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| Application No. | Application Title | Issue Date |
| 20120103566 | LIQUID COOLED DATA CENTER WITH ALTERNATING COOLANT SUPPLY LINES Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets and at least two coolant supply lines. The cabinets are configured t... | 05/03/2012 |
| 20120067547 | Device for protecting an electronic system mounted in a rack Device for protecting an electronic system, comprising a case (2) intended to receive the electronic system and to be mounted in a rack (3) of a storage system (1) that can receive a number of cases (2), said metallic case (2) comprisi... | 03/22/2012 |
| 20120048512 | DATA CENTER AND HEAT DISSIPATING CONTROL SYSTEM THEREOF A data center includes a portable container, a number of server systems, and a number of nozzles. The server systems are installed in the container. Two opposite sides of each server system are respectively a hot aisle and a cold aisle. The nozzles are arranged in the g... | 03/01/2012 |
| 20120048511 | Spiral-path chimney-effect heat sink A spiral-path chimney-effect heat sink cools an LED light bulb by increasing the length of the path over which heated air rises between two coaxial tubes. A tube top is attached to one end of the tubes. A light emitting diode (LED) is thermally coupled through the tube ... | 03/01/2012 |
| 20120044695 | HEAT DISSIPATION STRUCTURE FOR LED LAMP An improved heat dissipation structure for an LED lamp is provided. The heat dissipation structure, featuring low cost and a significant heat dissipation effect, includes a metal lamp housing. The inner side of the metal lamp housing is formed with a light-reflecting su... | 02/23/2012 |
| 20120037339 | COOLING SYSTEM FOR CONTACT COOLED ELECTRONIC MODULES Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Int... | 02/16/2012 |
| 20120037353 | SINGLE RACK COLD AIR CONTAINMENT A system for cooling rack mounted equipment includes: a rack configured to house rack mounted equipment, the rack providing a front port bordered by a top and two sides; and a cold-air duct separable from and attached to the rack about the top and two sides, the duct be... | 02/16/2012 |
| 20120024515 | DATA CENTER AND HEAT DISSIPATING SYSTEM THEREOF A container data center includes a plurality of server systems installed in a container. Each server system includes a power distribution units (PDU) used to manage power and a heat dissipating system to dissipate heat. The heat dissipating system includes a fan and a f... | 02/02/2012 |
| 20120020014 | DATA CENTER AND SERVER MODULE OF THE SAME A data center includes a server module. The server module includes a housing, and a number of heat-generating elements arranged in the housing. The housing includes a front wall, a back wall, and left and right sidewalls. When the server module runs, cool air comes into... | 01/26/2012 |
| 20120006507 | MULTI-MODULAR DATA CENTER A multi-modular data center includes at least one modular computing module and at least one modular power supply module. The modular computing module includes a transportable container, a plurality of computing systems, a cooling system, a surveillance system, and a net... | 01/12/2012 |
| 20110255237 | COMPUTER CABINETS HAVING PROGRESSIVE AIR VELOCITY COOLING SYSTEMS AND ASSOCIATED METHODS OF MANUFACTURE AND USE Computer cabinets, such as supercomputer cabinets, having progressive air velocity cooling systems are described herein. In one embodiment, a computer cabinet includes an air mover positioned beneath a plurality of computer module compartments. The computer module compa... | 10/20/2011 |
| 20110240260 | COOLING ARRANGEMENT A cooling arrangement for cooling a heat generating electrical component is disclosed, which arrangement comprises a heat spreading element (2) having a mounting surface (3) adapted to be thermally connected to the heat generating electrical component (... | 10/06/2011 |
| 20110240281 | Liquid-Based Cooling System For Data Centers Having Proportional Flow Control Device A liquid-based cooling system provides a method of supplying a heated coolant fluid at a relatively constant temperature and pressure to one or more heat driven engines, such as adsorption chillers or heat pumps, by utilizing a proportional flow control device in associ... | 10/06/2011 |
