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Class 205/112 - Coating is discontinuous single metal or alloy layer (e.g., islands, porous layer, etc.)


Subclass of Class 205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
Definition: Subject matter wherein the coating process is performed
No. of applications: 48
Last issue date: 03/22/2012


1    
Application No.Application TitleIssue Date
20120067731MANUFACTURING METHOD OF ALUMINUM STRUCTURE AND ALUMINUM STRUCTURE
There is provided a manufacturing method of an aluminum structure, including a conductive treatment process of forming an electrically conductive layer made of aluminum on a surface of a resin molded body and a plating process of plating the resin molded body subjected ...
03/22/2012
20120024711COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein the R1 radicals are each independently selected ...
02/02/2012
20120009437LOW HYDROGEN EMBRITTLEMENT ZINC/NICKEL PLATING FOR HIGH STRENGTH STEELS
The invention provides a method for producing a corrosion-resistant article, where the article is conductive and subject to hydrogen uptake during electroplating of a coating. The method comprises electroplating a zinc/nickel coating on the article in an aqueous, basic ...
01/12/2012
20110297550METHOD OF FORMING THE STRUCTURE OF THERMAL RESISTIVE LAYER
The prevent disclosure discloses a structure of thermal resistive layer and the method of forming the same. The thermal resistive structures, formed on a plastic substrate, comprises a porous layer, formed on said plastic substrate, including a plurality of oxides of ho...
12/08/2011
20110278770MOLD, MOLD MANUFACTURING METHOD AND METHOD FOR MANUFACTURING ANTI-REFLECTION FILM USING THE MOLD
A mold of at least one embodiment of the present invention includes: a base; a conductive layer provided on the base; and an anodized film provided on the conductive layer, the anodized film having an inverted motheye structure in its surface, the inverted motheye struc...
11/17/2011
20110117357MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF
A microstructure which has excellent long-term stability and is capable of simple joining by thermocompression bonding at a high joint strength is provided. The microstructure includes an insulating base in which through micropores with a pore size of 10 to 500 nm are d...
05/19/2011
20110100827ANTIREFLECTION FILM, OPTICAL ELEMENT COMPRISING ANTIREFLECTION FILM, STAMPER, PROCESS FOR PRODUCING STAMPER, AND PROCESS FOR PRODUCING ANTIREFLECTION FILM
An antireflection film of the present invention includes a plurality of first raised portions, each of which has a two-dimensional size of not less than 1 μm and less than 100 μm when seen in a direction normal to the film, and a plurality of second raised portions, e...
05/05/2011
20100326710Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same
The present invention relates to nanopillar arrays that may have relatively large dimensions and relatively large interpillar distances. The present invention also relates to methods of forming the same. In some embodiments of the invention, methods of forming hexagonal...
12/30/2010
20100308473METHOD FOR MAKING AN ELECTRICALLY CONDUCTING MECHANICAL INTERCONNECTION MEMBER
A method of fabricating an electrically conductive mechanical interconnection element (12) comprises: a first stage of electrochemically depositing a structure comprising a plurality of metal wires (2a) of sub-micrometric diameter projecting from th...
12/09/2010
20100310903Electrodeposition of hard to deposit materials on aluminum and other substrates using improved water saving mercy cell
The present invention provides an alloy film of Mn or its Fe—Mn is depositable on a metalized alumina ceramic (Al2O3-SiO3) substrate for hermetically sealed glass-metal fusion used for aircraft switch assemblies. The coefficient of the...
12/09/2010
20100307804METHOD FOR CONNECTING A PRECIOUS METAL SURFACE TO A POLYMER
The invention relates to a method for connecting a precious metal surface to a polymer, wherein a layer made of 20% to 40% gold and 80% to 60% silver is deposited on a substrate and the silver is subsequently selectively removed in order to produce a nanoporous gold lay...
12/09/2010
20100263921CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
A circuit board includes: an insulating substrate; and a circuit formed on the insulating substrate. The circuit includes: a undercoat layer with a circuit pattern formed by irradiating a metal thin film covering a surface of the insulating substrate with a laser along ...
