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| Application No. | Application Title | Issue Date |
| 20110186555 | SYSTEM FOR SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam that p... | 08/04/2011 |
| 20110139756 | DEVICE FOR STRUCTURING A SOLAR MODULE A device for structuring a solar module. A retainer device arranged above the solar modules to be machined comprises retainer means which retain the solar modules. The retention is achieved in a non-contact manner. In a region beneath the solar module a structuring tool... | 06/16/2011 |
| 20100264123 | Annealing apparatus using two wavelengths of continuous wave laser radiation A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the waf... | 10/21/2010 |
| 20100237051 | METHOD AND SYSTEM FOR LASER PROCESSING TARGETS OF DIFFERENT TYPES ON A WORKPIECE A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based ... | 09/23/2010 |
| 20100147812 | Method For Producing A Hole There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration b... | 06/17/2010 |
| 20100147811 | APPARATUS FOR LASER SCRIBING OF DIELECTRIC-COATED SEMICONDUCTOR WAFERS A groove pattern is scribed into a silicon-nitride layer on a silicon wafer using four independently scanned, focused beams of laser radiation. Each focused beam is scannable within one of four scan-field positions on a turntable. The wafer is transported incrementally ... | 06/17/2010 |
| 20100126642 | PROCESS AND APPARATUS FOR HARDENING THE SURFACE LAYER OF COMPONENTS HAVING A COMPLICATED SHAPE The invention relates to the hardening of the surface layer of parts of machines, plants and apparatuses and also tools. Objects for which the application is possible and advantageous are components which are subjected to severe fatigue or wear stresses and are composed... | 05/27/2010 |
| 20100089881 | SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS DELIVERING MULTIPLE BLOWS Methods and systems process a semiconductor substrate having a plurality of structures to be selectively irradiated with multiple laser beams. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The me... | 04/15/2010 |
| 20100084662 | SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS OVERLAPPING LENGTHWISE ON A STRUCTURE Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser... | 04/08/2010 |
| 20100072183 | Apparatus for cutting substrate An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser b... | 03/25/2010 |
| 20100032416 | Laser Processing Method and Processing Apparatus Based on Conventional Laser-Induced Material Changes The present invention relates to a technique that remarkably increases the processing speed of a conventional ultra-fast laser micro process having a very high processing accuracy. According to the present invention, a laser processing method based on transient changes ... | 02/11/2010 |
| 20100006549 | DEVICE FOR PROCESSING MATERIALS BY LASER BEAM Disclosed is a laser processing device for processing a surface of an object with laser beams. The laser processing device includes: a laser beam generating unit for projecting laser beams; and a micromirror device having a plurality of micromirrors, the micromirrors be... | 01/14/2010 |
| 20090283506 | Laser processing apparatus A laser processing apparatus is provided with a first laser oscillator for laser CVD and a second laser oscillator for laser repair in a laser oscillation section. Either one of the first or second laser beam is irradiated by switching the first and second laser oscilla... | 11/19/2009 |
| 20090255911 | LASER SCRIBING PLATFORM AND HYBRID WRITING STRATEGY Laser scribing can be performed on a workpiece (104) such as substrates with layers formed thereon for use in a solar panel without need to rotate the workpiece (104) during the scribing process. A series of lasers (602, 622) can be used to concurre... | 10/15/2009 |
| 20090200279 | AUTOMATIC FOCUS AND EMISSIVITY MEASUREMENTS FOR A SUBSTRATE SYSTEM An apparatus for thermally processing a substrate includes a first radiation source configured to heat a substrate and emit radiation at a heating wavelength, focusing optics configured to direct radiation from the first radiation source to the substrate, and a second r... | 08/13/2009 |
| 20090195934 | DEVICE AND METHOD FOR MANUFACTURING SPRING MEMBER A spring member manufacturing device that manufactures the spring member by laser irradiation includes a laser irradiation unit including a plurality of laser irradiation devices that perform predetermined laser irradiation with respect to the spring member. In the spri... | 08/06/2009 |
| 20090188901 | Laser Material Processing System A laser material processing system and method are provided. A further aspect of the present invention employs a laser for micromachining. In another aspect of the present invention, the system uses a hollow waveguide. In another aspect of the present invention, a laser ... | 07/30/2009 |