| 20110155346 | HEAT DISSIPATION DEVICE WITH FAN HOLDER A heat dissipation device includes a base plate, a bracket engaged with the base plate, a heat radiator mounted on the base plate and the bracket, a fan holder and a fan mounted on the fan holder. The base plate has first and second faces at opposite sides thereof. The ... | 06/30/2011 |
| 20110155569 | COOLING SYSTEM A cooling system that cools a wafer in a vacuum chamber of a sputtering apparatus, includes a wafer cooling stage for cooling the wafer, a cooling mechanism for cooling the wafer cooling stage, cooling gas supply units which introduces a cooling gas to the wafer cooling... | 06/30/2011 |
| 20110100598 | COOLING ARRANGEMENT The invention relates to an arrangement for cooling at least one electrical and/or electronic component and/or group of electrical/electronic components by means of a cooling body. The cooling body demonstrates at least one recess into which the electrical/electronic co... | 05/05/2011 |
| 20110103023 | LOCKING DEVICE AND HEAT DISSIPATION DEVICE USING THE SAME A heat dissipation device includes a heat sink and locking devices disposed on the heat sink. Each of the locking devices includes a shaft member and an elastic member circling the shaft member. The shaft member includes a body portion, a head portion formed at a top en... | 05/05/2011 |
| 20110088870 | Memory Heatsink Set With Supplementary Retaining Devices A memory heatsink set for dissipating heat from a memory module is disclosed to include a first memory heatsink and a second memory heatsink, two guide devices bilaterally provided between the first memory heatsink and the second memory heatsink for positioning during t... | 04/21/2011 |
| 20110083825 | Temperature Control within Storage Device Testing Systems A storage device testing system cooling circuit includes a plurality of test racks. Each of the test racks include a test slot compartment and a test electronics compartment. Each of the test slot compartments includes multiple test slots, and one or more cooling condui... | 04/14/2011 |
| 20110083824 | Data Centre A data centre (100) includes at least one rack room (in for example module 140) having a floor and a plurality of rack storage areas on the floor, each rack storage area being arranged to accommodate a plurality of racks (143) in which a plurality o... | 04/14/2011 |
| 20110079369 | Configuration To Detect And Control The Wireless Network Inside A Building A memory heatsink set for dissipating heat from a memory module is disclosed to include a first memory heatsink and a second memory heatsink, two guide devices bilaterally provided between the first memory heatsink and the second memory heatsink for positioning during t... | 04/07/2011 |
| 20110073279 | ELECTRICAL CONTROL CABINET An electrical control cabinet includes a casing, a plurality of heat elements, a heat exchanger, and two fans. The casing includes a first receiving portion and a second receiving portion. The first receiving portion communicates outside of the casing through the heat e... | 03/31/2011 |
| 20110073278 | HEAT SINK FOR NOTEBOOK COMPUTER The present invention is able to guide the wind produced by a fan interior of a heat sink when rotating to the interior of a computer, and discharge heat energy from the interior of the computer. Moreover, a user can easily adjust and fix air outlets of fan assemblies t... | 03/31/2011 |
| 20110061834 | COOLED BASE PLATE FOR ELECTRIC COMPONENTS A cooled base plate is provided for electric components. A first side of the cooled base plate is provided for attaching exothermal electric components thereto. On a second side of the base plate, opposite to the first side, there is embedded a cooling channel system ha... | 03/17/2011 |
| 20110056651 | INTEGRATED COMPUTER EQUIPMENT CONTAINER AND COOLING UNIT A shipping container having an interior and a plurality of electronic equipment modules disposed within the interior of the container is cooled by an air conditioning unit adapted to be disposed within the interior of the container. The electronic equipment may include ... | 03/10/2011 |
| 20110005721 | Integrated cooling lapdesk without electronics A cooling lapdesk comprises an interior cushion layer including a rear, a front, a left side and a right side, the rear being thicker than the front, the left and right sides having equal thickness at a given proximity to the front or rear, the interior layer elastic th... | 01/13/2011 |
