U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Icon_funbox Bizarre Patents

Patent No. 6293874

User-operated amusement apparatus for kicking the user's buttocks

An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.

Newsletter  PatentStorm News

Make the Most of Our Site

See this month's Top Inventors and Most Cited Patents.

Stay on top of the latest innovations by subscribing to an RSS feed.

Registered users: Manage your profile.

 

Class 216/58 - GAS PHASE ETCHING OF SUBSTRATE


Subclass of Class 216 - Etching a substrate: processes
Definition: Process wherein the etchant is in a gaseous state when it
No. of applications: 280
Last issue date: 03/01/2012


1              
Application No.Application TitleIssue Date
20120052597RECOGNIZABLE CARRIER FOR OPTICAL MEASUREMENT METHODS
The invention relates to a recognizable carrier for determining physical, chemical or biochemical interactions by means of optical measurement methods. The carrier comprises a surface that defines a substrate surface and that has a base layer coated with reactive elemen...
03/01/2012
20120027998SURFACE RELIEF MICROSTRUCTURES, RELATED DEVICES AND METHOD OF MAKING THEM
The present invention relates to a method for the replication of a patterned surface relief microstructure, comprising the steps of generation of a first layer with a patterned surface relief microstructure, generation of a master, by copying the microstructure of the f...
02/02/2012
20120003142VAPOR-PHASE PROCESS APPARATUS, VAPOR-PHASE PROCESS METHOD, AND SUBSTRATE
A vapor-phase process apparatus and a vapor-phase process method capable of satisfactorily maintaining quality of processes even when different types of processes are performed are obtained. A vapor-phase process apparatus includes a process chamber, gas supply ports se...
01/05/2012
20110318930METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
A first gas for plasma etch and a second gas for plasma deposition are introduced onto a semiconductor substrate, the semiconductor substrate including a mask pattern. A flow rate of the first and second gases is periodically changed within a range of flow rates during ...
12/29/2011
20110299969DEVICE FOR GRASPING AND ACTIVE RELEASE OF MICRO AND NANO OBJECTS
The present invention relates to design and microfabrication methods for forming devices that are capable of grasping and actively releasing micro or nanometer-sized objects in ambient and vacuum environments. Grasping motion is produced by one or more microactuators, a...
12/08/2011
20110286896Patterning Of Surfaces To Control The Storage, Mobility And Transport Of Liquids For Microfluidic Applications
Systems and methods to pattern surfaces to create regions of variable adhesive force on a superhydrophobic paper surface. By taking advantage of high surface energy sticky islands on a non-sticky superhydrophobic surface, microliter water drops can be registered or conf...
11/24/2011
20110268616REACTOR AND MANUFACTURING METHOD OF REACTOR
Provided is a reactor which makes it possible to increase the uniformity of mixing of the reactants therein. The reactor is provided with a flow path structure having internal reactant flow passages including: a first introduction passage for the introduction of a first...
11/03/2011
20110266256METHODS FOR PROCESSING SUBSTRATES IN PROCESS SYSTEMS HAVING SHARED RESOURCES
Methods for processing substrates in twin chamber processing systems having first and second process chambers and shared processing resources are provided herein. In some embodiments, a method may include providing a substrate to the first process chamber of the twin ch...
11/03/2011
20110215071WAFER CARRIER WITH SLOPED EDGE
A wafer carrier includes a body defining a central axis, a generally planar top surface perpendicular to the central axis, and pockets recessed below the top surface for receiving wafers. The body can include a lip projecting upwardly around the periphery of the top sur...
09/08/2011
20110204029PROCESSING SYSTEM AND METHOD FOR CHEMICALLY TREATING A SUBSTRATE
A processing system and method for chemically treating a substrate, wherein the processing system comprises a temperature controlled chemical treatment chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatmen...
08/25/2011
20110186544METHOD OF ACCELERATING SELF-ASSEMBLY OF BLOCK COPOLYMER AND METHOD OF FORMING SELF-ASSEMBLED PATTERN OF BLOCK COPOLYMER USING THE ACCELERATING METHOD
A block copolymer film is formed on a substrate. Then, the block copolymer film is annealed in an inert-gas atmosphere, for example, in a neon atmosphere. This places the outside (mainly the upper portion) of the block copolymer film in a nonpolar state, thereby strongl...
08/04/2011
20110174775SURFACE PROCESSING APPARATUS
To prevent a processing gas from leaking from a processing tank for processing a surface of a substrate and to stabilize flow of the processing gas in a processing space.

A substrate 9 is conveyed into the inside of a processing tank...

