Did You Know...
...that a workman who left the soap mixing machine on too long was responsible for making Ivory Soap? He was so embarrassed by his mistake that he threw the mess in a stream. Imagine his dismay when the evidence of his error floated to the surface! Result: Ivory soap, the soap that floats.
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| Application No. | Application Title | Issue Date |
| 20120125677 | CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE BY VARIABLE-WIDTH MESH PLANE STRUCTURES A first selection of mesh line segments of a mesh layer are of a first width and a second selection of mesh line segments of the mesh layer are of a second width, wherein the second width is greater than the first width. The second selection of mesh line segments of the... | 05/24/2012 |
| 20120125678 | Electrical Connector The electrical connector may include one or more contacts and a contact substrate. The contact may include a wadded wire element and a sleeve. The electrical connector may be used to connect a first electrical component to a second electrical component. The electrical c... | 05/24/2012 |
| 20120129011 | Printed circuit board and battery pack using the same A printed circuit board includes a base substrate, at least one through-hole in the base substrate, a connection tab extending through the through-hole, an electrical element on the base substrate and adjacent to the through-hole, and at least one groove portion in the ... | 05/24/2012 |
| 20120125669 | PACKAGE CARRIER A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with th... | 05/24/2012 |
| 20120104524 | Wiring Substrate, Imaging Device and Imaging Device Module A imaging device includes a first insulating substrate having a through hole, a connection electrode and a first wiring conductor, a second insulating substrate having outside terminals and a second wiring conductor, and an imaging element including a light-receiving po... | 05/03/2012 |
| 20120103677 | THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF A through wiring substrate includes a substrate including a first face and a second face, and a plurality of through-wires formed by filling, or forming a film of, an electrically-conductive substance in through-holes that penetrate between the first face and the second... | 05/03/2012 |
| 20120106117 | ULTRA-THIN INTERPOSER ASSEMBLIES WITH THROUGH VIAS A 3D interconnect structure comprising an ultra-thin interposer having a plurality of ultra-high density of through-via interconnections defined therein. The 3D interposer electrically connects first and second electronic devices in vertical dimension and has the same o... | 05/03/2012 |
| 20120080223 | PRINTED CIRCUIT BOARD There is provided a printed circuit board including an insulating substrate having a guide hole, a solder resist layer coated on a surface of the insulating substrate, and a connection pad arranged on the surface of the insulating substrate and having an outer periphery... | 04/05/2012 |
| 20120049343 | CONDUCTIVE CONNECTION STRUCTURE WITH STRESS REDUCTION ARRANGEMENT FOR A SEMICONDUCTOR DEVICE, AND RELATED FABRICATION METHOD A semiconductor device disclosed herein includes a conductive connection structure having a stepped profile that serves as a stress relief feature. The conductive connection structure includes a stress buffer arrangement for a contact pad. The stress buffer arrangement ... | 03/01/2012 |
| 20120051016 | SEMICONDUCTOR SOCKET A semiconductor socket including a substrate with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete contact members are located in the plurality of the through holes. The plurality of contact members each include a ... | 03/01/2012 |
| 20120052695 | ELECTRICAL CONNECTOR ASSEMBLY An electrical connector assembly includes a circuit board and an electrical connector mounted on the circuit board. The circuit board has a circuit board body having first and second surfaces and through-holes bored between the first and second surfaces. The circuit boa... | 03/01/2012 |
| 20120048603 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME A printed circuit board comprises a circuit substrate, an electrically conductive cloth structure, and a shielding structure. The circuit substrate comprises a base layer, a grounded circuit layer, and a connecting pad formed on the grounded circuit layer. The cloth str... | 03/01/2012 |
| 20120048703 | Printed circuit board and method for avoiding electromagnetic interference A printed circuit board, especially for a computer keypad, and method for avoiding electromagnetic interference include conductive signal traces positioned on a surface of one of a nonconductive layer that is other than the outward facing surface of an outer nonconducti... | 03/01/2012 |
| 20120043121 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first circuit layer including a first metal layer and a first plating layer provided on an outer side of the first metal layer... | 02/23/2012 |
| 20120043123 | PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD [Subject Matter] To provide a printed wiring board in which no warping occurs even if interlayer insulation layers without core material are laminated on a core substrate. [Solution(s)] To lower the thermal expansion coefficient (CTE) to 20... | 02/23/2012 |
| 20120037412 | Method for producing an electrical feedthrough in a substrate, and substrate having an electrical feedthrough A method is described for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough. The method has the following operations of forming the electrical feedthrough so that it extends through the substrate from the front side to ... | 02/16/2012 |
| 20120039056 | Component arrangement and method for production thereof The invention relates to a component arrangement with a first substrate and at least one second substrate arranged on the first substrate, wherein the first substrate has at least one first contact element and the at least one second substrate has at least one second co... | 02/16/2012 |
| 20120039053 | SYSTEM AND METHOD FOR COUPLING A BATTERY WITHIN AN EMBEDDED SYSTEM A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.... | 02/16/2012 |
| 20120031660 | METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD A circuit board having a plurality of first holes formed in a semiconductor substrate to extend therethrough; insulating layers formed on a back surface of the semiconductor substrate in the plurality of first holes, the insulating layers between the back surface and th... | 02/09/2012 |
