Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20120125670 | Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT In an electronic component having a wiring and/or an electrode prepared through firing of a paste or in an electronic component having a wiring in contact with a glass or glass ceramic member, provided is an electronic component using a Cu-based wiring material which le... | 05/24/2012 |
| 20120128996 | METAL NANOBELT AND METHOD OF MANUFACTURING THE SAME, AND CONDUCTIVE INK COMPOSITION AND CONDUCTIVE FILM COMPRISING THE SAME The present invention relates to a metal nanobelt and a method of manufacturing the same, and a conductive ink composition and a conductive film including the same. The metal nanobelt can be easily manufactured at a normal temperature and pressure without requiring the ... | 05/24/2012 |
| 20120125669 | PACKAGE CARRIER A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with th... | 05/24/2012 |
| 20120125668 | WIRING STRUCTURE FOR IMPROVING CROWN-LIKE DEFECT AND FABRICATION METHOD THEREOF A wiring structure for improving a crown-like defect and a fabrication method thereof are provided. The method includes the following steps. A substrate, on which a seed layer and a patterned photoresist layer with an opening are formed, is provided. A copper layer, hav... | 05/24/2012 |
| 20120103668 | Chip Package A chip package includes a conductive connection block connected to the conductive layer coated on the base and the two ends of the gold wire are respectively connected to the chip and the connection block. The connection block prevents lamination during packaging and en... | 05/03/2012 |
| 20120103669 | METAL TRANSPARENT CONDUCTORS WITH LOW SHEET RESISTANCE The present invention relates to a transparent electrode comprising an ultra thin metal conductor (2) with a thickness between 1 nm and 10 nm and a metal grid in contact with the ultra thin metal conductor (3), the metal grid comprising openings. The inven... | 05/03/2012 |
| 20120103665 | METHOD OF PROTECTING A PRINTED CIRCUIT BOARD AND RELATED APPARATUS According to one example there is a printed circuit board having a first surface and a solder mask over said first surface. There is a layer of sealing material having a shape and location covering a zone of the solder mask which is vulnerable to degradation.... | 05/03/2012 |
| 20120103666 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME An electronic device includes a first substrate on which a thin-film circuit layer is provided at a side of a first face, a second substrate on which a wiring layer is provided, and an isotropic conductive material which electrically connects a terminal portion of the t... | 05/03/2012 |
| 20120103667 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME A method of manufacturing a wiring substrate, includes forming a laminated body in which a nickel copper alloy layer is formed via an insulating resin layer, on a first wiring layer, forming a via hole reaching the first wiring layer in the nickel copper alloy layer and... | 05/03/2012 |
| 20120080218 | TRANSPARENT CONDUCTIVE FILM HAVING HIGH OPTICAL TRANSMITTANCE AND METHOD FOR MANUFACTURING THE SAME The present invention pertains to a transparent conductive film including a conductive layer having different thicknesses so as to increase the optical transmittance while maintaining the conductivity of the transparent conductive film. The present invention also pertai... | 04/05/2012 |
| 20120067629 | SOLDER ADHESIVE AND A PRODUCTION METHOD FOR THE SAME, AND AN ELECTRONIC DEVICE COMPRISING THE SAME The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 30... | 03/22/2012 |
| 20120069538 | PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD ASSEMBLY SHEET AND METHOD OF MANUFACTURING THE SAME A determination mark formation portion is provided in each suspension board. In the determination mark formation portion, a recess having a given depth is provided in a base insulating layer. An outer peripheral portion is formed on the base insulating layer to surround... | 03/22/2012 |
| 20120067630 | CIRCUIT STRUCTURE OF CIRCUIT BOARD A circuit structure of a circuit board includes a dielectric layer, a number of first circuits, and a number of second circuits. The dielectric layer has a surface and an intaglio pattern. The first circuits are disposed on the surface of the dielectric layer. The secon... | 03/22/2012 |
| 20120067628 | PRINTED WIRING BOARD A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation... | 03/22/2012 |
| 20120048601 | PRINTED CIRCUIT BOARD A printed circuit board includes a power layer, a ground layer, a signal layer, and a backboard. The backboard is arranged below the signal layer opposite to the ground layer. A number of vias are formed from the backboard through the signal layer, and then connected to... | 03/01/2012 |
| 20120048602 | METHOD OF MANUFACTURING CERAMIC SUBSTRATE FOR PROBE CARD AND CERAMIC SUBSTRATE FOR PROBE CARD There is provided a method of manufacturing a ceramic substrate for a probe card and a ceramic substrate for a probe card. The method includes preparing a ceramic substrate having a via electrode provided therein; filling a void formed between the ceramic substrate and ... | 03/01/2012 |
| 20120049384 | Buffer Layer to Enhance Photo and/or Laser Sintering Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned meta... | 03/01/2012 |
| 20120048603 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME A printed circuit board comprises a circuit substrate, an electrically conductive cloth structure, and a shielding structure. The circuit substrate comprises a base layer, a grounded circuit layer, and a connecting pad formed on the grounded circuit layer. The cloth str... | 03/01/2012 |
| 20120043119 | COMPOSITE POLYMER-METAL ELECTRICAL CONTACTS An array of composite polymer-metal contact members adapted to form solder free electrical connections with a first circuit member. The contact members include a resilient polymeric base layer and an array of metalized traces printed on selected portions of the base lay... | 02/23/2012 |
