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| Application No. | Application Title | Issue Date |
| 20130026134 | COPPER OXIDE ETCHANT AND ETCHING METHOD USING THE SAME In order to provide a copper oxide etchant and an etching method using the same capable of selectively etching exposure/non-exposure portions when laser light exposure is performed by using copper oxide as a thermal-reactive resist material, the copper oxide etchant for... | 01/31/2013 |
| 20130008870 | METHOD FOR PROCESSING OUTER PERIPHERY OF SUBSTRATE AND APPARATUS THEREOF To make an arrangement so as not to give any damage to the central part of a substrate during the operation for removing unnecessary film coated on the outer peripheral part of the substrate. The stage is provided therein with a refrigerant chamber 41 as a heat a... | 01/10/2013 |
| 20120223053 | Thermal Anneal of Block Copolymer Films with Top Interface Constrained to Wet Both Blocks with Equal Preference Methods for fabricating sublithographic, nanoscale microstructures utilizing self-assembling block copolymers, and films and devices formed from these methods are provided.... | 09/06/2012 |
| 20120088191 | lithographic printing plate precursor A positive-working lithographic printing plate precursor is disclosed which comprises on a support having a hydrophilic surface or which is provided with a hydrophilic layer a heat and/or light-sensitive coating including an infrared absorbing agent and a compound inclu... | 04/12/2012 |
| 20120053042 | DRY METHOD FOR SURFACE TREATMENT The present invention discloses a method for treating at least a portion of at least one surface of a glass article which comprises the following steps, whatever their order: dry application of at least one high-pH solid material on said portion; heating of said glass a... | 03/01/2012 |
| 20110311635 | HOLLOW METAL OXIDE SPHERES AND NANOPARTICLES ENCAPSULATED THEREIN A nanoparticle including a Group 3 atom-containing shell. In various embodiments, the nanoparticle includes a metal or metal catalyst-containing core, or a substantially metal-free core. In other embodiments, the nanoparticle shell is hollow. A method of preparing the n... | 12/22/2011 |
| 20110128165 | KEYPAD FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE KEYPAD A keypad for an electronic device having metallic texture has rigidity and elasticity equivalent to those of stainless steel. The keypad is manufactured and includes a metal alloy board, a keypad body manufactured by primarily thermal-treating the metal alloy board to a... | 06/02/2011 |
| 20100195953 | OPTICAL WAVEGUIDE DEVICE, MANUFACTURING METHOD THEREFOR, OPTICAL MODULATOR, POLARIZATION MODE DISPERSION COMPENSATOR, AND OPTICAL SWITCH An optical waveguide device includes: a substrate which has an electro-optical effect; an optical waveguide which is formed on the substrate and/or inside the substrate; and an in-substrate electrode which is formed of a metal and provided inside the substrate.... | 08/05/2010 |
| 20090039057 | Method of increasing etchability of metals having chemical etching resistant microstructure A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The invention also includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate ... | 02/12/2009 |
| 20080233435 | Polymer Thin Film, Patterned Substrate, Patterned Medium for Magnetic Recording, and Method of Manufacturing these Articles A polymer thin film in which cylindrical phases are distributed in a continuous phase and are oriented in a pass-through-direction of the film includes at least: a first block copolymer including at least a block chain A1, as a component of the continuous phase, ... | 09/25/2008 |
| 20080206562 | METHODS OF GENERATING SUPPORTED NANOCATALYSTS AND COMPOSITIONS THEREOF The disclosure relates to metal nanoparticle compositions and methods of making such nanoparticle compositions that are useful for the production of electrically conductive features and catalysts.... | 08/28/2008 |
| 20080166525 | METHOD FOR BONDING A DIE OR SUBSTRATE TO A CARRIER A method is disclosed for bonding two elements by means of a bonding agent such as a glue layer, wherein the bonding agent is removable, and wherein between the bonding agent and at least one element, a sacrificial layer is applied which is selectively removable with re... | 07/10/2008 |
| 20080083700 | Method and Apparatus for Maximizing Cooling for Wafer Processing Methods for processing wafers, wafer processing apparatus, micro-fluid ejection head substrates, and etching process are provided. One such method includes applying a clamping voltage to an electrostatic chuck sufficient to hold a wafer in a substantially planerized ori... | 04/10/2008 |
| 20070295276 | BAKE PLATE HAVING ENGAGEABLE THERMAL MASS A bake station comprising a bake plate adapted to heat a substrate supported on an upper surface of the bake plate, the bake plate vertically moveable between an upper baking position and a lower cooling position; and a plurality of heat sinks adapted to be engageably c... | 12/27/2007 |
| 20070228004 | Device and method for the treatment of wafers A device and a method is provided for irradiating wafers with low-intensity UV light to prevent blistering during the subsequent photostabilization of the photoresist.... | 10/04/2007 |
| 20070023392 | Method for removing at least one area of a layer of a component consisting of metal or a metal compound The invention relates to a method for removing an area of a layer of a component consisting of metal or a metal compound. According to prior art, corrosion products of a component are removed in a first step by applying a molten mass or by heating in a voluminous powder... | 02/01/2007 |
