185371 | FLUID WARMER A heat exchange apparatus including a heat exchanging portion capable of conforming to the outer surface of a heat exchange target.... | 08/07/2008 |
| 20080083727 | Heater assembly A heater is disclosed. The comprises a housing; a reflector; and a pair of opposite connectors supported by the reflector and configured to support opposite ends of a heating element. The reflector is movable between a plurality of positions relative to the housing.... | 04/10/2008 |
| 20080017628 | Multizone heater for furnace The present invention relates to an apparatus and method for heating a semiconductor processing chamber. One embodiment of the present invention provides a furnace for heating a semiconductor processing chamber. The furnace comprises a heater surrounding side walls of t... | 01/24/2008 |
| 20080011734 | HEAT-TREATING APPARATUS A processing gas is prevented from entering into a space below a placement table. A supporting surface 62 for supporting the lower face of a placement table 58 is provided at an inner circumferential portion of the upper end of a support 56. A circu... | 01/17/2008 |
| 20080006617 | THERMAL WAFER PROCESSOR A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holding p... | 01/10/2008 |
| 20070289961 | Device for firing ceramic dental prostheses A heating muffle for a muffle kiln for the production of a dental ceramic product containing titanium, which comprises a hollow unit, which is provided with at least one opening for the uptake of the ceramic product and has heatable inner walls, and which can form toget... | 12/20/2007 |
| 20070272674 | ABRASIVE BRUSH RECOVERY SYSTEM AND PROCESS One embodiment of the disclosure is a method for changing a cutting ability of an abrasive device. The method includes abrading a portion of an abrasive device, thereby reducing a cutting ability of the abrasive device. Moreover, the method includes heating the abrasive... | 11/29/2007 |
| 20070251935 | VACUUM THERMAL ANNEALER A vacuum thermal annealing device is provided having temperature control for use with various materials, such as semiconductor substrates. A vacuum is used to remove air and outgas residual materials. Heated gas is injected planar to a substrate as pressure is quickly r... | 11/01/2007 |
| 20070194001 | Substrate Heat Treatment Apparatus And Substrate Transfer Tray Used In Substrate Heat Treatment [PROBLEMS] To provide a substrate heat treatment apparatus that can suppress generation of the surface roughening of a substrate to which heat treatment is performed. [MEANS FOR SOLVING PROBLEMS] The substrate heat treatment apparatus is provided with a heating means fo... | 08/23/2007 |
| 20070181556 | Capacitor and manufacturing method thereof Atmosphere in processing apparatus is adjusted to, for example, oxygen atmosphere, by gas supply source and the like. Interior of thermal processing apparatus is set to oxygen atmosphere and raised to predetermined temperature. A wafer boat containing wafer W having die... | 08/09/2007 |
| 20070095812 | In-situ wafer parameter measurement method employing a hot susceptor as a reflected light source A semiconductor wafer temperature measurement method takes advantage of the tight control of the surface conditions and temperature of a hot susceptor, which tight control provides known and reproducible radiation emissions from the hot susceptor. The known amount of ra... | 05/03/2007 |
| 20070084848 | HEAT TREATING APPARATUS AND METHOD A heat treating apparatus includes halogen lamps for preheating a semiconductor wafer to 400 to 600 degC., and xenon flash lamps for heating the substrate preheated by the halogen lamps, to 1,000 to 1,100 degC. in about 0.1 to 10 milliseconds by irradiating the wafer wi... | 04/19/2007 |
| 20070084847 | Stage, substrate processing apparatus, plasma processing apparatus, control method for stage, control method for plasma processing apparatus, and storage media A stage onto which is electrostatically attracted a substrate to be processed in a substrate processing apparatus, which enables the semiconductor device yield to be improved. A temperature measuring apparatus 200 measures a temperature of the substrate to be pro... | 04/19/2007 |
| 20070029304 | Oven for dental prostheses or partial dental prostheses The invention relates to a stove for producing denture and or the parts thereof comprising a combustion chamber and a heating device which is arranged therein and provided with a heating spiral consisting of an appropriate resistance wire and a support for the heating s... | 02/08/2007 |
| 20070029305 | Magnetic field reduction resistive heating elements Heating element assemblies, heating furnaces incorporating heating element assemblies, methods to form heating element assemblies, methods to form heating furnaces and methods to reduce a magnetic field in a bifilar coil are disclosed. The heating element assembly inclu... | 02/08/2007 |
| 20070012679 | PRINTER TO RADIATE FAR-INFRARED RAYS A well-being printer to radiate far-infrared rays, the printer including a printer frame, and part or an entire area of the printer frame contains far-infrared ray radiating material. The far-infrared ray radiating material may be active carbon, and the active carbon ma... | 01/18/2007 |
| 20060289432 | Substrate heat treatment apparatus A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between ... | 12/28/2006 |
| 20060289434 | Apparatus and method for reducing stray light in substrate processing chambers A method and apparatus for heating semiconductor wafers in thermal processing chambers is disclosed. The apparatus includes a non-contact temperature measurement system that utilizes radiation sensing devices, such as pyrometers, to determine the temperature of the wafe... | 12/28/2006 |
| 20060289433 | Optimizing the thermal budget during a pulsed heating process An approach for optimizing the thermal budget during a pulsed heating process is disclosed. A heat sink or thermal transfer plate is configured and positioned near an object, such as a semiconductor wafer, undergoing thermal treatment. The heat sink is configured to enh... | 12/28/2006 |
| 20060289431 | Substrate processing method and manufacturing method of semiconductor device According to an aspect of the invention, there is provided a single substrate processing method which continuously heats substrates to be processed to which films containing solvents are applied, by use of a heating apparatus having an opening/closing mechanism, includi... | 12/28/2006 |
| 20060249501 | Oven for controlled heating of compounds at varying temperatures An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assembly ... | 11/09/2006 |
| 20060249502 | Distance estimation apparatus, abnormality detection apparatus, temperature regulator, and thermal treatment apparatus The invention is configured such that a distance estimation device estimates a distance between a hot plate as an object to be treated and a work, with respect to which the work is placed to be thermally treated, based upon information on temperature of the hot plate su... | 11/09/2006 |
| 20060219692 | Pointer for interactive display system There is disclosed a pointing device for use with an interactive surface, the pointing device comprising a coil for producing an electromagnetic field which couples into the interactive surface, the pointing device being arranged, in use, to be attached to a finger. ... | 10/05/2006 |
| 20060201927 | Heating device for heating semiconductor wafers in thermal processing chambers An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. The light energy sources can be placed in various configurations. In acco... | 09/14/2006 |
| 20060175316 | Vacuum muffle quench furnace A vacuum furnace adapted to cool a load. The vacuum furnace has one or more means for cooling a fluid and a muffle substantially containing the load. The fluid flows in a substantially unidirectional flow substantially within the muffle. ... | 08/10/2006 |