07/21/2011
20110147896CLUSTER JET PROCESSING METHOD, SEMICONDUCTOR ELEMENT, MICROELECTROMECHANICAL ELEMENT, AND OPTICAL COMPONENT
A method for processing a sample using an electrically neutral reactive cluster is provided. The surface of a sample is processed by jetting out a mixed gas that is composed of a reactive gas and a gas with a boiling point lower than that of the reactive gas from a gas ...
06/23/2011
20110149361MICRO-MIRROR WITH ELECTRODE SPACER
A micro-mirror includes stiffer end sections for limiting curvature, and thin middle sections forming ground electrodes and a hinge. Spacers arc provided beneath the thin middle sections of the micro-mirror for supporting hot electrodes, which attract the ground electro...
06/23/2011
20110132872METHOD OF FORMING A NOZZLE AND AN INK CHAMBER OF AN INK JET DEVICE BY ETCHING A SINGLE-CRYSTAL SUBSTRATE
A method of forming a nozzle and an ink chamber of an ink jet device, includes forming a nozzle passage by subjecting a substrate to a directional first etch process from one side of the substrate; applying a second etch process from the same side of the substrate for w...
06/09/2011
20110098841GAS SUPPLY DEVICE, PROCESSING APPARATUS, PROCESSING METHOD, AND STORAGE MEDIUM
A gas supply device 3 includes a device body 31 forming a substantially conical gas-conducting space 32 for conducting gases therethrough from a diametrally reduced end 32a of the space 32 to a diametrally enlarged end 32...
04/28/2011
20110082044HIGH TEMPERATURE SUPERCONDUCTING FILMS AND METHODS FOR MODIFYING AND CREATING SAME
Operational characteristics of an high temperature superconducting (“HTS”) film comprised of an HTS material may be improved by depositing a modifying material onto appropriate surfaces of the HTS film to create a modified HTS film. In some implementations of the in...
04/07/2011
20110068084SUBSTRATE HOLDER AND SUBSTRATE TEMPERATURE CONTROL METHOD
A substrate holder which has an electrostatic chuck on a substrate holding side of a holder main body and electrostatically adsorbs a substrate includes: a heating unit which is built in the electrostatic chuck and heats the substrate; a circulation medium distribution ...
03/24/2011
20110062113SUBSTRATE PROCESSING APPARATUS AND METHOD
A bypass route is provided in order to transfer a substrate without passing through the normal pressure transfer chamber, that is, a loader module, from a load lock chamber to a storage. In the bypass route, a sub-transfer unit for transferring the processed substrate f...
03/17/2011
20110048755HOUSING FOR ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME
A housing for electronic device, comprising: a metal substrate, the substrate having a bonding surface, a peripheral edge, and a ridge protruding from the peripheral edge and surrounding the bonding surface; a soft layer soft to the touch, the soft layer having an edge;...
03/03/2011
20110050804LIQUID EJECTING HEAD AND METHOD OF MANUFACTURING THE SAME
A liquid ejecting head has a nozzle substrate made of crystalline material, in which a nozzle through which liquid is ejected is provided by an etching process. The nozzle includes a plurality of continuous nozzle sections having different diameters arranged coaxially i...
03/03/2011
20110036810MANUFACTURING METHOD OF ELECTRON SOURCE
An electron gun with a truncated-cone-shaped cathode with uniform emission current density is efficiently manufactured. A manufacturing method of a cathode electron gun equipped with a supply source for diffusing oxide of a metal element on a single crystal needle of tu...
02/17/2011
20110033661CONTROLLABLE NANOSTRUCTURING ON MICRO-STRUCTURED SURFACES
Provided herein is a medical implant having a nanostructure on top of a microstructure and the methods of making and using the same....
02/10/2011
20110027506FUNCTIONAL COMPOSITE MATERIAL
The invention relates to a functional composite material consisting of a support (1) and a functional surface material (2). The composite material is characterised in that the support has a structured boundary layer (3) with a lower boundary (4
02/03/2011
20110013870COUPLING DEVICE FOR OPTICAL FIBRES
A coupling device (1, 2) for optical fibres (19) comprises a first sheet (11) equipped with a plurality of through-holes (13), of which a portion 13a, at least, has a diameter adjusted to the diameter of said optical fibres (...
01/20/2011
20110008211MICROFLUID CHANNEL, METHOD FOR ITS IMPLEMENTATION, AND MICROFLUIDIC SYSTEM CONTAINING SAID CHANNEL
The invention relates to a microfluidic channel (6) with shifted levels comprising a channel pillar (2a, 2b) and a channel bridge (3) which microfluidic channel (6) connects a channel (4a, 4b),...
01/13/2011
20110008578METHOD FOR PRODUCING POLYMER MOLDED BODY
