Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Application No. | Application Title | Issue Date |
| 20120048740 | ACIDIC GOLD ALLOY PLATING SOLUTION A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.... | 03/01/2012 |
| 20120045691 | CARBON NANOTUBE BASED ELECTRODE MATERIALS FOR HIGH PERFORMANCE BATTERIES Improved battery materials, and a process for producing such improved battery materials are disclosed. The materials and methods employ battery components based on porous lightweight non woven substrate materials that are coated with dispersions comprised of carbon nano... | 02/23/2012 |
| 20110315558 | THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER AND PRODUCTION METHOD OF HYDROGEN PRODUCTION FILTER In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal ... | 12/29/2011 |
| 20110234365 | CHIP RESISTOR HAVING LOW RESISTANCE AND METHOD FOR MANUFACTURING THE SAME The present invention relates to a chip resistor having low resistance and a method for manufacturing the same. The chip resistor includes a substrate, a resistive layer, a pair of conducting layers and at least one protective layer. The substrate has a first surface. T... | 09/29/2011 |
| 20110204021 | METHOD OF MAKING FINE-PITCH CIRCUIT LINES A method of making fine-pitch circuit lines includes steps of preparing an insulative substrate, disposing a conductive metal layer on the insulative substrate, disposing on a whole or a part of a top surface of the conductive metal layer a hetero layer having an etchin... | 08/25/2011 |
| 20110124535 | METHOD FOR PRODUCING SLIDING MEMBER, SLIDING MEMBER, AND SUBSTRATE MATERIAL OF SLIDING MEMBER [Task] In a method, in which a plain bearing alloy layer 3 is bonded to a surface of a backing steel sheet 1, and, a Bi-based overlay layer 10 is then deposited on the plain bearing alloy layer 3 by electroplating, replacement of Bi with the ... | 05/26/2011 |
| 20110101532 | DEVICE FABRICATED USING AN ELECTROPLATING PROCESS A method for fabricating a device includes providing a substrate including at least one contact and applying a dielectric layer over the substrate. The method includes applying a first seed layer over the dielectric layer, applying an inert layer over the seed layer, an... | 05/05/2011 |
| 20110100829 | MULTI MATERIAL SECONDARY METALLIZATION SCHEME IN MEMS FABRICATION Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A fir... | 05/05/2011 |
| 20110072976 | METHOD OF REDUCING THE QUANTITY OF LEAD RELEASED BY BRONZE AND/OR BRASS WATER-SYSTEM COMPONENTS INTO LIQUIDS THAT ARE INTENDED FOR HUMAN CONSUMPTION A method of reducing the quantity of lead released by water-system components made of metal alloys containing lead when they are in contact with liquids intended for making beverages for human use comprises at least the following steps in sequence: 03/31/2011 | |
| 20110056909 | METHODS OF MAKING MEDICAL DEVICES Scaffold-supported metal or pseudometallic film covers suitable for use as medical devices are disclosed together with methods of fabricating the devices. Methods for making the medical devices consist of either providing or forming a scaffold, then depositing a metalli... | 03/10/2011 |
| 20100294654 | MICRO-METAL-MOLD WITH PATTERNS OF GROOVES, PROTRUSIONS AND THROUGH-OPENINGS, PROCESSES FOR FABRICATING THE MOLD, AND MICRO-METAL-SHEET PRODUCT MADE FROM THE MOLD The present invention relates to a micro metal mold for manufacturing micro metal sheet products provided with a fine or micro opening(s) or an aperture(s) together with or independently of a groove(s) and/or a protrusion(s), a method for making the mold by the electrof... | 11/25/2010 |
| 20100261031 | MANUFACTURING METHODS FOR METAL CLAD LAMINATES The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplati... | 10/14/2010 |
| 20100243465 | METHOD OF PRODUCING SURFACE-TREATED METAL MATERIAL AND METHOD OF PRODUCING COATED METAL ITEM A method of producing a surface-treated metal material, comprising: surface treating a metal material using a treatment liquid (1), which comprises from 10 to 10,000 ppm of tin ions and has a pH of 1.0 or greater, and subjecting the metal material that has undergone sur... | 09/30/2010 |
| 20100243463 | Chromium Alloy Coating with Enhanced Resistance to Corrosion in Calcium Chloride Environments The invention consists of a chromium electroplating solution comprising a chromium electroplating solution comprising: (1) a water soluble trivalent chromium salt; (2) at least one complexant for trivalent chromium ions; (3) a source of hydrogen ions sufficient to creat... | 09/30/2010 |
