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| Application No. | Application Title | Issue Date |
| 20120107664 | BATTERY MODULE OF IMPROVED COOLING EFFICIENCY Disclosed herein is a battery module configured to have a structure in which a plurality of plate type battery cells is mounted in a module case so that the battery cells are arranged adjacent to one another. The battery module includes a plurality of insulative members... | 05/03/2012 |
| 20110315344 | INTERLEAVED, IMMERSION-COOLING APPARATUS AND METHOD FOR AN ELECTRONIC SUBSYSTEM OF AN ELECTRONICS RACK Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fl... | 12/29/2011 |
| 20110232864 | COMPACT TWO SIDED COLD PLATE WITH THREADED INSERTS A structural cold plate assembly includes a support structure including first and second opposite sides supporting corresponding cold plates and an insert. The insert defines a portion of a fluid passage through the support structure and secures the cold plate to the su... | 09/29/2011 |
| 20110232863 | INTEGRAL COLD PLATE AND STRUCTURAL MEMBER A cold plate assembly is provided having a cold plate with a generally planar member that provides a support surface. The support surface is configured to support a heat generating device. A structural member provides attaching features that are configured to secure the... | 09/29/2011 |
| 20110127007 | COOLING DEVICE AND METHOD FOR THE MANUFACTURING THEREOF A cooling device comprises a main body (4) and an adapter device (5) arranged at an end (4a) of the main body. The main body is provided with a plurality of channels (6, 7) running from one to the other one of the oppositely located en... | 06/02/2011 |
| 20110114289 | Cold chassis for electronic modules and method of making same A cold chassis and method of making a cold chassis for electronic modules featuring the fabrication of individual brazed cooling ribs each including microchannels along the length thereof and a peripheral flange. A set of adjacent ribs are secured together and assembled... | 05/19/2011 |
| 20110056675 | APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a ... | 03/10/2011 |
| 20100326626 | Heat Sink Assembly A heat sink assembly including a first member having a heat transfer surface adapted to directly contact a device to be cooled; a second member including coolant channels and a separate fluid channel; and a connection which at least partially mechanically connects the f... | 12/30/2010 |
| 20100300652 | Heat Dissipating System A heat dissipating system includes an electronic device, a refrigeration device, a thermal connector, a cold plate, and a pipe. The cold plate is located in the electronic device for absorbing the heat. The refrigeration device is capable of refrigerating a coolant. The... | 12/02/2010 |
| 20100243716 | Enhanced Connector Cradle Having a Cooling Shell for Preferential Cooling of Wafers A method, system and apparatus for preferential cooling of an electrical circuit board via a cradle having a cooling shell. An enhanced connector cradle enables the secure and precise placement of a connector on a circuit board by using a cooling component which selecti... | 09/30/2010 |
| 20100155024 | Liquid cooling system In some embodiments, a cooling device may be mounted to a portion of a chassis of an electronic system, wherein the cooling device may be releasably and pivotably attached to the chassis in at least an open position to permit access to components within the electronic s... | 06/24/2010 |
| 20100101771 | HEATED COOLING PLATE FOR E-CHUCKS AND PEDESTALS A method and apparatus for controlling the temperature of a substrate support assembly includes a pedestal, a chuck connected to the pedestal, a cooling plate structure thermally coupled with the chuck, a heater thermally coupled with the cooling plate structure, and a ... | 04/29/2010 |
| 20100101759 | APPARATUS AND METHOD FOR FACILITATING IMMERSION-COOLING OF AN ELECTRONIC SUBSYSTEM Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed ... | 04/29/2010 |
| 20100084117 | PLATEN COOLING MECHANISM FOR CRYOGENIC ION IMPLANTING A system and method for altering and maintaining the temperature of a workpiece, especially at cryogenic temperatures, is disclosed. The platen on which the workpiece is located contains at least one inner conduit through which fluid can flow. An apparatus, in communica... | 04/08/2010 |
