Bizarre Patents
Combination Beverage Container and Spittoon
A combination beverage container and spittoon includes a bottom portion including outer wall and a first inner wall defining a spittoon space.
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| Application No. | Application Title | Issue Date |
| 20120031585 | DATA CENTER WITH FIN MODULES A system for providing computing capacity includes a base module and two or more fin modules coupled to the base module. At least one of the fin modules includes one or more fins and two or more computer systems coupled to the fins. At least one of the fins to which the... | 02/09/2012 |
| 20110315343 | INTERLEAVED, IMMERSION-COOLING APPARATUSES AND METHODS FOR COOLING ELECTRONIC SUBSYSTEMS Cooling apparatuses and methods are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatuses include a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectri... | 12/29/2011 |
| 20110309751 | HEAT SINK SYSTEM The improved heat sink system for a lighting fixture includes a conductive mount configured to selectively receive and retain a lighting subassembly. An inner heat sink couples to the conductive mount and is positioned to encompass the lighting assembly. A plurality of ... | 12/22/2011 |
| 20110128699 | COOLING SERVERS IN A DATA CENTER USING FANS EXTERNAL TO SERVERS To avoid the need to operate in-chassis fans to cool rack-mounted servers in a data center, the data center is arranged into a hot aisle and a cold aisle. The cold aisle is adjacent to a first side of the rack mounted servers and receives cold air from a cold air supply... | 06/02/2011 |
| 20110108237 | HEATSINK WITH FLEXIBLE BASE AND HEIGHT-ADJUSTED COOLING FINS One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate a... | 05/12/2011 |
| 20110079370 | Non-Uniform Height And Density Fin Design For Heat Sink A heat sink includes a heat sink plate and a heat generating electrical component mounted to a first side of the heat sink plate. Fins are connected and oriented perpendicular to a second side of the heat sink plate. The fins include a maximum height fin positioned prox... | 04/07/2011 |
| 20110073289 | LOW PROFILE BLOWER RADIAL HEATSINK A cooling device, such as for cooling a chip and socket may have a centrifugal blower outside of a radial heatsink. In addition, supports for coupling the blower to a center motor may comprise overhead fan blades effectively creating a radial fan in series with the blow... | 03/31/2011 |
| 20110048675 | HEAT SINK A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first ... | 03/03/2011 |
| 20110030920 | Heat Sink Structure A heat sink structure includes a heat dissipating body and at least one heat pipe. The heat dissipating body includes a main body having two opposite first and second end faces, and a plurality of radiating fins formed on two wall surfaces of the main body. The heat dis... | 02/10/2011 |
| 20110011562 | FRONT-TO-BACK COOLING SYSTEM FOR MODULAR SYSTEMS WITH ORTHOGONAL MIDPLANE CONFIGURATION A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus ... | 01/20/2011 |
| 20110013402 | Light Feature A lighting apparatus includes a light source module and a heat dissipation module. The light source module emits light and generates heat. The heat dissipation module dissipates at least a portion of the heat, and includes a base portion to which the light source module... | 01/20/2011 |
| 20100328889 | COOLED ELECTRONIC MODULE WITH PUMP-ENHANCED, DIELECTRIC FLUID IMMERSION-COOLING Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples... | 12/30/2010 |
| 20100314073 | HEAT DISSIPATION DEVICE AND CLIP ASSEMBLY THEREOF A heat dissipation device includes a heat sink, a positioning member and a wire clip. The heat sink includes a base and a plurality of fins. Two of the fins each form a hook. The positioning member includes a seat and two positioning arms each forming two opposite finge... | 12/16/2010 |
| 20100302725 | VAPOR CHAMBER HEAT SINK WITH CROSS MEMBER AND PROTRUDING BOSS One embodiment provides a vapor chamber having an outwardly protruding boss. A frame surrounds a perimeter of the vapor chamber. A plurality of heat sink fins extend from the frame. A cross-member spans the frame across the vapor chamber wall and defines an opening thro... | 12/02/2010 |
| 20100294462 | HEAT SINK AND HEAT-DISSIPATING FINS OF THE SAME A heat sink and heat-dissipating fins have wave-shaped folds. The heat sink includes a plurality of heat-dissipating fins that are radially connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing a he... | 11/25/2010 |
| 20100294463 | HEAT DISSIPATION DEVICE HAVING A FAN THEREON A heat dissipation device includes a heat sink and a blower. The heat sink has a base and a plurality of fins formed on the base. The blower includes a frame and an impeller rotatably secured to the frame. The frame faces and is secured to the base of the heat sink to d... | 11/25/2010 |
| 20100290195 | Power Semiconductor Heatsinking A heatsink includes a thermally conductive body including a plurality of fins configured to conduct and dissipate heat. The body is configured to receive a circuit board containing heat-producing electrical components along a width of the body. The heatsink further incl... | 11/18/2010 |
| 20100288476 | HEAT DISSIPATION APPARATUS A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources fo... | 11/18/2010 |
| 20100288470 | HEAT DISSIPATION DEVICE A heat dissipation device includes a plate, a protrusion to divide a top of the plate into a number of mounting areas, and a number of heat sinks selectively received on the number of mounting areas.... | 11/18/2010 |
| 20100271786 | HEAT SINK ASSEMBLY A heat sink assembly includes a heat sink main body and a contact member attached to a base of the heat sink main body. The contact member includes a container with thermal grease contained therein and a movable cover movably attached to the container. The container inc... | 10/28/2010 |