| 20100200407 | ENHANCED TRANSPARENT CONDUCTIVE COATINGS AND METHODS FOR MAKING THEM Transparent conductive coated devices (films, three dimensional objects and others) produced through coating with a nano metal containing emulsion which forms a conductive pattern with enhanced electrical, optical and other properties.... | 08/12/2010 |
| 20100173095 | Inkjet ink and method for making conductive wires using the same An inkjet ink includes a solvent, precious metal ions, a number of carbon nanotubes, and a binder. The carbon nanotubes are disposed in the solvent, and the precious metal ions are adhered to a surface of each of the carbon nanotubes via the binder. A method for making ... | 07/08/2010 |
| 20100155255 | PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueo... | 06/24/2010 |
| 20100155250 | SYNTHESIS OF OIL CONTAINING MICROCAPSULES AND THEIR USE IN FUNCTIONAL COMPOSITE COATINGS Systems and methods for the synthesis of lubricant-containing microcapsules are disclosed. Embodiments of composite nickel and copper coatings containing capsules with liquid lubricating oil cores are also disclosed. In certain embodiments, microcapsules can be incorpor... | 06/24/2010 |
| 20100132978 | WHISKER-FREE COATING STRUCTURE AND METHOD OF FABRICATING THE SAME A whisker-free coating structure and a method for fabricating the same are disclosed. The whisker-free coating structure includes a substrate, a tungsten doped copper layer overlaying the substrate, and a lead-free tin layer overlaying the tungsten doped copper layer.... | 06/03/2010 |
| 20100119701 | Method For Preparing a Conductive Strain Sensor on the Surface of a Device The invention provides a method for preparing a conductive strain sensor on the surface of a device to measure strain at the surface of the device, which method comprises the steps of
| |
| 20100086807 | NICKEL-GOLD PLATEABLE THICK FILM SILVER PASTE, AND PLATING PROCESS FOR LOW TEMPERATURE CO FIRED CERAMIC DEVICES AND LTCC DEVICES MADE THEREFROM Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.... | 04/08/2010 |
| 20100044018 | Porous Layer Heat exchange device with a boiling surface comprising porous surface layer arranged on a solid substrate, the porous surface layer comprises a porous wall structure defining and separating macro-pores that are interconnected in the general direction normal to the surfa... | 02/25/2010 |
| 20100032308 | METALLIZATION PROCESS FOR MAKING FUSER MEMBERS The presently disclosed embodiments are directed to an improved metallization process for making fuser members which avoids the extra steps of metal nanoparticle seeding or special substrate treatment. In embodiments, a metallized substrate, formed by dip-coating or spr... | 02/11/2010 |
| 20090311519 | Metal composite film and process for producing the same A metal composite film having an excellent heat resistance and adhesion, suited for flexible printed circuit boards capable of forming fine wirings, as well as a production process thereof, is disclosed. The metal composite film comprises an insulating film; a thermopla... | 12/17/2009 |
| 20090291319 | COPPER FOIL WITH CARRIER SHEET, METHOD FOR MANUFACTURING COPPER FOIL WITH CARRIER SHEET, SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET AND COPPER-CLAD LAMINATE USING THE SURFACE-TREATED COPPER FOIL WITH CARRIER SHEET An object of the present invention is to provide a copper foil with carrier sheet which permits releasing of the carrier sheet from the copper foil layer even when hot pressing at a temperature exceeding 300° C. is applied in the production of a printed wiring board. I... | 11/26/2009 |
| 20090285976 | METHOD FOR PRODUCING ELECTRICALLY CONDUCTIVE SURFACES ON A SUPPORT Method for producing electrically conductive, structured or full-area surfaces on a support, in which a structured or full-area base layer onto the support in a first step by using a dispersion, which contains electrically conductive particles in a matrix material, the ... | 11/19/2009 |
| 20090263237 | Coated turbine component and method of coating a turbine component Turbine components with different types of coatings on different parts thereof are described. The coatings are chosen such that they are especially adapted to the thermal and corrosive conditions being present on the parts of the component during use. A method to coat a... | 10/22/2009 |