| 20120044652 | TERMINAL STRUCTURE, PRINTED WIRING BOARD, MODULE SUBSTRATE, AND ELECTRONIC DEVICE The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer... | 02/23/2012 |
| 20120043120 | Dual-Layer Method of Fabricating Ultracapacitor Current Collectors A method of making a multi-layer current collector comprises forming a first layer from a first formulation over each major surface of a current collector substrate, and forming a second layer from a second formulation over each of the first layers, wherein one of the f... | 02/23/2012 |
| 20120043121 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first circuit layer including a first metal layer and a first plating layer provided on an outer side of the first metal layer... | 02/23/2012 |
| 20120043122 | BOARD WITH FINE PITCH BUMP AND METHOD OF MANUFACTURING THE SAME Disclosed herein are a board with a fine pitch bump and a method of manufacturing the same. The method of manufacturing a board with a fine pitch bump includes: forming a solder resist layer by stacking a solder resist on a core layer having a circuit pattern formed the... | 02/23/2012 |
| 20120037408 | METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plur... | 02/16/2012 |
| 20120037409 | METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD OBTAINED THEREBY In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging cop... | 02/16/2012 |
| 20120031656 | SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHODS FOR PRODUCING SAME Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil l... | 02/09/2012 |
| 20120031653 | Printed Circuit Board made from a Composite Material Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.... | 02/09/2012 |
| 20120024579 | BENDABLE CIRCUIT STRUCTURE FOR LED MOUNTING AND INTERCONNECTION This invention is directed to bendable circuit substrate structures useful for LED mounting and interconnection.... | 02/02/2012 |
| 20120026708 | CARRIER SUBSTRATE AND METHOD FOR MAKING THE SAME A carrier substrate includes a substrate having a chip side and a PCB side, a plurality of bond pads disposed on the chip side for bonding a chip, a plurality of land grid array (LGA) pads disposed on the PCB side, and a plurality of resilient flanges installed on the P... | 02/02/2012 |
| 20120018200 | TRANSPARENT CONDUCTIVE FILM FOR TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME Disclosed herein are a transparent conductive film for a touch panel and a method for manufacturing the same. A transparent conductive film 100 for a touch panel according to the present invention includes a transparent substrate 110: a plurality of silver... | 01/26/2012 |
| 20120018199 | PRINTED CIRCUIT BOARD A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole a... | 01/26/2012 |
| 20120014017 | SUSPENSION SUBSTRATE, SUSPENSION, HEAD SUSPENSION, HARD DISK DRIVE, METHOD FOR MANUFACTURING SUSPENSION SUBSTRATE, AND METHOD FOR TESTING CONTINUITY OF SUSPENSION A suspension substrate according the present invention includes: an insulating layer; a metallic support layer provided on the actuator element's side of the insulating layer. A wiring layer is provided on the other side of the insulating layer. This wiring layer includ... | 01/19/2012 |
| 20120012370 | TRANSPARENT CONDUCTIVE LAMINATE AND TOUCH PANEL THEREWITH A transparent conductive laminate comprising a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate; and a transparent base substrate bonded to another side of the transparent film substrate with a transpa... | 01/19/2012 |
| 20120012153 | CONNECTION SHEET FOR SOLAR BATTERY CELL ELECTRODE, PROCESS FOR MANUFACTURING SOLAR CELL MODULE, AND SOLAR CELL MODULE Disclosed is a connection sheet for a solar battery cell electrode, which is a polymer sheet for use in the connection between an electrode for extracting an electric power from a solar battery cell and a wiring member through an electrically conductive adhesive materia... | 01/19/2012 |
| 20120012373 | Submount and Method of Manufacturing the Same A submount with an electrode layer having excellent wettability in soldering and method of manufacturing the same are disclosed. A submount (1) for having a semiconductor device mounted thereon comprises a submount substrate (2), a substrate protective lay... | 01/19/2012 |
| 20120012372 | Method and Structure to Improve the Conductivity of Narrow Copper Filled Vias Techniques for improving the conductivity of copper (Cu)-filled vias are provided. In one aspect, a method of fabricating a Cu-filled via is provided. The method includes the following steps. A via is etched in a dielectric. The via is lined with a diffusion barrier. A ... | 01/19/2012 |
| 20120014073 | CONDUCTIVE NANOPARTICLE SUBSTRATE AND METHOD OF MANUFACTURE A device comprising a substrate with first and second layers is prepared by applying a cellulosic base layer on the substrate followed by a silver nanoparticle coating. The nanoparticle coating is durable and highly electrically conductive. This conductive substrate may... | 01/19/2012 |
| 20120006586 | SUSPENSION SUBSTRATE, SUSPENSION, HEAD SUSPENSION, AND HARD DISK DRIVE A suspension substrate according to the present invention includes an insulating layer and a metallic support layer provided on the actuator element's side of the insulating layer. On the other side of the insulating layer, a wiring layer is provided. This wiring layer ... | 01/12/2012 |
| 20120006584 | WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE A wiring board of the present invention (1) is arranged so that: pads (30) arranged in a plurality of rows include: first-row pads (30a) connected to first metal wires (10a) among metal wires (10); and second-row pads ( 01/12/2012 | |
| 20120006585 | TOUCH PANEL A touch panel includes first and second substrates, and first insulating layer disposed therebetween. The first substrate has, on its bottom surface, a first conductive layer having opposing first and second sides; a first electrode along the first side; and a second el... | 01/12/2012 |
