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| Application No. | Application Title | Issue Date |
| 20120024832 | Method and apparatus for the thermal treatment of a workpiece by means of a laser beam In the thermal cutting of a workpiece by means of a laser beam, said beam is generated by means of a laser source and supplied to a movable laser head. In the laser head, an optical deflection element is provided for deflecting the laser beam such that, when viewed in w... | 02/02/2012 |
| 20110186555 | SYSTEM FOR SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam that p... | 08/04/2011 |
| 20110186110 | THIN-FILM SOLAR CELL SYSTEM AND METHOD OF APPARATUS FOR MANUFACTURING A THIN-FILM SOLAR CELL A method for manufacturing a thin-film solar cell includes providing a first conducting layer on a substrate that has an area at least 0.75 m2. The first conducting layer is located in a deposition portion of the area. An ultraviolet laser beam is applied through a lens... | 08/04/2011 |
| 20110095007 | THERMAL FLUX PROCESSING BY SCANNING A FOCUSED LINE BEAM The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate the... | 04/28/2011 |
| 20110084050 | LASER PROCESSING APPARATUS A laser processing apparatus including a laser applying unit. The laser applying unit includes a first laser oscillating unit, a second laser oscillating unit, a first laser branching unit for branching a laser beam oscillated from the first laser oscillating unit into ... | 04/14/2011 |
| 20110062128 | Multiple laser beam focusing head An apparatus that divides a single laser beam into two or more beams that can be directed at an object, such as a work piece, to perform laser heat treatment is disclosed. An adapter stage is in optical communication with a light source, such as a laser source, and arra... | 03/17/2011 |
| 20110008973 | LASER ANNEALING METHOD AND APPARATUS In the case of a lens array type homogenizer optical system, the incident angle and intensity of a laser beam 1 entering a large-sized lens (long-axis condenser lens 22) of a long-axis condensing optical system, which is provided on the rear side, are chan... | 01/13/2011 |
| 20100304506 | LASER IRRADIATION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME The present invention is to provide a laser irradiation method for performing homogeneous laser irradiation to the irradiation object even when the thickness of the irradiation object is not even. In the case of irradiating the irradiation object having uneven thickness... | 12/02/2010 |
| 20100294749 | LASER BEAM MACHINING A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpi... | 11/25/2010 |
| 20100219171 | Laser Processing System and laser Processing Method A laser processing system and a laser processing method that can highly accurately and efficiently specify a focus position of a processing laser using visible lasers are provided. For that purpose, a laser processing system includes a processing laser oscillator, a con... | 09/02/2010 |
| 20100193484 | MULTIPLE BEAM LASER SYSTEM FOR FORMING STENTS A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each s... | 08/05/2010 |
| 20100181295 | METHOD AND DEVICE FOR REMOVING SOLDER MATERIAL DEPOSITS FROM A SUBSTRATE The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material dep... | 07/22/2010 |
| 20100176100 | LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on th... | 07/15/2010 |
| 20100163536 | Substrate treatment device and method and encoder scale treated by this method The invention provides a substrate treatment method and apparatus. Embodiments show a substrate in the form of a rotary encoder ring having a pattern of marks producable by means of a laser treatment device controllable to produce the pattern in the correct manner whils... | 07/01/2010 |
| 20100147812 | Method For Producing A Hole There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration b... | 06/17/2010 |
| 20100089881 | SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS DELIVERING MULTIPLE BLOWS Methods and systems process a semiconductor substrate having a plurality of structures to be selectively irradiated with multiple laser beams. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The me... | 04/15/2010 |
| 20100089886 | LASER MACHINING SYSTEMS AND METHODS WITH VISION CORRECTION AND/OR TRACKING Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particul... | 04/15/2010 |
| 20100072183 | Apparatus for cutting substrate An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser b... | 03/25/2010 |
| 20100065536 | Micro Laser Assisted Machining A method and apparatus (1) for machining a semiconductor or ceramic workpiece (32) causes a portion of the workpiece to undergo high pressure phase transformation to form a high pressure phase transformation portion which has altered optical properties fro... | 03/18/2010 |
| 20100025386 | LASER PROCESSING DEVICE The time required for forming a modified region within an object to be processed is shortened. An apparatus 100 comprises a mount table 107, a light source 101 for emitting linearly polarized laser light L, a light source 41 for emitting lase... | 02/04/2010 |
| 20100006548 | LASER WORKING METHOD A converging point of processing laser light is made to accurately follow a laser light irradiation surface of an object to be processed. An object to be processed 1 is irradiated with measuring laser light along a line to cut 5, astigmatism is added to a ... | 01/14/2010 |
| 20090308853 | ELIMINATING HEAD-TO-HEAD OFFSETS ALONG COMMON CHUCK TRAVEL DIRECTION IN MULTI-HEAD LASER MACHINING SYSTEMS The embodiments disclosed herein provide systems and methods for correcting a head-to-head offset in a laser machining system with two or more processing heads. A focusing lens is associated with each processing head, and is configured to receive an incident laser beam ... | 12/17/2009 |
