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Class 216/13 - FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.)


Subclass of Class 216 - Etching a substrate: processes
Definition: Process wherein etching is used in the forming or treating
No. of applications: 727
Last issue date: 05/24/2012


1                      
Application No.Application TitleIssue Date
20120125668WIRING STRUCTURE FOR IMPROVING CROWN-LIKE DEFECT AND FABRICATION METHOD THEREOF
A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, hav...
05/24/2012
20120125680MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an ope...
05/24/2012
20120129049METHOD OF MAKING SILICON ANODE MATERIAL FOR RECHARGEABLE CELLS
A method of forming a silicon anode material for rechargeable cells includes providing a metal matrix that includes no more than 30 wt % of silicon, including silicon structures dispersed therein. The metal matrix is at least partially etched to at least partially isola...
05/24/2012
20120103932METHODS FOR FABRICATING CURRENT-CARRYING STRUCTURES USING VOLTAGE SWITCHABLE DIELECTRIC MATERIALS
A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between t...
05/03/2012
20120103930METHOD OF MAKING FUSIBLE LINKS
Methods of fabricating the fusible link are directed to processing a multi-layer clad foil having a first layer suitable for forming a fusible link and a second layer suitable for forming one or more welding pads. In some embodiments, the first layer is an aluminum laye...
05/03/2012
20120103931METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD
A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal fil...
05/03/2012
20120082825METHODS OF WET ETCHING A SELF-ASSEMBLED MONOLAYER PATTERNED SUBSTRATE AND METAL PATTERNED ARTICLES
Method of patterning a substrate are described including a method of providing a substrate comprising a metalized surface having a self-assembled monolayer patterned region and unpatterned region; and wet etching the metalized surface in a liquid etchant agitated with b...
04/05/2012
20120081348METHOD FOR ELIMINATING ROW OR COLUMN ROUTING ON ARRAY PERIPHERY
The present disclosure provides systems, methods, and apparatus to facilitate edge routing among a plurality of microelectromechanical devices arranged in a mosaic or array. In one aspect, the disclosed implementations modify the construction of a movable layer, such th...
04/05/2012
20120067618METHOD FOR PRODUCING A COATED ITEM BY MEANS OF TEXTURE ETCHING
The invention relates to a method for manufacturing a coated object (2) through deposition of at least one transparent, conductive metal-oxide layer (3) on a substrate (5), comprising the deposition (I) and preferably subsequent temperature treatmen...
03/22/2012
20120068265WIRING LAYER STRUCTURE AND PROCESS FOR MANUFACTURE THEREOF
This wiring layer structure includes: an underlying substrate of a semiconductor substrate or a glass substrate; an oxygen-containing Cu layer or an oxygen-containing Cu alloy layer which is formed on the underlying substrate; an oxide layer containing at least one of A...
03/22/2012
20120067396Hydrophobic Solar Concentrator and Method of Using and Forming the Hydrophobic Solar Concentrator
A solar concentrator is implemented with a plate structure that has a surface and one or more hydrophobic regions on the surface of the plate structure. The plate structure is transparent to visible light. A fluid is sprayed onto the surface of the plate structure where...
03/22/2012
20120070741HIGH CAPACITY BATTERY ELECTRODE STRUCTURES
Provided are battery electrode structures that maintain high mass loadings (i.e., large amounts per unit area) of high capacity active materials in the electrodes without deteriorating their cycling performance. These mass loading levels correspond to capacities per ele...
03/22/2012
20120069288LIQUID CRYSTAL POLYMER LAYER FOR ENCAPSULATION AND IMPROVED HERMITICITY OF CIRCUITIZED SUBSTRATES
A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of each ...
03/22/2012
20120048019HIGHLY SENSITIVE CAPACITIVE SENSOR AND METHODS OF MANUFACTURING THE SAME
Micro-machined capacitive sensors implemented in micro-electro-mechanical system (MEMS) processes that have higher sensitivity, while providing an increased linear capacitive sensing range. Capacitive sensing is achieved via variable-area sensing, which employs a transd...