10/21/2010
20100247960PATTERNED ECC AND GRADIENT ANISOTROPY MEDIA THROUGH ELECTRODEPOSITION
An electrodeposited magnetic recording medium having multiple coercivity values is disclosed. In some embodiments, layers having different coercivity levels may be separated by exchange coupled composites and in other embodiments a range of coercivity levels are deposit...
09/30/2010
20100183894METHOD FOR COATING A CONSTRUCTION MATERIAL WITH A FUNCTIONAL METAL AND THE PRODUCT MANUFACTURED BY THE METHOD
A method for coating a construction material made of metal alloy with a functional metal. The functional metal is deposited electrolytically on the surface of the construction material selectively so that the deposition occurs on the grain boundaries of the construction...
07/22/2010
20100142124Cathode for Use in a Wet Capacitor
A cathode containing a metal substrate that possesses a micro-roughened surface imparted by spark anodization is provided. The surface is formed by contacting the substrate with an electrolytic solution and applying a voltage to form a dielectric sub-oxide layer. The vo...
06/10/2010
20100097696Sheet glass for microscopy and manufacturing method thereof
A sheet glass for microscopy includes a base plate and a metal pattern configured on the base plate. The structure of the sheet glass increases the throughput, reduces the cost and shortens the distance between grids and targets for keeping grids and targets within the ...
04/22/2010
20100089866Method for producing tapered metallic nanowire tips on atomic force microscope cantilevers
A method of making nanowire probes is provided. The method includes providing a template having a nanoporous structure, providing a probe tip that is disposed on top of the template, and growing nanowires on the probe tip, where the nanowires are grown from the probe ti...
04/15/2010
20100066346Fabrication of microstructures integrated with nanopillars along with their applications as electrodes in sensors
This invention presents microstructures enhanced with nanopillars. The invention also provides ways for manufacturing nanopillar-enhanced microstructures. In some embodiments, the invention also provides methods of use for the nanopillar-enhanced microstructures....
03/18/2010
20100044018Porous Layer
Heat exchange device with a boiling surface comprising porous surface layer arranged on a solid substrate, the porous surface layer comprises a porous wall structure defining and separating macro-pores that are interconnected in the general direction normal to the surfa...
02/25/2010
20100035068Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type
A method for producing a silicon substrate, including the steps of providing a silicon substrate having an essentially planar silicon surface, producing a porous silicon surface having a plurality of pores, in particular having macropores and/or mesopores and/or nanopor...
02/11/2010
20090321712PLASMONIC COUPLING DEVICES
A plasmonic coupling device (1) comprising a first structure (2), and a second structure (3) comprising two or more conductive nanoparticles (7), wherein each nanoparticle is elongate and is attached to the first structure such that it is ori...
12/31/2009
20090266411PHOTOVOLTAIC WIRE
A photovoltaic wire is presented where the active layers coat a metallic wire, preferably aluminum. The active layers are an array of doped silicon nanowires electrically attached to the metallic wire that extend from the surface of the wire into a layer of semiconducti...
10/29/2009
20090243584Fabrication of microstructures integrated with nanopillars along with their applications as electrodes in sensors
This invention presents microstructures enhanced with nanopillars. The invention also provides a novel way for manufacturing nanopillar-enhanced microstructures, using conventional microfabrication techniques. In some embodiments, the invention also provides methods of ...
10/01/2009
20090194914Mold, process for producing mold, and process for producing sheet
A mold comprising alumina having a microscopic pattern, in which distances between adjacent recesses or salients therein are not longer than wavelength of visible light, formed by anodic oxidation on a surface of an aluminum pre-mold without a rolling mark, wherein heig...
08/06/2009
20090188804Plating method
Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power an...
07/30/2009
20090188553Methods of fabricating solar-cell structures and resulting solar-cell structures
Embodiments of the invention relate to methods of fabricating solar-cell structures and resulting solar-cell structures. In one embodiment of a method of fabricating a solar-cell structure, a substrate including a front surface and an opposing back surface is provided. ...
