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| Application No. | Application Title | Issue Date |
| 20120017989 | Metal and metal oxide surface texturing A method of texturing a metal provides a metal with a thickness of 50 to 400 μm. The metal is anodized, etched and then textured in a first texturing step to produce a first textured surface of the metal. A textured metal is produced with a dimpled surface of dimples w... | 01/26/2012 |
| 20120013691 | MATERIALS AND METHODS TO PRODUCE DESIRED IMAGE DRUM SURFACE TOPOGRAPHY FOR SOLID INK JET Exemplary embodiments provide an aluminum image drum and method of its formation such that the aluminum image drum can have a surface texture to provide desirable surface oil consumption and high print quality for solid ink jet marking systems.... | 01/19/2012 |
| 20110162972 | METHOD FOR PRODUCING POSITIVE ELECTRODE OF THIN-FILM BATTERY AND METHOD FOR PRODUCING THIN-FILM BATTERY A method for producing a thin-film battery includes a film-formation step of forming a film of a positive-electrode material to form a positive-electrode active material film and an annealing step of annealing the positive-electrode active material film. After the annea... | 07/07/2011 |
| 20110089042 | METHOD OF MANUFACTURING A GAS ELECTRON MULTIPLIER Methods for manufacturing a gas electron multiplier. One method comprises a step of preparing a blank sheet comprised of an insulating sheet with first and second metal layers on its surface, a first metal layer hole forming step in which the first metal layer is patter... | 04/21/2011 |
| 20110022207 | Methods of and Apparatus for Electrochemically Fabricating Structures Via Interlaced Layers or Via Selective Etching and Filling of Voids Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to boun... | 01/27/2011 |
| 20100318142 | METHOD OF PRODUCING AN ALUMINUM SLUG ANODE An aluminum slug anode usable in capacitors is produced from multiple-stacked layers of aluminum foils. The foils are stacked (possibly after cutting them to have an area similar to the area desired for the anode), hot-pressed, sintered, and anodized to generate the ano... | 12/16/2010 |
| 20100230290 | MOULD FOR GALVANOPLASTY AND METHOD OF FABRICATING THE SAME The invention relates to a method (3) of fabricating a mould (39, 39′) including the following steps:
| 09/16/2010 |
| 20100224501 | PLATING METHODS FOR LOW ASPECT RATIO CAVITIES The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the wor... | 09/09/2010 |
| 20100193366 | Method For Electrochemical Fabrication An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate i... | 08/05/2010 |
| 20100108531 | ADHESIVE LAYER FORMING LIQUID AND ADHESIVE LAYER FORMING PROCESS The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive... | 05/06/2010 |
| 20100044080 | Metal Deposition Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material in... | 02/25/2010 |
| 20090226760 | INDUCTIVE WRITE HEAD WITH SLANTED ELECTROPLATED MEMBER AND METHOD FOR PRODUCING THE SAME A method for forming a tapered, electroplated structure. The method involves forming a first mask structure having an opening. A shrink material is deposited into the opening, such that the thickness of the shrink material is less than the thickness of the first mask st... | 09/10/2009 |
| 20090218233 | Method of Forming a Multilayer Structure Method of forming a multilayer structure by electroetching or electroplating on a substrate. A seed layer is arranged on the substrate and a master electrode is applied thereto. The master electrode has a pattern layer forming multiple electrochemical cells with the sub... | 09/03/2009 |
| 20090207576 | SLOTTED MAGNETIC MATERIAL FOR INTEGRATED CIRCUIT INDUCTORS An embodiment is an inductor that may include a slotted magnetic material to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electro- or electroless plating techniques to form a layer or layers of m... | 08/20/2009 |
| 20090202845 | Antimicrobial Anodized Aluminum and Related Method An anodized aluminum product in continuous web or sheet form, which is heat sealed and coated with an antimicrobial composition. The antimicrobial coating can be bound to surface of the anodic layer and can comprise a network of cross-linked organo-silane molecules that... | 08/13/2009 |
| 20090101513 | METHOD OF MANUFACTURING A FILM PRINTED CIRCUIT BOARD A method of manufacturing a film printed circuit board is provided. A film substrate consisting of a polyimide substrate, an alloy layer and a first copper layer is provided. A first lithographic and etching process is performed to pattern the copper layer and the alloy... | 04/23/2009 |
| 20090095634 | Plating method A plating method can form a plated film having a uniform thickness over the entire surface, including the peripheral surface, of a substrate. The plating method includes: disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathod... | 04/16/2009 |
| 20080102251 | PLATING METHOD AND APPARATUS FOR CONTROLLING DEPOSITION ON PREDETERMINED PORTIONS OF A WORKPIECE The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the wor... | 05/01/2008 |
| 20070020397 | Method of fabricating printed circuit board using imprinting process Disclosed herein is a method of fabricating a printed circuit board using an imprinting process, including forming a plating layer on an insulating layer having a plurality of recessed patterns formed through an imprinting process, and etching and polishing the portion ... | 01/25/2007 |
| 20060151329 | Plating layer for sliding portion and method for forming the same In forming a plating layer for a sliding portion, which comprises Cr that is electrolytically-deposited in a plating bath containing Cr, the plating bath contains organic sulfonic acid. Accordingly, micro-cracks are formed at the plating layer. The plating layer for a s... | 07/13/2006 |
| 20060054507 | Method for producing porous body A process of a porous body comprises the steps of disposing a first material in which pores are formed by anodization on a substrate to form a first layer, disposing on the first layer a second material which has a hardness lower than that of the first material and an o... | 03/16/2006 |
| 20050203637 | Structures and devices for parenteral drug delivery and diagnostic sampling A structure for and method of manufacture of structures for implantation within the tissue of a mammalian subject are disclosed. These structures can be utilized in applications such as the delivery of therapeutic drugs to the tissue of the subject or the sampling of bi... | 09/15/2005 |
| 20050167281 | Production method of suspension board with circuit A production method of a suspension board with circuit that can reduce variations in diameter of the location holes or like holes formed in the suspension board and can produce a trim contour of the suspension board. In the process of forming a seed film 12, zirc... | 08/04/2005 |
| 20050150773 | Method for forming deposition film and method for producing photovoltaic device A method for forming a deposition film from an aqueous solution by electrochemical reaction includes the steps of: forming the targeted deposition film under primary deposition conditions; replacing at least part of members in contact with the solution or removing depos... | 07/14/2005 |
| 20050072681 | Multi-step release method for electrochemically fabricated structures Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surround... | 04/07/2005 |
| 20050056544 | Dual contact ring and method for metal ECP process A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge region of the wafer. The dual contact ring has an outer voltage ring in cont... | 03/17/2005 |
