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| Application No. | Application Title | Issue Date |
| 20120043216 | Working electrode design for electrochemical processing of electronic components An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The catho... | 02/23/2012 |
| 20110089049 | METHOD, SYSTEM AND DEVICE FOR TREATMENT OF WATER An electrolytic method for treatment of water to increase the dissolved oxygen content, the method including:
| 04/21/2011 |
| 20110000797 | ELECTROCHEMICAL DEVICE AND METHOD FOR LONG-TERM MEASUREMENT OF HYPOHALITES A method and apparatus measures the presence of total residual oxidant species in aqueous environments. More specifically, the apparatus is operable to measure hypohalites (e.g., hypochlorite and hypobromite) in water containing halide salts using electrochemistry. The ... | 01/06/2011 |
| 20070227888 | Microdevice and Method for Separating an Emulsion An active method for decanting the dispersed phase in the continuous phase of an emulsion. According to the method, repulsive forces created by an electric field are used on the drops constituting the dispersed phase. The electric field scans the reservoir containing th... | 10/04/2007 |
| 20060243596 | Uniform current distribution for ECP loading of wafers An electrochemical plating apparatus and method for facilitating uniform current distribution across a wafer during loading into an ECP (electrochemical plating) apparatus is disclosed. The apparatus includes a bath container for containing a bath solution, an anode pro... | 11/02/2006 |