A method for producing a polymer molded body, comprising a step of forming a recess in a polymer structure containing a polyglycolic acid by dry etching the polymer structure at a vacuum degree of 50 mTorr or less, an output of 1-6 W and a current of 3 mA or less....
01/13/2011
20110006038PLASMA PROCESSING CHAMBER WITH ENHANCED GAS DELIVERY
A method and apparatus for providing flow into a processing chamber are provided. In one embodiment, a vacuum processing chamber is provided that includes a substrate support pedestal disposed in an interior volume of a chamber body, a lid enclosing the interior volume,...
01/13/2011
20100301011APPARATUS AND METHOD FOR DOWNSTREAM PRESSURE CONTROL AND SUB-ATMOSPHERIC REACTIVE GAS ABATEMENT
A sub-atmospheric downstream pressure control apparatus includes a first flow restricting element (FRE); a pressure control chamber (PCC) located in serial fluidic communication downstream from the first FRE; a second FRE located in serial fluidic communication downstre...
12/02/2010
20100288729Methods for Manufacturing a Microstructure
Methods for manufacturing a microstructure, wherein use is made of a powder blasting and/or etching and a single mask layer with openings and structures of varying dimensions, wherein the mask layer at least at one given point in time has been wholly worn away within at...
11/18/2010
20100282710SHUTTERED GATE VALVE
Embodiments of gate valves and methods of using same are provided herein. In some embodiments, a gate valve for use in a process chamber may include a body having an opening disposed therethrough from a first surface to an opposing second surface of the body; a pocket e...
11/11/2010
20100260974Method for Manufacturing a Micromechanical Component, and Micromechanical Component
A micromechanical method for manufacturing a cavity in a substrate, and a micromechanical component manufactured with this method. In this method, in a first step a first layer is produced on or in a substrate. At least one second layer is then applied onto the first la...
10/14/2010
20100237046DRY NON-PLASMA TREATMENT SYSTEM AND METHOD OF USING
A dry non-plasma treatment system and method for removing oxide material is described. The treatment system is configured to provide chemical treatment of one or more substrates, wherein each substrate is exposed to a gaseous chemistry under controlled conditions includ...
09/23/2010
20100224590METHOD FOR PRODUCING MICRONEEDLE STRUCTURES EMPLOYING ONE-SIDED PROCESSING
A method for forming a hollow microneedle structure includes processing the front side of a wafer to form at least one microneedle projecting from a substrate and a through-bore passing through the microneedle and through a thickness of the substrate. An entire length o...
09/09/2010
20100207411MEMS-BASED MICRO AND NANO GRIPPERS WITH TWO-AXIS FORCE SENSORS
The present invention relates to a design and microfabrication method for microgrippers that are capable of grasping micro and nano objects of a large range of sizes and two-axis force sensing capabilities. Gripping motion is produced by one or more electrothermal actua...
08/19/2010
20100200543CRYSTAL OSCILLATOR PIECE AND METHOD FOR MANUFACTURING THE SAME
The present invention provides a crystal oscillator piece in which the cross section of its vibrating tine, while not symmetrical in shape, has a principal axis that is oriented parallel to an X axis to suppress the generation of leakage vibration, and a method for manu...
08/12/2010
20100200545NON-CONTACT SUBSTRATE PROCESSING
Embodiments of the present invention provide apparatus and methods for supporting, positioning or rotating a semiconductor substrate during processing. One embodiment of the present invention provides a method for processing a substrate comprising positioning the substr...
08/12/2010
20100190349Method for backside polymer reduction in dry-etch process
A method for preventing the formation of contaminating polymeric films on the backsides of semiconductor substrates includes providing an oxygen-impregnated focus ring and/or an oxygen-impregnated chuck that releases oxygen during etching operations. The method further ...
07/29/2010
20100170871FINE PATTERN FORMING METHOD
A disclosed fine pattern forming method includes steps of: forming patterns made of a first photoresist film, arranged at a first pitch on a film; trimming the patterns made of the first photoresist film; depositing a protection film on the patterns made of the first ph...
07/08/2010
20100126962Spin head and method of chucking substrate using the same
Provided is a spin head. Chuck pins, installed at a support plate to support the lateral surface of a substrate, are moved along the perpendicular direction to the radial direction of the support plate. The effect of centrifugal force applied to the chuck pins during th...
05/27/2010
1              
 
Sign InRegister
Username  
Password   
forgot password?