"To place a man in a multi-stage rocket and project him into the controlling gravitational field of the moon where the passengers can make scientific observations, perhaps land alive, and then return to earth--all that constitutes a wild dream worthy of Jules Verne. I am bold enough to say that such a man-made voyage will never occur regardless of all future advances."
|Application No.||Application Title||Issue Date|
|20080180906||HEATSINK THERMAL MODULE WITH NOISE IMPROVEMENT|
The invention provided a heatsink thermal module with noise improvement, which has a heatsink thermal module additionally consisting of a heat pipe, a heatsink fins set and a fan module; the fan module is combined with the heatsink fins set which consists of multiple he...
A fan cover for being mounted onto a heat sink fan with a casing is disclosed, wherein a plurality of openings are formed in the casing of the fan. The fan cover includes fan-cover body and an elastic integration unit mounted on the fan-cover body. The integration unit ...
|20060254790||Cooling unit having heat radiating portion, through which liquid coolant flows and electronic apparatus equipped with cooling unit|
A cooling unit includes a heat receiving portion thermally connected to a heat generating component, a heat radiating portion which radiates heat generated by the heat generating component, and a circulation path which circulates a liquid coolant between the heat receiv...
|20060005980||Thermal management system and method for electronics system|
A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading ...
|20060002089||Attaching heat sinks to printed circuit boards using preloaded spring assemblies|
A bottom loaded assembly for securing heat sinks to printed circuit boards may use a preloaded spring. The preloaded spring may be positioned on one side of the printed circuit board and the heat sink may be positioned on the opposite side. ...
|20050117296||Ball grid array package with heat sink device|
The present invention provides the heat sink device for the ball grid array package to improve the heat dissipation. The heat sink device includes a first part of heat sink assembly that comprises a heat dissipating element above the heat sink body and is used to increa...