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Class 165/104.33 - Cooling electrical device


Subclass of Class 165 - Heat exchange
Definition: Apparatus particularly adapted to removing heat from a member,
No. of applications: 502
Last issue date: 05/24/2012


1                      
Application No.Application TitleIssue Date
20120125573HEAT STORAGE BY PHASE-CHANGE MATERIAL
Methods and means related to rejecting heat through thermal storage are provided. A heat sink includes internal cavities containing a phase-change material. Heat from a thermal load is rejected by flowing fluid coolant at a normal operating temperature. Failure of the f...
05/24/2012
20120106083LIQUID COOLING SYSTEM FOR AN ELECTRONIC SYSTEM
A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contac...
05/03/2012
20120103576INTEGRATED LIQUID COOLING SYSTEM
A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipati...
05/03/2012
20120048515High Power Module Cooling System
A cooling apparatus includes a direct-bonded copper (“DBC”) substrate, the DBC substrate having a plurality of micro-structure tabs formed on a fluid impingement side of the DBC substrate, and a jet head in complementary opposition to the fluid impingement side. The...
03/01/2012
20120050984SERVER CABINET WITH LIQUID COOLING SYSTEM
An exemplary server cabinet includes an enclosure configured to house multiple servers therein, and a liquid cooling system. A heat conductive plate is positioned in the enclosure to be adjacent to the servers. The liquid cooling system includes a cooler located outside...
03/01/2012
20120044643HEAT MANAGEMENT AND REDUCTION OF HIGH TEMPERATURES EXPOSURE TO COMPONENTS INSIDE ENERGY METER
Electronic components of an energy meter are mounted in an encapsulated compartment within a sealed outer enclosure of the meter. The encapsulated compartment is advantageously positioned to form air channels between the encapsulated compartment and the sealed outer enc...
02/23/2012
20120026690HEAT EXCHANGE MEDIUM AND ELECTRIC STORAGE DEVICE
A liquid heat exchange medium (40) is provided in a case (20) together with an electric storage element (11) to exchange heat with the electric storage element. The heat exchange medium is an ester compound of a fatty acid with a carbon number of 6 ...
02/02/2012
20120024502ENCLOSED-AISLE DATA CENTER COOLING SYSTEM
An aspect of the disclosure provides a method comprising: providing a first portion of an exhaust gas from racks of computer devices in an enclosed aisle arrangement for cooling in an air cooling device; and diverting a second portion of the exhaust gas from the racks o...
02/02/2012
20120024501THERMOELECTRIC-ENHANCED, LIQUID-COOLING APPARATUS AND METHOD FOR FACILITATING DISSIPATION OF HEAT
Thermoelectric-enhanced, liquid-cooling apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure in thermal communication with the component(s) to be cooled, and a liqui...
02/02/2012
20120021306ACID FUEL CELL CONDENSING HEAT EXCHANGER
A heat exchanger for a fuel cell includes first and second heat exchanger portions that provide a fluid flow passage. The second heat exchanger portion is arranged downstream from the first heat exchanger portion. The first and second heat exchanger portions include a c...
01/26/2012
20120012282DIRECT AIR CONTACT LIQUID COOLING SYSTEM HEAT EXCHANGER ASSEMBLY
A heat exchanger assembly for use in hybrid liquid-air cooling system adapted to provide a liquid cooling mechanism for components in a personal computer system. The heat exchanger assembly consists of a heat exchanger chamber, though which the thermal transfer liquid f...
01/19/2012
20120012283HOT AISLE CONTAINMENT COOLING UNIT AND METHOD FOR COOLING
A cooling unit, which is configured to contain and cool air between two rows of equipment racks defining a hot aisle, includes a housing configured to be secured mounted on the two rows of equipment racks such that the housing spans the hot aisle, a heat exchanger suppo...
01/19/2012
20120006383HEAT EXCHANGER APPARATUS AND METHODS OF MANUFACTURING CROSS REFERENCE
The invention provides systems and methods for cooling semiconductor devices, such as those provided in concentrated photovoltaic (CPV) systems using a cold plate. The invention also provides using a material, such as a ceramic, to form that cold plate that matches or n...
01/12/2012
20120000627ELECTROSTATIC PRECIPITATOR PRE-FILTER FOR ELECTROHYDRODYNAMIC FLUID MOVER
Electrostatic precipitation is performed upstream of collector electrode surfaces toward which a downstream EHD fluid mover accelerates fluid flow. In this way, the upstream electrostatic precipitator (ESP) acts as a pre-filter (with low flow-impedance) and can reduce a...
01/05/2012
20120000508THERMAL DEVICE AND PHOTOVOLTAIC MODULE HAVING THE SAME
Disclosed herein are a thermal device and a photovoltaic module having the same. The photovoltaic module includes a photovoltaic device, a thermal device, and an adhesive layer. The photovoltaic device includes a front substrate, a back substrate and a photovoltaic cell...
01/05/2012
20110315354MULTIPLE LIQUID LOOP COOLING FOR ELECTRONICS
The present invention relates to liquid cooling systems and more particularly to a liquid cooling system for an electrical system on an air-cooled platform. In one embodiment of the invention, a liquid-cooled system for a platform with air cooling includes an electrical...