| 20090223941 | PHASE SHIFTER FOR LASER ANNEALING An object of the present invention is to provide a phase shifter for laser annealing which is capable of effectively preventing the sticking of particles. A first layer and a third layer are made of quartz glass, and a two-dimensional pattern of fine grooves is formed i... | 09/10/2009 |
| 20090194517 | LASER CUTTING DEVICE An exemplary laser cutting device (300) includes a laser source (40), a lens module (51), a sprayer (60), a first rotating subassembly (52), and a second rotating subassembly (53). The lens module is configured for focusing a la... | 08/06/2009 |
| 20090194514 | LASER CUTTING DEVICE WITH HIGH PRECISION An exemplary laser cutting device (300) includes a laser source (40), a lens module (51), a sprayer (60), a rotating subassembly (52), and a driving member (55). The lens module is configured for focusing a laser beam emitting f... | 08/06/2009 |
| 20090188900 | METHOD OF CUTTING MATERIAL FOR USE IN IMPLANTABLE MEDICAL DEVICE A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material acc... | 07/30/2009 |
| 20090173724 | PRODUCT LASER IRRADIATION DEVICE, LASER IRRADIATION METHOD AND METHOD FOR MANUFACTURING MODIFIED OBJECT Provided are a laser irradiation device and a laser irradiation method, which are suitable for a liquid crystal display device. The laser irradiation device comprises a semiconductor laser element group (1A) having a plurality of semiconductor laser elements (... | 07/09/2009 |
| 20090107585 | Method for Production and Apparatus for Production of Grain-Oriented Electrical Steel Sheet Excellent in Magnetic Properties Technology scanning and irradiating grain-oriented electrical steel sheet moving in a rolling direction at a speed Vl with an elliptical spot formed by a laser beam in the width direction at Vc to improve the core loss of the grain-oriented electrical steel sheet, which... | 04/30/2009 |
| 20090071947 | LASER BEAM MACHINE There is disclosed a laser beam machine including: a light source that emits a laser beam; an aperture in a flat plate shape and arranged in a manner crossing an optical axis direction of a laser beam from the light source, and having an opening to pass a laser beam fro... | 03/19/2009 |
| 20090032511 | Apparatus and method of improving beam shaping and beam homogenization The present invention generally relates to an optical system that is able to reliably deliver a uniform amount of energy across an anneal region contained on a surface of a substrate. The optical system is adapted to deliver, or project, a uniform amount of energy havin... | 02/05/2009 |
| 20080296275 | LASER BEAM MACHINING APPARATUS A laser beam machining apparatus including a laser beam irradiation unit, the laser beam irradiation unit including: a laser beam oscillator for oscillating a laser beam; a beam splitter by which the laser beam oscillated by the laser beam oscillator is split into a fir... | 12/04/2008 |
| 20080268571 | Apparatus for heating chip, flip chip bonder having the apparatus, and method for bonding flip chip using the same An apparatus for heating a chip includes: a laser generator for emitting a laser beam to a semiconductor chip to heat the semiconductor chip; and a beam intensity adjuster disposed on a laser emission path between the semiconductor chip and the laser generator to equali... | 10/30/2008 |
| 20080251504 | LASER-WELDING APPARATUS AND METHOD A laser-welding apparatus may include a laser source, an incoming laser beam produced by the laser source, and a beam splitter that splits the incoming laser beam to form a leading beam and a trailing beam. A first focusing lens may focus the leading beam and a second f... | 10/16/2008 |
| 20080245779 | LASER PROCESSING MACHINE A laser processing machine that includes a chuck table adapted to hold a workpiece thereon and laser beam irradiation unit for applying a laser beam to the workpiece held on the chuck table. The laser beam irradiation unit includes: a laser beam oscillation section for ... | 10/09/2008 |
| 20080242056 | SYSTEM AND METHOD FOR CUTTING USING A VARIABLE ASTIGMATIC FOCAL BEAM SPOT A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The... | 10/02/2008 |
| 20080217310 | METHOD FOR PROFILING THE PERIMETER BORDER OF A SEMICONDUCTOR WAFER A method for profiling the perimeter border of a semiconductor chip, characterized by the following steps: the semiconductor chip is supported near to the perimeter border on supporting points which are spaced apart in the perimeter direction of the semiconductor chip, ... | 09/11/2008 |
| 20080169275 | Hybrid Laser Processing Apparatus A hybrid laser processing apparatus 1 includes a laser oscillator 4 which oscillates a laser beam L, a high-pressure pump 5 which supplies liquid, wherein liquid supplied from the high-pressure pump 5 is injected from an injection nozzle 1... | 07/17/2008 |
| 20080116183 | Light Scanning Mechanism For Scan Displacement Invariant Laser Ablation Apparatus A scanning/laser ablation apparatus includes an orbiting objective mounted on a radial arm that is rotated around a central axis such that the objective travels along a circular scan path. An input laser beam is directed along the central axis to a first mirror, which r... | 05/22/2008 |
| 20080116182 | Multiple Station Scan Displacement Invariant Laser Ablation Apparatus A laser scanning mechanism and multiple processing stations are circumferentially disposed around a central axis. The laser scanning mechanism includes a rotating member driven by a motor to rotate around the central axis, and an optical system fixedly mounted on the ro... | 05/22/2008 |
| 20080110869 | Method of machining mold surface using laser A method of machining a mold surface using laser includes the steps of preparing a laser device and an optical zoom lens assembly disposed in front of the laser device; using a computer to compute a sectional curvature of the mold surface to be machined, so as to obtain... | 05/15/2008 |
