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Class 216/103 - Etchant contains acid


Subclass of Class 216 - Etching a substrate: processes
Definition: Process wherein the substrate is etched with H+ ion
No. of applications: 10
Last issue date: 01/19/2012


Application No.Application TitleIssue Date
20120015205Surface Finishing Process for Indirect or Offset Printing Components
A process for preparing an imaging surface of an imaging transfer member in a printing machine, the process comprises providing a surface roughness to the imaging surface to produce a plurality of pits having sharp features on the surface, and then exposing the pitted i...
01/19/2012
20110111214INTEGRALLY INJECTION-MOLDED ALUMINUM/RESIN ARTICLE AND PROCESS FOR PRODUCING THE SAME
Provided are an integrally injection-molded aluminum/resin article capable of having extremely high adhesion strength and air tightness at the interface between an aluminum shape made of an aluminum alloy and a molded resin integrally bonded to each other by injection m...
05/12/2011
20090212013METHOD FOR MANUFACTURING ELECTRODE FOIL
A method of manufacturing a electrode foil composed of a valve metal layer of a first valve metal and a metal foil of a second valve metal supporting the valve metal layer, the method includes coating fine particles of the first valve metal with a resin to form composit...
08/27/2009
20080067148ETCHANT FOR PATTERNING COMPOSITE LAYER AND METHOD OF FABRICATING PATTERNED CONDUCTIVE LAYER OF ELECTRONIC DEVICE USING THE SAME
An etchant for patterning composite layer containing copper is provided. The etchant includes peracetic acid being about 5% to 40% by weight and serving as a major component, a peracetic acid stabilizer being about 5% to 15% by weight, an organic acid being about 5% to ...
03/20/2008
20070278183Wet etch suitable for creating square cuts in si and resulting structures
A single crystal silicon etching method includes providing a single crystal silicon substrate having at least one trench therein. The substrate is exposed to a buffered fluoride etch solution which undercuts the silicon to provide lateral shelves when patterned in the <...
12/06/2007
20070257010Method and composition for selectively stripping nickel from a substrate
A method of stripping nickel from a printed wiring board comprises providing a printed wiring board with a nickel deposit on a surface and contacting the nickel deposit with phosphate ions and an oxidizer. An aqueous solution comprises ammonium ions, phosphate ions and ...
11/08/2007
20070235408Method of making tapered capillary tips with constant inner diameters
Methods of forming electrospray ionization emitter tips are disclosed herein. In one embodiment, an end portion of a capillary tube can be immersed into an etchant, wherein the etchant forms a concave meniscus on the outer surface of the capillary. Variable etching rate...
10/11/2007
20050279732Methods for sidewall etching and etching during filling of a trench
A method for sidewall etching includes providing a substrate having a trench defined therein, with the trench having fill material disposed over a bottom thereof, along a sidewall thereof, and at the trench opening. The fill material along the sidewall of the trench and...
12/22/2005
20050266695Novel aqueous based metal etchant
The present invention provides an aluminum etchant solution for etching an aluminum surface in the presence of solder bumps. The etchant solution includes about 42% to about 80% phosphoric acid; about 0.1% to about 6% nitric acid; about 5% to about 40% acetic acid; abou...
12/01/2005
20050161439METHOD FOR REMOVING ALUMINIDE COATING FROM METAL SUBSTRATE AND TURBINE ENGINE PART SO TREATED
A method for selectively removing an aluminide coating from at least one surface of a metal-based substrate by: (a) contacting the surface of the substrate with at least one stripping composition comprising nitric acid at a temperature less than about 20° C. to degrade...
07/28/2005
 
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