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| Application No. | Application Title | Issue Date |
| 20120127666 | Heat-Radiating Substrate and Method Of Manufacturing The Same Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a c... | 05/24/2012 |
| 20120080216 | Brazing Material, Heat Dissipation Base Using the Same, and Electronic Device Provided are a brazing material capable of being restrained from protruding unnecessarily in a joint region; a heat dissipation base having a high reliability of electric insulation, and does not easily cause a short circuit even when the base dissipates heat repeatedly... | 04/05/2012 |
| 20120069523 | SYSTEM AND METHOD OF FORMING A PATTERNED CONFORMAL STRUCTURE A system and method of forming a patterned conformal structure for an electrical system is disclosed. The conformal structure includes a dielectric coating shaped to conform to a surface of an electrical system, with the dielectric coating having a plurality of openings... | 03/22/2012 |
| 20120067623 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-ra... | 03/22/2012 |
| 20120048596 | Structure And Process For Electrical Interconnect And Thermal Management A method for making a structure for thermal management of circuit devices. The method provides a first substrate and a second substrate where at least one of the first and second substrates includes a circuit element. The method forms in at least one of the first substr... | 03/01/2012 |
| 20120037404 | PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN AND METHOD OF FABRICATING THE SAME A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces th... | 02/16/2012 |
| 20120031652 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF A circuit board includes a metal pattern layer, a thermally conductive plate, an electrically insulating layer, and at least one electrically insulating material. The thermally conductive plate has a plane. The electrically insulating layer is disposed between the metal... | 02/09/2012 |
| 20120031651 | CIRCUIT BOARD A circuit board including a circuit layer, a thermally conductive substrate, an insulation layer, and at least one thermally conductive material is provided. The thermally conductive substrate has a plane. The insulation layer is disposed between the circuit layer and t... | 02/09/2012 |
| 20120024575 | THERMAL PAD AND METHOD OF FORMING THE SAME A thermal pad (602, 612, 622, 702, 712) formed on a Printed Circuit Board and a method (900) of formed the thermal pad (602, 612, 622, 702, 712) are provided. The thermal pad (602, 612, 622, 702, 712) comprises in its interior one or more coi... | 02/02/2012 |
| 20110303437 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a secon... | 12/15/2011 |
| 20110304990 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a seco... | 12/15/2011 |
| 20110297427 | PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a metal layer divided into a plurality of regions; a build-up layer formed on at least one surface of the metal layer; and a penetrating part penetrat... | 12/08/2011 |
| 20110299250 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connecti... | 12/08/2011 |
| 20110284271 | HEAT SINK A heat sink capable of being surface-mounted, the heat sink having a 3D shape and comprising a body made of metal, having a rear side which is horizontal and a front side which is at least partially horizontal, such that the front side is partially surface-mounted on a ... | 11/24/2011 |
| 20110284272 | PRINTED CIRCUIT BOARD PROVIDING HEAT DISSIPATION A printed circuit board includes an insulated base sheet, a heat-conducting layer, an insulated layer, a plurality of heat-conducting blocks, and a plurality of bonding pads. The heat-conducting layer is disposed on the insulated base sheet. The insulated layer is parti... | 11/24/2011 |
| 20110284914 | METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE A substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, comprising:an insulating layer which is composed of a resin containing heat conductive fillers under the mounting position ... | 11/24/2011 |
| 20110272179 | Printed Circuit Board with Embossed Hollow Heatsink Pad A printed circuit board includes a dielectric layer having a first surface and an opposing second surface and a circuit layer laminated to the first surface of the dielectric layer. Cut-out windows provide openings through the dielectric and circuit layers. A thermally ... | 11/10/2011 |
| 20110253423 | PRINTED CIRCUIT BOARD WITH FINS AND METHOD FOR MANUFACTURING SAME A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The f... | 10/20/2011 |
| 20110247861 | ELECTRONIC DEVICE AND LATCHING MECHANISM THEREOF An exemplary electronic device includes a circuit board defining apertures therein, an electronic component arranged on the circuit board and surrounded by the apertures, a heat spreader arranged on the electronic component, and a latching mechanism fixing the heat spre... | 10/13/2011 |
| 20110226512 | Heatsink Device Having A Rapid Heatsink Effect A heatsink device includes a heatsink body and at least one heatsink member. The heatsink member is made of a metallic material different from that of the heatsink body. The heatsink member is combined with the heatsink body by a friction welding machine without needing... | 09/22/2011 |
