Quotables
"It is my heart-warmed and world-embracing Christmas hope and aspiration that all of us, the high, the low, the rich, the poor, the admired, the despised, the loved, the hated, the civilized, the savage (every man and brother of us all throughout the whole earth), may eventually be gathered together in a heaven of everlasting rest and peace and bliss, except the inventor of the telephone. "
Mark Twain ; Christmas greetings, 1890
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| Application No. | Application Title | Issue Date |
| 20120125902 | ABSORBING METHOD AND APPARATUS FOR REAR SIDE LASER PROCESS An absorbing method and apparatus for rear side laser process is disclosed. A conductive plate contacts or separates above a flexible substrate which is deposited a conductive film therebelow. A power source electrically connects the conductive plate and the conductive ... | 05/24/2012 |
| 20120125169 | SEMICONDUCTOR LIGHT-EMITTING DEVICE MEASUREMENT APPARATUS A movable stage on which an LED chip is placed is moved in horizontal directions (for example, the x-axis direction and the y-axis direction) under the control of a position adjusting section. A probe needle is brought into contact with a bonding electrode on the surfac... | 05/24/2012 |
| 20120125901 | APPARATUS AND SYSTEM FOR IMPROVING DEPTH OF FOCUS The present invention provides an apparatus and a system for improving depth of focus (DOF), wherein an optical lens for optical processing is actuated to vibrate whereby the DOF of the optical processing is increased due to the variation of focal point. In the embodime... | 05/24/2012 |
| 20120103951 | CONTROL APPARATUS AND LASER PROCESSING MACHINE A control apparatus for controlling a laser processing machine, includes: a HDD as data storing means for storing shape data on a shape of a processed part to which laser processing of the laser processing machine is applied and data on a processing condition of the las... | 05/03/2012 |
| 20120103946 | SYSTEM FOR THERMALLY PROCESSING WORKPIECES The invention relates to a system for the thermal processing of workpieces. In this respect, workpieces can be processed by a plasma jet or by a laser beam. It is the object of the invention to make possible the thermal processing of workpieces more flexibly and also le... | 05/03/2012 |
| 20120103952 | LASER PROCESSING APPARATUS An optical transmitting unit transmits a pulsed laser beam oscillated by a pulsed laser beam oscillator to a focusing unit in a laser processing apparatus. A wavelength band expanding unit expands the wavelength band of the pulsed laser beam, and a pulse width expanding... | 05/03/2012 |
| 20120103954 | SYSTEM AND METHOD FOR MINIMIZING FORMATION OF STRIATION PATTERNS IN LASER CUTTING The system and method for minimizing formation of striation patterns in laser cutting provides real-time monitoring and control of laser cutting quality. Laser cutting of a workpiece is controlled through monitoring of thermal radiation generation, particularly during a... | 05/03/2012 |
| 20120067858 | Method and apparatus for processing substrates using a laser The invention relates to a method and apparatus for processing substrates, such as glass and semiconductor wafers. The method comprises directing to the substrate from a laser source a plurality of sequential focused laser pulses having a predetermined duration, pulsing... | 03/22/2012 |
| 20120037604 | LASER BEAM MACHINING DEVICE Provided is a laser beam machining apparatus (1) which enables prevention of a reduction in the transmittance of a protection glass (32) caused by adhesion of high-temperature foreign substances such as spatters and fumes generated in laser beam machining ... | 02/16/2012 |
| 20120024829 | LASER MACHINING DEVICE A laser machining device for forming dots on a substrate includes a light-combining assembly having a first reflection surface and a second reflection surface, a first laser source module, and a second laser source module. The first laser source module emits a first las... | 02/02/2012 |
| 20120025837 | METHOD TO DICE BACK-CONTACT SOLAR CELLS A method of processing of solar cells includes determining that a back-contact solar cell is defective. The back-contact solar cell includes a first plurality of interconnect pads at a first edge thereof, and a second plurality of interconnect pads at a second, opposed ... | 02/02/2012 |