07/30/2009
20090162685Rolled Copper or Copper Alloy Foil with Roughened Surface and Method of Roughening Rolled Copper or Copper Alloy Foil
Provided is a rolled copper or copper alloy foil having a roughened surface formed of fine copper particles, obtained by subjecting a rolled copper or copper alloy foil to roughening plating with a plating bath containing copper sulfate (Cu equivalent of 1 to 50 g/L), 1...
06/25/2009
20090145766ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD, AND PRODUCTION METHOD OF PRINTED WIRING BOARD
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The...
06/11/2009
20090145686PRESSURE WAVE GENERATOR AND PRODUCTION METHOD THEREFOR
A pressure wave generator is provided, which has excellent output stability over time. This pressure wave generator comprises a substrate, a heat generating layer, and a heat insulating layer formed between the substrate and the heat generating layer. A pressure wave is...
06/11/2009
20090057155Process of preparing copper foil for use in fine geometry circuit boards
Process of preparing copper foil for use in fine geometry circuit boards in which spaced apart islands are formed in the copper foil, with the islands being smaller in dimension than crystals in the foil so that most of the islands are single crystals, and the islands a...
03/05/2009
20090053505METHOD OF ELIMINATING AND MONITORING THE ELIMINATION OF ALUMINUM OXIDE AND OTHER MATERIALS AT THE BASE OF PORES IN POROUS ANODIZED ALUMINUM
The present invention is directed to the development of a nanoporous alumina template comprising a multilayer metal film structure that allows for the in situ removal of an electrically insulating barrier layer, thus exposing an electrode at the pore bases. An exemplary...
02/26/2009
20080314753Electrode Surface Coating and Method for Manufacturing the Same
An electrode surface coating and method for manufacturing the electrode surface coating comprising a conductive substrate; and one or more surface coatings comprising one or more of the following metals titanium, niobium, tantalum, ruthenium, rhodium, iridium, palladium...
12/25/2008
20080311362Partial pigmentation of a coating layer to prevent interference on aluminum components or components comprising aluminum
A method for treating the surface of aluminum components or components comprising aluminum includes anodizing the surface.

Anodizing includes introducing at least one pigmenting substance, particularly fully pigmenting substance, into depre...

12/18/2008
20080278029ELECTROLESS PLATING PRODUCTION OF NICKEL AND COLBALT STRUCTURES
A method comprising forming a structural element 115 on a surface 620 of a layer 510 via an electroless plating of nickel or cobalt 130 onto the surface, the layer being rigidly fixed to an underlying substrate 110. The method also com...
11/13/2008
20080223824COLUMNAR STRUCTURED MATERIAL AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a dot pattern includes the steps of preparing a structured material composed of a plurality of columnar members containing a first component and a region containing a second component different from the first component surrounding the columnar ...
09/18/2008
20080035487PROBE AND METHOD OF MAKING SAME
Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of maki...
02/14/2008
20080029399Method of manufacturing nanostructures
A method of manufacturing structures includes a stripping step in which an aluminum member that includes an aluminum substrate and an anodized layer present on a surface of the aluminum substrate and that serves as a cathode is electrolyzed to strip the anodized layer f...
02/07/2008
20080023675Device applications for voltage switchable dielectric material having high aspect ratio particles
One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD materi...
01/31/2008
20070051632Polishing method, polishing apparatus, plating method, and plating apparatus
A polishing method and polishing apparatus able to easily flatten an initial unevenness with an excellent efficiency of removal of excess copper film and suppress damage to a lower interlayer insulation film, and a plating method and plating apparatus able to deposit a ...
03/08/2007
20070045119Methods and apparatus for sorting and/or depositing nanotubes
Methods and apparatus for forming devices using nanotubes. In one embodiment, an apparatus for depositing nanotubes onto a workpiece comprises a vessel configured to contain a deposition fluid having a plurality of nanotubes including first nanotubes having a first char...
03/01/2007
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