| 20090173893 | Semiconductor device and its manufacturing method It is an object of the present invention to provide laser irradiation apparatus and method which can decrease the proportion of the microcrystal region in the whole irradiated region and can irradiate a semiconductor film homogeneously with a laser beam. A low-intensity... | 07/09/2009 |
| 20090120915 | METHOD FOR MAKING AIRTIGHT CONTAINER A laser beam emitted from a laser oscillator unit passes through a first substrate and irradiates a sealing member. The sealing member irradiated with the laser beam is heated in accordance with the absorptance and thus softens and melts. The laser beam is reflected by ... | 05/14/2009 |
| 20090045181 | SYSTEMS AND METHODS FOR PROCESSING THIN FILMS The present disclosure is directed to methods and systems for processing a thin film samples. In an exemplary method, semiconductor thin films are loaded onto two different loading fixtures, laser beam pulses generated by a laser source system are split into first laser... | 02/19/2009 |
| 20080296275 | LASER BEAM MACHINING APPARATUS A laser beam machining apparatus including a laser beam irradiation unit, the laser beam irradiation unit including: a laser beam oscillator for oscillating a laser beam; a beam splitter by which the laser beam oscillated by the laser beam oscillator is split into a fir... | 12/04/2008 |
| 20080251504 | LASER-WELDING APPARATUS AND METHOD A laser-welding apparatus may include a laser source, an incoming laser beam produced by the laser source, and a beam splitter that splits the incoming laser beam to form a leading beam and a trailing beam. A first focusing lens may focus the leading beam and a second f... | 10/16/2008 |
| 20080210671 | Fast axis beam profile shaping by collimation lenslets for high power laser diode based annealing system A dynamic surface anneal apparatus for annealing a semiconductor workpiece has a workpiece support for supporting a workpiece, an optical source and scanning apparatus for scanning the optical source and the workpiece support relative to one another along a fast axis. T... | 09/04/2008 |
| 20080185367 | METHOD AND SYSTEM OF MACHINING USING A BEAM OF PHOTONS Some embodiments include methods, and systems of machining using a beam of photons. In some embodiments, a machining method to remove material in a machined region may include reducing transparency of the region to at least a predefined wavelength by irradiating the reg... | 08/07/2008 |
| 20080121627 | Methods and systems for semiconductor structure processing using multiple laser beam spots Methods and systems selectively irradiate structures on or within a semiconductor substrate using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links.... | 05/29/2008 |
| 20080083715 | Reverse side film laser circuit etching A direct-write laser lithography system comprises a reel-to-reel feed system in a vacuum chamber that presents the clear film-side of a single-sided metal-clad tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by rotat... | 04/10/2008 |
| 20080029499 | Laser processing method and laser processing apparatus The present invention relates to a method and apparatus having a structure that enables laser processing of an object even when the object has a surface formed with irregularities. The laser processing method irradiates objects, each having a cylindrical form extending ... | 02/07/2008 |
| 20080011725 | Laser beam processing machine A laser beam processing machine comprising a chuck table, a laser beam application means for applying a laser beam to a workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other ... | 01/17/2008 |
| 20070284346 | METHOD FOR MANUFACTURING POLARIZER AND LASER PROCESSING APPARATUS FOR MANUFACTURING THE POLARIZER A method for manufacturing a polarizer includes forming a conductive thin film layer on a first surface of a substrate. The conductive thin film layer corresponding to a processing line is partially removed by a treatment laser beam irradiated along the processing line.... | 12/13/2007 |
| 20070221640 | APPARATUS FOR THERMAL PROCESSING STRUCTURES FORMED ON A SUBSTRATE The present invention generally describes one ore more apparatuses and various methods that are used to perform an annealing process on desired regions of a substrate. In one embodiment, an amount of energy is delivered to the surface of the substrate to preferentially ... | 09/27/2007 |
| 20070158318 | LASER HARDENING TOOL The invention provides a laser hardening tool having little laser output loss. The laser hardening tool 100 condenses the irradiated beams LB1 from a semiconductor laser stack 120 via a condensing optical lens 134, and creates parallel li... | 07/12/2007 |