| 20120018412 | OPTICAL DEVICE AND LASER BEAM MACHINING APPARATUS HAVING OPTICAL DEVICE An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam g... | 01/26/2012 |
| 20120012569 | FABRIC CUTTING SYSTEM AND METHOD A fabric cutting system and/or method can include a mandrel having a body and first and second legs, a centered chuck, and an offset chuck, each chuck configured to receive either one of the legs or body to rotatingly support the mandrel between the chucks. When one of ... | 01/19/2012 |
| 20120012568 | Laser irradiation apparatus A laser irradiation apparatus for irradiating a laser beam to a semiconductor layer including a plurality of pixel areas, the apparatus includes a laser generator generating the laser beam, and an optical switching unit time-dividing the laser beam generated from the la... | 01/19/2012 |
| 20120006798 | LASER OSCILLATOR AND LASER MACHINING APPARATUS A laser oscillator includes a blower for blowing laser gas to discharge tubes; a gas circulation path for connecting discharge tubes and a blower; a gear chamber pressure detector for detecting the pressure of the gear chamber disposed in the blower; and an alarm part f... | 01/12/2012 |
| 20120006797 | LASER BEAM WORKING MACHINE A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1 | 01/12/2012 |
| 20120000894 | PRECISION LASER SCORING Method and apparatus for laser scoring a sheet material. An elongated laser beam having S-mode intensity profile in the width direction and a flat-top-mode profile in the length direction is used to achieve high precision scoring. The invention can be used for scoring l... | 01/05/2012 |
| 20120003788 | High Throughput Solar Cell Ablation System A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A l... | 01/05/2012 |
| 20110315666 | METHOD OF ABLATING A SURFACE LAYER OF A WALL, AND ASSOCIATED DEVICE The invention relates to a method of ablating a surface layer of a wall by sweeping the said layer, comprising: a step of directional control by an optical deflector of a plurality of pulsed laser beams; a step of ablating the layer on impact zones created by the plural... | 12/29/2011 |
| 20110312158 | METHOD AND APPARATUS FOR DIVIDING THIN FILM DEVICE INTO SEPARATE CELLS A method and apparatus for dividing a thin film device having a first layer which is a lower electrode layer, a second layer which is an active layer and a third layer which is an upper electrode layer, the layers each being continuous over the device, into separate cel... | 12/22/2011 |
| 20110297655 | MIRROR ANGULAR-POSITIONING APPARATUS AND PROCESSING APPARATUS The present invention provides an apparatus for angular positioning of a mirror, the apparatus including a motor configured to rotate a mirror, a detector configured to detect a rotational angle of the mirror, a controller configured to supply an electric current to the... | 12/08/2011 |
| 20110290768 | GAS LASER OSCILLATION DEVICE AND GAS LASER PROCESSING MACHINE A gas laser oscillator includes a discharge section for exciting laser gas, a blowing section for transmitting the laser gas, and a laser gas flowing path for forming a circulation route of the laser gas between the discharge section and the blowing section. The blowing... | 12/01/2011 |
| 20110284511 | METHOD AND APPARATUS FOR LASER STRIP SPLICING A splicing apparatus for joining a trailing end of a downstream metal strip to the leading end of an upstream metal strip includes a base having a working surface, a cover assembly operatively connected to the base and movable between an open position and a closed posit... | 11/24/2011 |
| 20110284512 | METHOD AND DEVICE FOR MONITORING A LASER PROCESSING OPERATION TO BE PERFORMED ON A WORKPIECE AND LASER PROCESSING HEAD HAVING SUCH A DEVICE The invention relates to a method for monitoring a laser machining operation to be performed on a workpiece, comprising the following steps: detecting at least two current measured values by at least one sensor, which monitors the laser machining operation, determining ... | 11/24/2011 |
| 20110284509 | Deflection Mirror and Device for Laser Inscribing with the Deflection Mirror Unit In order to keep the entire unit compact e.g. in a laser inscribing unit in spite of the laser beam impacting the card to be inscribed in an orthogonal manner a relatively large amount of beam deflections is necessary partially through mirrors that are fixated relative ... | 11/24/2011 |