| 20100319876 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE A semiconductor element cooling structure includes a semiconductor element, a heat sink on which the semiconductor element is mounted, and a heat storage member attached to the semiconductor element in a manner to be located opposite to the heat sink with respect to the... | 12/23/2010 |
| 20100314072 | BASE PLATE WITH TAILORED INTERFACE Base plate apparatus for mounting IGBT modules, the base plate apparatus includes a base plate with a mounting surface and an opposed surface. A tailored coefficient of thermal expansion interface layer is directly bonded to the mounting surface of the base plate and fo... | 12/16/2010 |
| 20100307716 | HOT AISLE CONTAINMENT COOLING UNIT AND METHOD FOR COOLING A cooling unit, which is configured to contain and cool air between two rows of equipment racks defining a hot aisle, includes a housing configured to be secured mounted on the two rows of equipment racks such that the housing spans the hot aisle, a heat exchanger suppo... | 12/09/2010 |
| 20100294461 | ENCLOSURE FOR HEAT TRANSFER DEVICES, METHODS OF MANUFACTURE THEREOF AND ARTICLES COMPRISING THE SAME Disclosed herein is a heat transfer device that includes a shell; the shell being an enclosure that prevents matter from within the shell from being exchanged with matter outside the shell during the operation of the heat transfer device; the shell having an outer surfa... | 11/25/2010 |
| 20100270007 | HEAT SINK A heat sink has a conducting heat seat, multiple heat pipes and multiple heat dissipating fins. The heat pipes are mounted through the conducting heat seat and each heat pipe has a central portion and two distal portions. The central portion is flat. The distal portions... | 10/28/2010 |
| 20100263830 | Cold Row Encapsulation for Server Farm Cooling System Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers inst... | 10/21/2010 |
| 20100252234 | HIGH PERFORMANCE DUAL-IN-LINE MEMORY (DIMM) ARRAY LIQUID COOLING ASSEMBLY AND METHOD A method and associated assembly for cooling electronic heat generating components of a computer including dual-in-line memory (DIMM) array(s) is provided. The assembly comprises a cooling component having a plate with a first and a second (reverse) side, thermally coup... | 10/07/2010 |
| 20100243203 | COOLING DEVICE FOR ADD-ON CARD A cooling device for cooling an add-on card includes a heat absorption member attached to the add-on card to absorb heat therefrom, a heat sink and a clip for clasping the heat sink onto the heat absorption member. The heat sink includes a supporting plate, and a first ... | 09/30/2010 |
| 20100236753 | Heat Sink for Drill Bits of Different Sizes A heat sink for a drill press includes a main body having a receiving chamber which has a top provided with a limit tube, a guide unit mounted on the main body, and a sponge mounted in the main body. The guide unit includes an outer tube mounted on the receiving chamber... | 09/23/2010 |
| 20100232113 | HEAT DISSIPATION DEVICE WITH FASTENER An electronic device comprises a printed circuit board, an electronic component mounted on the printed circuit board, a heat dissipation device dissipating heat generated by the electronic component and a plurality of wires on the printed circuit board. The heat dissipa... | 09/16/2010 |
| 20100220447 | HEAT DISSIPATION DEVICE A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and recei... | 09/02/2010 |
| 20100214736 | Cooling system for computer, cooling apparatus and cooling method A cooling system for computer, a cooling apparatus and a cooling method are described. The cooling system includes a computer casing, a fan and the fan-less cooling apparatus. The fan-less cooling apparatus has an air passage with two open ends and a closed circumferenc... | 08/26/2010 |
| 20100175851 | MODULAR ABSORPTION HEAT SINK DEVICES FOR PASSIVE COOLING OF SERVERS AND OTHER ELECTRONICS A passive heat sink for cooling an electronic component such as a high-performance processor. The heat sink includes a shell with a surface that is positionable adjacent a heat generating surface of the electronic component. The shell includes a heat exchanger portion w... | 07/15/2010 |
| 20100175852 | Cooling Manifold Assembly A cooling apparatus comprising a cooling manifold assembly is disclosed. The cooling manifold assembly comprises a manifold inlet end cap, a manifold outlet end cap and at least one cooling manifold. Cooling fluid flows into the manifold inlet end cap, through the cooli... | 07/15/2010 |