03/01/2012
20120052244LAYER SYSTEM HAVING BARRIER PROPERTIES AND A STRUCTURED CONDUCTIVE LAYER, METHOD FOR PRODUCING THE SAME, AND USE OF SUCH A LAYER SYSTEM
The invention relates to a layer system, comprising a substrate (1) on which firstly at least one barrier layer (2), followed by an intermediate layer (3) acting as an etch-stop layer and subsequently at least one electrically conductive layer (4...
03/01/2012
20120048828METHOD OF MANUFACTURING CONDUCTIVE TRANSPARENT SUBSTRATE
Disclosed herein is a method of manufacturing a conductive transparent substrate. The method of manufacturing a conductive transparent substrate includes (A) forming a transparent electrode on one surface of a transparent film; (B) forming a release function film on a p...
03/01/2012
20120048609SUSPENSION SUBSTRATE, SUSPENSION, AND MANUFACTURING METHOD OF SUSPENSION SUBSTRATE
A main object of the present invention is to provide a suspension substrate capable of supplying electric power easily to an assisting element fitted thereto. The object is attained by providing a suspension substrate comprising a metal supporting substrate, an insulati...
03/01/2012
20120052258PATTERNING OF AND CONTACTING MAGNETIC LAYERS
A method according to embodiments of the present invention comprises providing a magnetic stack comprising a magnetic layer sub-stack comprising magnetic layers and a bottom conductive electrode and a top conductive electrode electrically connecting the magnetic layer s...
03/01/2012
20120043509Indium Oxide Sintered Compact, Indium Oxide Transparent Conductive Film, and Manufacturing Method of Indium Oxide Transparent Conductive Film
An indium oxide sintered compact containing zirconium as an additive, wherein the ratio of atomic concentration of zirconium to the sum of the atomic concentration of indium and the atomic concentration of zirconium is in the range of 0.5 to 4%, the relative density is ...
02/23/2012
20120030931ELECTRONIC DEVICE WITH EDGE SURFACE ANTENNA ELEMENTS AND RELATED METHODS
An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least o...
02/09/2012
20120034419METHODS OF PRODUCING STRUCTURES USING A DEVELOPER-SOLUBLE LAYER WITH MULTILAYER TECHNOLOGY
Methods of forming microelectronic structures using multilayer processes are disclosed. The methods comprise the use of a developer-soluble protective layer adjacent the substrate surface in a multilayer stack to protect the substrate during pattern transfer. After etch...
02/09/2012
20120031872CONDUCTIVE FILM REMOVAL AGENT AND CONDUCTIVE FILM REMOVAL METHOD
Disclosed is an agent for removing a conductive film, which contains: an acid having a boiling point of 80° C. or higher, a base having a boiling point of 80° C. or higher, or a compound which generates an acid or a base by external energy in combination with a solven...
02/09/2012
20120025667Method for manufacturing a piezoelectric film wafer, piezoelectric film element, and piezoelectric film device
A method for manufacturing a piezoelectric film wafer includes a first processing step for carrying out an ion etching on a KNN piezoelectric film formed on a substrate by using a gas containing Ar, and a second processing step for carrying out a reactive ion etching by...
02/02/2012
20120024816METHOD FOR FABRICATING TOUCH SENSOR PANELS
A method for fabricating a touch sensor panel is disclosed. The method includes providing a substrate for the touch sensor panel, depositing a conductive material layer on a top surface of the substrate, depositing a metal layer on top of the conductive material layer, ...
02/02/2012
20120024571ELECTRODE ASSEMBLY
The present invention relates to an electrode assembly having a laminate structure comprising: a first insulating capping layer; a first conducting layer capped by the first insulating capping layer and substantially sandwiched by at least the first insulating capping l...
02/02/2012
20120024817APPARATUS AND METHOD FOR PLASMA SURFACE TREATMENT
An apparatus and a method for plasma surface treatment which treats a surface of a treatment portion of an electrically conductive object using ions from plasma are disclosed. The apparatus includes a connector electrically connected to the treatment portion for applyin...