| 20090236128 | PRINTED WIRING BOARD WITH RESIN COMPLEX LAYER AND MANUFACTURING METHOD THEREOF A multilayer printed wiring board is manufactured by a method in which a core substrate is provided, an insulation layer including a thermosetting resin material is formed over the core substrate, an uncured resin layer including a thermoplastic resin material is placed... | 09/24/2009 |
| 20090223701 | POROUS RESIN BASE, METHOD FOR MANUFACTURING SAME, AND MULTILAYER SUBSTRATE A porous resin substrate and a manufacturing method thereof. The substrate comprises a porous resin film having at least one functional part including electrodes or circuits, or both of them, and the porous resin film has a height-altered part, the height of which is di... | 09/10/2009 |
| 20090218230 | METHOD OF PRODUCING ELECTRONIC COMPONENT A method of producing an electronic component includes forming a film of a first metal above a substrate; converting partly the film of the first metal into a film containing a second metal by replacement of at least part of the first metal with the second metal; formin... | 09/03/2009 |
| 20090133745 | PHOTOVOLTAIC CELL COMPRISING A PHOTOVOLTAIC ACTIVE SEMICONDUCTOR MATERIAL The invention relates to a photovoltaic cell comprising a photovoltaically active semiconductor material, wherein the photovoltaically active semiconductor material is a p- or n-doped semiconductor material comprising a binary compound of the formula (I) or a ternary co... | 05/28/2009 |
| 20090023010 | METHOD OF SURFACE MODIFICATION OF POLYIMIDE FILM USING ETHYLENEIMINES COUPLING AGENT, MANUFACTURING METHOD OF FLEXIBLE COPPER CLAD LAMINATE AND ITS PRODUCT THEREBY A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is co... | 01/22/2009 |
| 20080237053 | STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING COBALT AND/OR NICKEL An interconnection structure comprising a substrate having a dielectric layer with a via opening therein; wherein the opening has an underlayer of cobalt and/or nickel therein, barrier layer of an alloy of cobalt and/or nickel; and tungsten is provided.... | 10/02/2008 |
| 20080213420 | Stamper and method of manufacturing the same A stamper includes a stamper body including a nickel having a patterned surface by artificial drawing method, and a surface layer of a nickel-vanadium alloy having a vanadium content of less than 3 atomic percent formed on the patterned surface.... | 09/04/2008 |
| 20080171175 | Diamond Cutting Tool and Manufacturing Method Thereof A manufacturing method of a diamond cutting tool is characterized in that the metal coated diamond particles are arranged on a region of a steel body portion intended to be used as a cutting edge, and then adhered to the body portion through the electro-deposition where... | 07/17/2008 |
| 20080142371 | Method of forming yttrium-modified platinum aluminide diffusion coating A method for forming a modified platinum aluminide coating on a turbine engine component surface includes the step of forming a platinum layer on the turbine engine component surface. A bath is then prepared, including a mixture of a primary alcohol and a tertiary alcoh... | 06/19/2008 |
| 20070175764 | THIN FILM SUPPORT SUBSTRATE FOR USE IN HYDROGEN PRODUCTION FILTER AND PRODUCTION METHOD OF HYDROGEN PRODUCTION FILTER In a through hole closing process, a metal plate is attached to one surface of a conductive base member having a plurality of through holes by the use of a magnet, in a copper plating process, a copper plating layer is formed on the conductive base member and the metal ... | 08/02/2007 |
| 20060163079 | Method for the formation of a good contact surface on an aluminium support bar and support bar The invention relates to a method for achieving a good contact surface on an aluminium electrode support bar used in electrolysis. In the method the support bar is fabricated as a continuous bar and a highly electroconductive layer is formed on its end. The highly elect... | 07/27/2006 |
| 20060153973 | Ruthenium layer formation for copper film deposition In one embodiment, a method for forming a material on a substrate is provided which includes positioning a substrate containing a dielectric material having vias formed therein within a process chamber, forming a barrier layer within the vias and on the dielectric mater... | 07/13/2006 |
| 20060108230 | Method for the formation of a good contact surface on a cathode support bar and support bar The method relates to the obtaining of a good current contact on the support bar of a cathode used in electrolysis. In this method a highly electroconductive layer is formed on the contact piece on the end of the support bar of the cathode, especially at the point that ... | 05/25/2006 |