| 20110228484 | ELECTRICAL COMPONENT THERMAL MANAGEMENT Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is... | 09/22/2011 |
| 20110214904 | Heat Sink, Cooling Module And Coolable Electronic Board A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a su... | 09/08/2011 |
| 20110204409 | hBN INSULATOR LAYERS AND ASSOCIATED METHODS Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided including a substrate and an electrically insulating layer coated on at least o... | 08/25/2011 |
| 20110186335 | CIRCUIT BOARD WITH HEAT DISSIPATING STRUCTURE AND MANUFACTURING METHOD THEREOF The circuit board with a heat dissipating structure is provided. A first grounding conductor layer is formed on a first surface of a substrate. A first insulting layer is formed on the first grounding conductor layer and defines a number of circuit element pin openings ... | 08/04/2011 |
| 20110176277 | SILICON NITRIDE SINTERED BODY, METHOD OF PRODUCING THE SAME, AND SILICON NITRIDE CIRCUIT SUBSTRATE AND SEMICONDUCTOR MODULE USING THE SAME Provided are a silicon nitride substrate made of a silicon nitride sintered body that is high in strength and thermal conductivity, a method of producing the silicon nitride substrate, and a silicon nitride circuit substrate and a semiconductor module that use the silic... | 07/21/2011 |
| 20110155425 | Underfill film having thermally conductive sheet An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board an... | 06/30/2011 |
| 20110156083 | Light emission module with high-efficiency light emission and high-efficiency heat dissipation and applications thereof A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plu... | 06/30/2011 |
| 20110122336 | MULTI-LAYER PRINTED CIRCUIT BOARD AND LIQUID CRYSTAL DISPLAY DEVICE HAVING THE SAME A PCB and an LCD device with the same are disclosed. The PCB and the LCD device force an LED to directly contact either a heat radiation member or a metal plate. As such, heat generated in the LED is directly transferred to the heat radiation member or the metal plate w... | 05/26/2011 |
| 20110114369 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both ... | 05/19/2011 |
| 20110110059 | APPARATUS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES An apparatus is disclosed that may include a printed circuit board (PCB) and an electronics package may be disposed about the first surface of the PCB. The PCB may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between mult... | 05/12/2011 |
| 20110100681 | SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES In a circuit module having components that are fastened to a substrate, the substrate includes a carrier layer made of metal and having a first surface, a first insulating layer bordering directly on the carrier layer being situated on the first surface. The substrate a... | 05/05/2011 |
| 20110088928 | HEAT DISSIPATING SUBSTRATE Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the m... | 04/21/2011 |
| 20110067902 | HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame la... | 03/24/2011 |
| 20110061901 | HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and fille... | 03/17/2011 |
| 20110061902 | Circuit board and method of manufacturing the same There is provided a circuit board. The circuit board according to an aspect of the invention may include: an insulating base body; a plurality of circuit patterns including a first conductive pattern and a second conductive pattern facing the first conductive pattern at... | 03/17/2011 |
| 20110017496 | POWER MODULE SUBSTRATE HAVING HEATSINK, METHOD FOR MANUFACTURING THE SAME, POWER MODULE HAVING HEATSINK, AND POWER MODULE SUBSTRATE A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected ... | 01/27/2011 |
| 20110011628 | HIGHLY THERMAL CONDUCTIVE CIRCUIT BOARD A highly thermal conductive circuit board includes a composite substrate, and a metal layer, an insulating layer, and a conductor layer sequentially disposed on the composite substrate. When at least one electronic element is electrically disposed on the conductor layer... | 01/20/2011 |
| 20110005810 | INSULATING SUBSTRATE AND METHOD FOR PRODUCING THE SAME An insulating substrate 1 includes an electrically insulative layer 2, a wiring layer 3 formed on one side of the electrically insulative layer 2 and formed of a spark plasma sintered body of an electrically conductive material powder, and a ... | 01/13/2011 |
| 20110000701 | Ceramic elements module and manufacturing method thereof The present invention relates to a ceramic elements module and a manufacturing method thereof. There is provided a ceramic elements module, including: a ceramic elements that has a plurality of lower inserting grooves; an electronic component that is mounted on a lower ... | 01/06/2011 |
| 20110001418 | HIGH HEAT DISSIPATION ELECTRIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF The present invention relates to a high heat dissipation electric circuit board, comprises: an electric conductive wiring layer serving to be installed with at least one electronic unit, on which a wiring is formed for being connected to the electronic unit; an insulati... | 01/06/2011 |
