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| Application No. | Application Title | Issue Date |
| 20110315558 | THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER AND PRODUCTION METHOD OF HYDROGEN PRODUCTION FILTER In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal ... | 12/29/2011 |
| 20110308958 | NICKEL-CONTAINING LAYER ARRANGEMENT FOR INTAGLIO PRINTING A layer arrangement for a gravure cylinder including nickel in at least a first region through the entire thickness (d) thereof, with a mass fraction of at least 0.80, the arrangement being designed to permit an imaging by means of a laser in the first region and to ser... | 12/22/2011 |
| 20110297319 | Reduction of Copper or Trace Metal Contaminants in Plasma Electrolytic Oxidation Coatings A method for creating an oxide layer having a reduced copper concentration over a surface of an object comprising aluminum and copper for use in a semiconductor processing system. The oxide layer produced using a plasma electrolytic oxidation process has a reduced coppe... | 12/08/2011 |
| 20110171425 | FORMATION OF PATTERNED MEDIA BY SELECTIVE ANODIC REMOVAL FOLLOWED BY TARGETED TRENCH BACKFILL A method is disclosed for defining discrete magnetic and non-magnetic regions on the magnetic film layer of a storage media substrate. The method applies anodic oxidation of a cobalt-containing magnetic film layer to remove cobalt, followed by controlled deposition of a... | 07/14/2011 |
| 20110123737 | MARKING OF PRODUCT HOUSINGS Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the mark... | 05/26/2011 |
| 20110089039 | Sub-Surface Marking of Product Housings Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on sub-surfaces of the housings. For example, a housing for a particular product can include an outer housing surf... | 04/21/2011 |
| 20100301010 | ETCHANT COMPOSITIONS AND ETCHING METHOD FOR METALS Cu/Mo The present invention provides an etchant composition suitable for etching metals Cu/Mo, wherein the composition comprises 1 to 25 wt % of hydrogen peroxide on the basis of the total weight of the composition; 0.1 to 15 wt % of amino acid on the basis of the total weigh... | 12/02/2010 |
| 20100282613 | Methods for tailoring the surface topography of a nanocrystalline or amorphous metal or alloy and articles formed by such methods Electrochemical etching tailors topography of a nanocrystalline or amorphous metal or alloy, which may be produced by any method including, by electrochemical deposition. Common etching methods can be used. Topography can be controlled by varying parameters that produce... | 11/11/2010 |
| 20100264036 | MICROSTRUCTURE Disclosed is a microfine structure which can be used as an anisotropic conductive member. Also disclosed is a method for producing such a microfine structure. Specifically disclosed is a microfine structure which is composed of a base having penetrating micropores at a ... | 10/21/2010 |
| 20100137171 | MICROPOROUS LAYER FOR LOWERING FRICTION IN METAL-FORMING PROCESSES The invention is a microporous layer to be used in metal forming processes providing lower friction and improved resistance against galling. The layer is a thin, porous metallic film, which is electrochemically deposited on a metallic substrate, whereafter one of the me... | 06/03/2010 |
| 20080173548 | Chrome plated articles of variable surface appearance A process for applying patterning across the surface of a chrome plated article. The process uses electroplated layers of nickel and chromium in combination with controlled and selectively applied dimpling treatment of coated layers to impart patterns of predefined diff... | 07/24/2008 |
| 20080142367 | In situ plating and etching of materials covered with a surface film Systems and methods for plating and/or etching of hard-to-plate metals are provided. The systems and methods are designed to overcome the deleterious effect of superficial coating or oxide layers that interfere with the plating or etching of certain metal substrates. Th... | 06/19/2008 |
| 20080073114 | TECHNIQUE FOR PLATING SUBSTRATE DEVICES USING VOLTAGE SWITCHABLE DIELECTRIC MATERIAL AND LIGHT ASSISTANCE An electroplating process is performed using a substrate that includes a thickness of voltage switchable dielectric (VSD) material having photoactive components that are dispersed, mixed or dissolved in a binder of the VSD material. A pattern of conductive elements may ... | 03/27/2008 |
| 20070080068 | Method for preparing thermally transmissive anodized surface and products therefrom A process for substantially improving the heat transmission and reflection properties of anodized metals is presented along with a method of improving such properties while allowing for such processed anodized metals to be used for food contact. ... | 04/12/2007 |
| 20050230258 | Apparatus and process for sensing fluoro species in semiconductor processing systems A gas detector and process for detecting a fluorine-containing species in a gas containing same, e.g., an effluent of a semiconductor processing tool undergoing etch cleaning with HF, NF3, etc. The detector in a preferred structural arrangement employs a micr... | 10/20/2005 |
| 20050224358 | Method for improved local planarity control during electropolishing A metal layer formed on a semiconductor wafer is planarized by applying sequentially a deplating step, a plating step, and a relaxation step in a removal cycle. A series of cycles are performed sequentially in one embodiment to comprise a pass. The removal cycle is repe... | 10/13/2005 |
| 20050039949 | Methods for fabricating current-carrying structures using voltage switchable dielectric materials A method is provided for fabricating current-carrying formation on substrates. The method includes providing a substrate including a layer of a voltage switchable dielectric material, forming a mask over the layer of the voltage switchable dielectric material, and formi... | 02/24/2005 |