| 20100071876 | COLD PLATE APPARATUS WITH A CONTROLLED HEAT TRANSFER CHARACTERISTIC BETWEEN A METALLURGICALLY BONDED TUBE AND HEAT SINK FOR FACILITATING COOLING OF AN ELECTRONICS COMPONENT A cold plate apparatus is provided which includes a tube formed of a first metal, a casted heat sink member formed of a second metal surrounding a heat transfer region of the tube, and an alloy layer disposed between the tube and the heat sink member. The tube has its f... | 03/25/2010 |
| 20100066399 | MINIATURE FLUID-COOLED HEAT SINK WITH INTEGRAL HEATER A temperature control device that includes a miniature liquid-cooled heat sink with integral heater and sensing elements is used as part of a system to provide a controlled temperature surface to an electronic device, such as a semiconductor device, during the testing p... | 03/18/2010 |
| 20100039117 | TEMPERATURE CONTROL SYSTEM FOR A DEVICE UNDER TEST A temperature control system for an optical microscope for inspecting an integrated circuit device under test (DUT) that includes a first fluid circulation system coupled to and supplying fluid to fluid injectors that spray fluid on the DUT and a second fluid circulatio... | 02/18/2010 |
| 20100038058 | HEAT SINK AND COOLING AND PACKAGING STACK FOR PRESS-PACKAGES A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The... | 02/18/2010 |
| 20100012294 | Structure and Apparatus for Cooling Integrated Circuits Using Cooper Microchannels A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed ... | 01/21/2010 |
| 20090314467 | COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH JET IMPINGEMENT STRUCTURE INTEGRALLY FORMED ON THERMALLY CONDUCTIVE PIN FINS A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: bonding a plurality of thermally conductive pin fins to a surface to be cooled, each pin fin includi... | 12/24/2009 |
| 20090283244 | Stacked and Redundant Chip Coolers A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are sta... | 11/19/2009 |
| 20090272512 | Liquid cooling heat dissipating device The present invention discloses a liquid cooling heat dissipating device for at least one heat source. The liquid cooling heat dissipating device comprises a base, at least a cooling fin and a liquid cooling module. The device is characterized in that the cooling fin is... | 11/05/2009 |
| 20090266515 | ELECTRONIC DEVICE COOLING APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME As an electronic device cooling apparatus which allows refrigerant liquid to circulate and flow in a cooling system by using a pump so as to cool a heat generating portion of an electronic device, a heat generating portion cooling unit which is connected to the pump, wh... | 10/29/2009 |
| 20090205809 | LIQUID COOLING DEVICE A liquid cooling device has a main liquid block, a pump, a heat sink, and at least one auxiliary liquid block that are in fluid communications. The auxiliary liquid block has a body and a partition that separates the body into a reservoir and a heat-absorbing chamber. T... | 08/20/2009 |
| 20090205808 | LIQUID COOLING DEVICE FOR MULTIPLE ELECTRONIC COMPONENTS A liquid cooling device for multiple electronic components has two liquid blocks, a heat-dissipating plate, a pump and a heat sink. The two liquid blocks and the heat sink are connected and communicated with other via tubing. The pump operates to make a coolant circulat... | 08/20/2009 |
| 20090205810 | LIQUID COOLING DEVICE A liquid cooling device includes a liquid block, a heat-dissipating plate, a thermal-conductive pipe, a pump and a heat sink. The liquid block, the pump, and the heat sink are connected by ducts. The pump drives a coolant to circulate among them. The thermal-conductive ... | 08/20/2009 |
| 20090188264 | Modular in-frame pumped refrigerant distribution and heat removal system An apparatus, method and system are provided for a modular in-frame pumped refrigerant distribution system. Specifically, a micro-channel heat exchanger is positioned in an equipment cabinet close to equipment that generates heat. More specifically, the micro-channel he... | 07/30/2009 |