| 20110284510 | Methods and Systems for Laser Processing of Materials A method of processing a work material using a laser can include directing a laser beam of optical energy from a laser to a work material; processing the work material with the laser beam of optical energy in accordance with at least one processing parameter to modify t... | 11/24/2011 |
| 20110278267 | SCRIBING APPARATUS AND SCRIBING METHOD Performing scribing accurately with a high yield rate. A scribing apparatus (1), including a conveyance means (10) for conveying a web of strip-like continuous flexible substrate (B) on which a target scribing film (M) is formed by applying a tensile stren... | 11/17/2011 |
| 20110272388 | PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensatio... | 11/10/2011 |
| 20110266264 | METHOD AND APPARATUS FOR FORMING GROOVES IN THE SURFACE OF A POLYMER LAYER A method for the formation of grooves (74, 85) in the surface of a polymer layer substrate (36, 46, 51, 65, 73, 83) by a direct write laser vaporization process, the polymer being selected, or modified by the addition of organic or inorganic material, so t... | 11/03/2011 |
| 20110259861 | FIBER LASER SYSTEMS FOR COLD ABLATION Scribing operations with reduced substrate heating can be provided by applying multiple optical pulses to a substrate within a time interval that is less than a material recombination time. Typically a series of pulses of durations of 5-200 ps with pulse energies of les... | 10/27/2011 |
| 20110253245 | METHOD AND APPARATUS FOR PRODUCING PIPE SECTIONS USING A LASER BEAM MOVABLE BY A SCANNING DEVICE, AND CORRESPONDING PIPE SECTION When severing pipe sections from a pipe that is continuously produced, a closed separating line is formed around the section axis along the pipe circumference, the separating line being disposed by a section length from the free pipe end. In at least one embodiment, in ... | 10/20/2011 |
| 20110253685 | LASER PROCESSING SYSTEM WITH VARIABLE BEAM SPOT SIZE Systems for scribing a workpiece incorporate a motorized beam expander to change a laser beam spot size incident on a workpiece. A system includes a frame, a laser coupled with the frame and generating an output to remove material from at least a portion of a workpiece,... | 10/20/2011 |
| 20110253686 | Laser Processing Machines and Methods The invention relates to a laser processing machine for selectively processing plate-like or pipe-like workpieces, including: a displacement device to which a workpiece table for supporting a plate-like workpiece can be secured in order to move the workpiece table into ... | 10/20/2011 |
| 20110253687 | MOUTH OF A HOOD FOR SUCKING UP FINE PARTICLES, AND LASER DEVICE FOR ABLATING A SURFACE LAYER OF A WALL COMPRISING SUCH A HOOD The invention relates to a hood for sucking up fine particles, comprising: an air intake mouth comprising a crest intended to be placed close to a wall or to emit fine particles, the crest defining an internal portion of the hood and an external portion; and a suction o... | 10/20/2011 |
| 20110248004 | SEAMLESS LASER ABLATED ROLL TOOLING A system for generating a laser machined tool from a substantially cylindrical work piece. The system includes a laser producing a laser beam, a mask positioned within the laser beam for shaping the laser beam into an image, and an optical system for imaging the laser b... | 10/13/2011 |
| 20110248005 | Laser Cutting Method and Equipment, with means for Modifying the Laser Beam Quality Factor by a Diffractive Optical Component A method of cutting a work-piece to be cut by a laser beam, in which an incident laser beam is generated that has an initial beam parameter product (BPP), given by means of a laser source, preferably an ytterbium-doped or erbium-doped fiber laser source, coupled to at l... | 10/13/2011 |
| 20110250423 | PROCESS AND SYSTEM FOR CUTTING A BRITTLE-MATERIAL PLATE, AND WINDOW GLASS FOR A VEHICLE Provide a process for cutting a brittle-material plate, a window glass for vehicles obtained by the cutting process, and a system for cutting such a brittle-material plate, which are capable of cutting such a brittle-material plate in a desired planar shape in productio... | 10/13/2011 |
| 20110240617 | LASER-BASED MATERIAL PROCESSING APPARATUS AND METHODS Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a... | 10/06/2011 |
| 20110240616 | METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and ... | 10/06/2011 |
| 20110233178 | LASER PROCESSING APPARATUS A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser ... | 09/29/2011 |