02/02/2012
20120018514MEMS barcode device for monitoring medical systems at point of care
This invention relates to a novel wireless barcode MEMS canary which can be embedded in electronic systems that can be monitored at any time for their degradation over a period of time until they fail. By establishing the relationship between the healthy state of the ba...
01/26/2012
20120018186CASE STRUCTURE HAVING FILM TYPE ELECTRONIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME
Disclosed herein is a case structure of an electronic product to which a film-type electronic circuit is adhered. The case structure may include a case of an electronic product and a first film adhered to the case. The case structure may further include a second film ad...
01/26/2012
20120013989META MATERIAL AND METHOD OF MANUFACTURING THE SAME
Provided are a meta material and a method of manufacturing the same. The meta material comprises: a substrate; at least one conductive nano pattern patterned on the substrate and having a size with a negative refractive index in a predetermined electromagnetic wavelengt...
01/19/2012
20120013544POSITION-SENSING PANEL AND METHOD
An exemplary touch position sensing panel includes an opaque electrode layer and a transparent electrode layer separated from the opaque electrode layer by a substrate. The electrodes are arranged such that nodes are formed in areas where the electrodes cross over each ...
01/19/2012
20120014642Transparent Optical Switch
An optical switching device realized on a substrate. The device includes a moveable platform driven by electrostatic actuation provided by a set of rotor fingers and stator fingers. The moveable platform, rotor fingers and stator fingers are integrally formed on the sub...
01/19/2012
20120015818Method for producing a HTS coated conductor and HTS coated conductor with reduced losses
A method for producing a high temperature superconductor (=HTS) coated conductor (12), wherein a buffer layer (2; 22) and an HTS layer (4; 24; 65) are deposited on a substrate (1; 21), with the following steps: a) after depositing the buffer ...
01/19/2012
20120008934CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a camera module is disclosed. The module includes a semiconductor substrate having a first main surface and a second main surface facing the first main surface. An imaging region is provided on the first main surface. A penetrative electrode...
01/12/2012
20120006781Electrode material and applications thereof
A metal vanadium film is used as an extraction electrode contacting with a vanadium oxide or doped vanadium oxide film. The electrode material is adapted for a detector, sensor and optical switch based on a vanadium oxide or doped vanadium oxide film. The metal vanadium...
01/12/2012
20120006782SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method for removing a copper oxide film on a surface of Cu and a Cu-containing residue adhered to an interlayer insulating film in a Cu wiring structure on a substrate by using an organic acid-containing gas is provided. The substrate processing m...
01/12/2012
20120003851Sheet-Like Connector And Manufacturing Method Thereof
The sheet-like connector comprises a plurality of conductive members formed on one side of sheet. Each of the conductive members comprises elastically deformable spring member wherein edge thereof moves in the thickness direction of sheet, middle member which is formed ...
01/05/2012
20120001890Switchable 3-Dimensional Conversion Device, Method for Manufacturing the Same and Stereoscopic Image Display Device Using the Same
The present invention is for a switchable 3-dimensional conversion device having a spacer stably formed at a predetermined height by imprinting, a manufacturing method thereof and a stereoscopic image display device using the same, the method includes: providing a first...
01/05/2012
20120003438GRAPHENE PROCESSING FOR DEVICE AND SENSOR APPLICATIONS
A supported graphene device comprises at least one graphene feature of 1 to about 10 graphene layers having a predetermined shape and pattern, with at least a portion of each graphene feature being supported on a substrate. In some embodiments the device comprises graph...
01/05/2012
20110317312FLEXURE AND METHOD OF FORMING WIRING PART OF FLEXURE
A flexure includes a metal substrate whose front end supports a slider and a wiring part having a base insulating layer and a conductor layer formed on the base insulating layer. The wiring part includes a normal wiring part that is on the metal substrate and an aerial ...
12/29/2011
20110316057WIRING BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS THEREOF
It is an object to reduce defective conduction in a wiring board or a semiconductor device whose integration degree is increased. It is another object to manufacture a highly reliable wiring board or semiconductor device with high yield. In a wiring board or a semicondu...
12/29/2011
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