| 20090183856 | HEAT TRANSFER APPARATUS AND METHODS INCLUDING HYDROFLUOROCARBONATES Provided is an apparatus for heat transfer that includes a device and a mechanism for transferring heat to or from the device, comprising using a heat transfer fluid, wherein the heat transfer fluid includes a hydrofluorocarbonate. Also provided is a method for transfer... | 07/23/2009 |
| 20090178783 | Water-cooled heat dissipation device for a notebook computer A water-cooled heat dissipation device for a notebook computer includes primarily a pad and a heat dissipation device at a bottom of the pad having an air through-hole. The heat dissipation structure has a fan below a U-shape plate, a groove of which is latched with par... | 07/16/2009 |
| 20090139693 | TWO PHASE MICRO-CHANNEL HEAT SINK A method and system for providing a heat sink are described. The heat sink includes at least one inlet, at least one outlet, a plurality of flow micro-channels, and at least one cross-connect channel. The plurality of flow micro-channels are defined by a plurality of ch... | 06/04/2009 |
| 20090101308 | MICRO-CHANNEL PULSATING HEAT PUMP A heat pump device and method in which micro-channel embedded pulsating heat pumps are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a micro-channel which will become slugs of liquid. Heating of the contents of the micro-channel at an e... | 04/23/2009 |
| 20090086789 | CONDENSATION DETECTOR UTILIZING A WET BULB AND DRY BULB TEMPERATURE DIFFERENTIAL Apparatus, systems and methods for coordinated detecting condensation utilizing a wet bulb and dry bulb temperature differential are disclosed. According to exemplary embodiments, a condensation detector may include; a first temperature sensor which generates a first te... | 04/02/2009 |
| 20090065177 | Cooling with microwave excited micro-plasma and ions One embodiment of the present invention uses an actuator, which is actuated by electromagnetic microwave. The actuator is used to generate the micro-plasma and ions. The configurations of actuators may be microstrip lines structure, stripline structure, piping structure... | 03/12/2009 |
| 20090056911 | ELECTRONIC APPARATUS An electronic apparatus includes: a circuit board that is mounted with a first heat generating component and a second heat generating component that generate heat; and a circulation-type heat pipe that circulates a coolant, the heat pipe including: a first heat receptio... | 03/05/2009 |
| 20090032937 | COOLING SYSTEMS FOR POWER SEMICONDUCTOR DEVICES A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavit... | 02/05/2009 |
| 20090027856 | BLADE COOLING SYSTEM USING WET AND DRY HEAT SINKS An enclosure is disclosed. The enclosure comprises a chassis having a plurality of slots configured to hold a plurality of blades. At least one wet heat sink is positioned adjacent to each of the plurality of slots. An input piping system is coupled to the wet heat sink... | 01/29/2009 |
| 20090008061 | Easily assembled cooler A cooler capable of reducing the fabrication cost is provided. In the cooler, in which electronic parts 6 are held between neighboring tubes 1, each of the tubes 1 is formed by joining the edges of plates 1a, 1b, each of ... | 01/08/2009 |
| 20090008063 | System and Method for Passive Cooling Using a Non-Metallic Wick According to an embodiment of the invention, a cooling system for a heat-generating device comprises a base plate, a fluid transfer chamber, a non-metallic wicking material, and a coolant. The base plate is in thermal communication with a heat generating structure and i... | 01/08/2009 |
| 20090000769 | Temperature Controlled Loadlock Chamber A temperature controlled loadlock chamber for use in semiconductor processing is provided. The temperature controlled loadlock chamber may include one or more of an adjustable fluid pump, mass flow controller, one or more temperature sensors, and a controller. The adjus... | 01/01/2009 |
| 20080314565 | METHOD AND APPARATUS FOR CHIP COOLING In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of a system for cooling a heat-generating device, such as a semiconductor chip, includes a vaporization chamber for at least partially vaporizing a stream of liquid in a stream o... | 12/25/2008 |