| 20100258272 | HEAT DISSIPATION DEVICE HAVING FAN HOLDER FOR ATTACHMENT OF A FAN A heat dissipation device includes a heat sink, a fan and a holding frame securing the fan onto the heat sink. The holding frame is mounted on a top of the heat sink and has four beams located around the top of the heat sink and defines an opening in a central part ther... | 10/14/2010 |
| 20100258271 | HEAT DISSIPATION DEVICE HAVING A FAN DUCT THEREON A heat dissipation device includes a heat sink, a fan placed on a top of the heat sink for providing an airflow through the heat sink and a fan duct located at a side of the heat sink. The heat sink includes a plurality of upwardly extending first fins and a plurality o... | 10/14/2010 |
| 20100258273 | HEAT DISSIPATION DEVICE A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipe... | 10/14/2010 |
| 20100258270 | HEAT SINKS WITH DISTRIBUTED AND INTEGRATED JET COOLING A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets dispose... | 10/14/2010 |
| 20100243206 | HEAT SINK AND LATCH MECHANISM THEREOF A latch mechanism includes a press portion, two connection portions, and two latch portions. The two connection portions are connected to opposite ends of the press portion correspondingly. Each connection portion includes two connectors. First ends of the two connector... | 09/30/2010 |
| 20100243204 | HEAT RADIATING UNIT FOR ADAPTER A heat radiating unit for adapter includes at least one receiving portion and a heat radiating portion. The receiving portion has at least one receiving space for receiving at least one adapter therein. The heat radiating portion includes a plurality of radiating fins, ... | 09/30/2010 |
| 20100243205 | INTEGRATED THERMAL SYSTEM FOR COOLING MULTIPLE SEPARATE COMPONENTS OF AN ELECTRONIC DEVICE The invention broadly contemplates an integrated thermal system that is capable of simultaneously cooling multiple, separate heat generating components of an electronic device. The integrated thermal system according to one embodiment of the invention takes the form of ... | 09/30/2010 |
| 20100246136 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins disposed between the heat spreaders. The heat dissipation fin is curved from one of the heat spreaders to the other one of the heat spreaders. A curved air passage is... | 09/30/2010 |
| 20100243207 | THERMAL MODULE A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick... | 09/30/2010 |
| 20100236754 | Airflow guider for use in heat sink An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward... | 09/23/2010 |
| 20100236755 | HEAT DISSIPATION DEVICE A heat dissipation device adapted for removing heat from heat-generating components includes a plurality of first fins spaced from each other and connected to the heat-generating components in thermal relationship and a plurality of second fins alternately arranged with... | 09/23/2010 |
| 20100236756 | THERMAL MODULE A thermal module includes a heat spreader adapted for attaching to a heat-generating component, a fin unit, a heat pipe, and a securing structure for firmly pressing the heat pipe against the heat-generating component. The heat pipe includes an evaporation section attac... | 09/23/2010 |
| 20100230074 | HEAT DISSIPATION APPARATUS A heat dissipation apparatus includes a base with a bottom surface contacting a heat source, and a fin assembly disposed on a top surface of the base. The fin assembly includes a first heat dissipation member, and a second heat dissipation member symmetric with respect ... | 09/16/2010 |
| 20100224344 | Vibration Proof Structure Of Fan A vibration proof structure of a fan is provided. The vibration proof structure includes a frame, a plurality of buffer members, and a plurality of rigid rods. The frame is adapted for assembling with a blade assembly. The buffer members are assembled to the frame. The ... | 09/09/2010 |
| 20100218915 | Structure of LED Radiator The improved structure of LED radiator comprises a radiator comprising with a better heat-dissipating plate bended through the machine as plurality of continuously arranged bottom area, side areas and top area. The length of the top area and the bottom area is the same.... | 09/02/2010 |
| 20100212862 | Cooling structure for a housing A cooling structure for a housing is located on the side board of the housing. The side board has a through hole. The cooling structure for a housing includes a cooling device and a fan device. The cooling device includes a cooling chip, a cooler and a heater. The cooli... | 08/26/2010 |
| 20100212864 | PACKAGED HEAT DISSIPATING ASSEMBLY FOR AN INTERMEDIATE BUS CONVERTER A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat dissipating assembly is easily detached from the IBC. Therefore, a broken bus conve... | 08/26/2010 |
| 20100212863 | HEAT DISSIPATION DEVICE HAVING A FAN HOLDER A heat dissipation device includes a fin group, a fan and two fan holders fixing the fan onto a front side of the fin group. The fin group defines two elongated slots in two opposite lateral side thereof and two receiving grooves in two opposing inner faces of each elon... | 08/26/2010 |
| 20100208428 | COMMUNICATION CHASSIS HEAT DISSIPATION STRUCTURE A communication chassis heat dissipation structure includes a chassis body defining an inner receiving space. The chassis body is divided into at least one heat concentration portion and at least one heat dissipation portion. A first heat pipe set is arranged in the rec... | 08/19/2010 |
| 20100187963 | Heat Sink for Passive Cooling of a Lamp Various embodiments of heat sinks for passive cooling of lamps are provided. In an embodiment, a heat sink comprises a top end and a bottom end that is opposite the top end along a body axis of the heat sink, an airflow passageway formed through the heat sink, an intern... | 07/29/2010 |