| 20120024585 | Electrical Connector, Electrical Connection System and Lithographic Apparatus An electrical connector comprises a high voltage pad and a high voltage plate. When connected to another electrical connector, the two plates, which are at the same voltage as the pads, form a region of high voltage in which the field is low. The pads are positioned in ... | 02/02/2012 |
| 20120018208 | COUPLER APPARATUS According to one embodiment, a coupler apparatus includes a coupling element and a ground plane. The coupling element comprises a conductive material and configured to be subjected to power feeding to a feeding point. The ground plane comprises a conductive material and... | 01/26/2012 |
| 20120019106 | ULTRASONIC ARRAY TRANSDUCER, ASSOCIATED CIRCUIT AND METHOD OF MAKING THE SAME A transducer system includes a multi-layer flexible circuit. The flexible circuit includes a first layer, a second layer and a third layer. The circuit engages a piezoelectric material/electrode subassembly. Vias are used to operatively connect ground electrodes of indi... | 01/26/2012 |
| 20120012379 | Printed circuit board A printed circuit board including: an insulation layer; a first pattern buried in one surface of the insulation layer; a first resin layer laminated on one surface of the insulation layer to cover the first pattern; a second pattern buried in the other surface of the in... | 01/19/2012 |
| 20120012378 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circ... | 01/19/2012 |
| 20120006591 | Wiring Substrate and Method for Manufacturing Wiring Substrate A wiring substrate that prevents the occurrence of delamination near an interface between an insulation layer and an electrode pad, which is formed in a recess of the insulation layer. An adjustment layer is formed in an opening in a resist, which is applied to a suppor... | 01/12/2012 |
| 20120003848 | HIGH DATA RATE CONNECTOR SYSTEM A connector and circuit board assembly includes terminals in a connector that are mounted to vias in a circuit board. Signal and ground terminals are thus coupled to signal traces and ground planes in the circuit board. Additional pinning vias that are aligned with the ... | 01/05/2012 |
| 20110316167 | ELECTRICAL INTERCONNECT FOR AN INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME An interconnect assembly for an embedded chip package includes a dielectric layer, first metal layer comprising upper contact pads, second metal layer comprising lower contact pads, and metalized connections formed through the dielectric layer and in contact with the up... | 12/29/2011 |
| 20110304026 | VIA AND METHOD OF VIA FORMING AND METHOD OF VIA FILLING An electronic or micromechanical device having first (11) and second (12) surfaces and a via extending through the device from the first surface to the second surface. The via comprises integrally formed first (84, 86), second (82) and third ... | 12/15/2011 |
| 20110303452 | Electromagnetic bandgap structure and printed circuit board An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second diele... | 12/15/2011 |
| 20110297432 | PRINTED CIRCUIT BOARD A printed circuit board includes signal layers, ground layers, and a power layer, which are superposed. A closed trace is set along edges of each of the signal layers and the power layers. A number of vias are defined in each trace at intervals. Each via extends through... | 12/08/2011 |
| 20110292296 | TELEVISION APPARATUS, ELECTRONIC DEVICE, AND CIRCUIT BOARD STRUCTURE According to one embodiment, a television apparatus includes a circuit board, a pad, a heat-transfer layer, and a block. The circuit board is mounted with an electronic component. The pad is provided on a surface of the circuit board. The heat-transfer layer is formed o... | 12/01/2011 |
| 20110290545 | THROUGH WIRING BOARD AND METHOD OF MANUFACTURING THE SAME A through wiring board provided with through wiring extending through the through hole of the board. The through wiring board comprises a through hole made through the board, through extension wiring provided in the through hole and extending on one side of the through ... | 12/01/2011 |
| 20110284273 | POWER CORE FOR USE IN CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAME A power core adapted for use as part of a circuitized substrate, e.g., a PCB or LCC. The core includes a first layer of low expansion dielectric and two added layers of a different low expansion dielectric bonded thereto, with two conductive layers positioned on the two... | 11/24/2011 |
| 20110284275 | CIRCUIT BOARD HAVING GROWN METAL LAYER IN A FLEXIBLE ZONE A circuit board has a grown metal layer in a flexible zone. A circuit board has a first part, a second part and a recess in the circuit board that is arranged between the first part and the second part. A thickness of the circuit board reduced in the region of the reces... | 11/24/2011 |
| 20110286189 | METHOD OF FABRICATING WIRING BOARD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE A method of fabricating a wiring board includes forming a resist layer, such as a solder or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed. An electrode is formed directly on the support board wit... | 11/24/2011 |
| 20110266038 | PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrical... | 11/03/2011 |
| 20110266044 | Thin Film Circuit Board Device A thin film circuit board device includes a multi-layered circuit unit that includes an upper circuit layer, a lower circuit layer and an insulation layer. The upper circuit layer has at least one first contact part. The lower circuit layer is disposed below the upper c... | 11/03/2011 |
| 20110253430 | MICRO PIN HYBRID INTERCONNECT ARRAY AND METHOD OF MANUFACTURING SAME A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal an... | 10/20/2011 |
| 20110253435 | MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE A multilayer three-dimensional circuit structure and a manufacturing method thereof are provided in the present invention. The manufacturing method includes following steps. First, a three-dimensional insulating structure is provided. A first three-dimensional circuit s... | 10/20/2011 |
| 20110253439 | CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the... | 10/20/2011 |