12/29/2011
20110315353LIQUID-COOLED ELECTRONICS RACK WITH IMMERSION-COOLED ELECTRONIC SUBSYSTEMS AND VERTICALLY-MOUNTED, VAPOR-CONDENSING UNIT
Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor...
12/29/2011
20110317365LIQUID COOLING SYSTEM AND ELECTRONIC DEVICE INCORPORATING THE SAME
A liquid cooling system includes a heat conductive member, a liquid tank, and plural conduits connecting the heat conductive member with the liquid tank. The heat conductive member is configured for thermally connecting to a heat-generating electronic component. The liq...
12/29/2011
20110315355IMMERSION-COOLING APPARATUS AND METHOD FOR AN ELECTRONIC SUBSYSTEM OF AN ELECTRONICS RACK
Cooling apparatus and method are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatus includes a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fl...
12/29/2011
20110303394LIQUID COOLING SYSTEM FOR A SERVER
A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid coo...
12/15/2011
20110303393THERMAL DISTRIBUTION SYSTEMS AND METHODS
Thermal distribution systems and methods are provided. A thermal distribution system can include a first surface having a perimeter and a second surface. At least a portion of the perimeter can be disposed proximate the second surface, forming a void between the first a...
12/15/2011
20110293985Heat Transfer Module for Battery Cells and Battery Assembly Therewith
Disclosed is a heat transfer module (3) for battery cells includes a plastic frame (4) having a supply conduit and an exhaust conduit (13b) for a heat transfer fluid. Two heat transfer members (12a, 12b) contacting...
12/01/2011
20110290448DEHUMIDIFYING COOLING APPARATUS AND METHOD FOR AN ELECTRONICS RACK
Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The...
12/01/2011
20110256493Method and device for cooling of IR emitters for preforms
A method for cooling IR emitters in a heating device for warming preforms before processing them in a stretch blow or blow molding device. IR emitters are arranged on at least one sidewall of the heating device parallel to the transport direction of the preforms, with a...
10/20/2011
20110247788SYSTEMS AND METHODS OF USING SUBSEA FRAMES AS A HEAT EXCHANGER IN SUBSEA BOOSTING SYSTEMS
Systems and methods of cooling a motor of an electrical submersible pump (ESP) assembly employed in an electrical submersible subsea booster pumping system, are provided. A supporting frame structure such as an ESP mounting skid or top end assembly of a caisson having s...
10/13/2011
20110242755COOLING SYSTEM
According to an embodiment of the present invention, there is provided a system for cooling. The system comprises an equipment rack installable in a facility and for accommodating a plurality of electronic equipment. The system further comprises an exhaust duct into whi...
10/06/2011
20110232864COMPACT TWO SIDED COLD PLATE WITH THREADED INSERTS
A structural cold plate assembly includes a support structure including first and second opposite sides supporting corresponding cold plates and an insert. The insert defines a portion of a fluid passage through the support structure and secures the cold plate to the su...
09/29/2011
20110232877COMPACT VAPOR CHAMBER AND HEAT-DISSIPATING MODULE HAVING THE SAME
A compact vapor chamber configured to thermally conduct heat of an electronic heat-generating element includes a flat sealed casing; a wick structure arranged on inner walls of the flat sealed casing; a working fluid filled inside the flat sealed casing; and an evaporat...
09/29/2011
20110232889COMPUTER RACK COOLING USING INDEPENDENTLY-CONTROLLED FLOW OF COOLANTS THROUGH A DUAL-SECTION HEAT EXCHANGER
Embodiments of the present invention include a cooling system and method for cooling a computer rack by circulating liquid coolant through different sections of a rack heat exchanger under separately controlled flow and temperature conditions. In a method according to o...
09/29/2011
20110232863INTEGRAL COLD PLATE AND STRUCTURAL MEMBER
A cold plate assembly is provided having a cold plate with a generally planar member that provides a support surface. The support surface is configured to support a heat generating device. A structural member provides attaching features that are configured to secure the...
09/29/2011
20110220329Cooling device and method for cooling an equipment component
Described is a cooling device for cooling an equipment component with the aid of a cooling agent, as well as a method for cooling an equipment component. In at least one embodiment, the cooling device includes a heat source for transferring thermal energy from the equip...
09/15/2011
20110222281COOLING LARGE ARRAYS WITH HIGH HEAT FLUX DENSITIES
A lighting module includes an array of light emitters, a heat pipe having a flat portion, the array of light emitters being mounted to the flat portion, a liquid inside the heat pipe, the liquid selected to vaporize upon exposure to heat from the array, and a cooling un...
09/15/2011
20110214629Waste Heat Accumulator/Distributor System
A waste heat accumulator/distributor system for use in a vehicle. The system includes an engine coolant loop directing engine coolant through a power plant, a powertrain electronics coolant loop directing electronics coolant through a powertrain electronics system; and ...
09/08/2011
20110214843Systems and Methods for Thermal Control of Integrated Circuits During Testing
Thermal control units (TCU) for maintaining a set point temperature on an IC device under test (DUT) are provided. The units include a pedestal assembly comprising a heat-conductive pedestal, a fluid circulation block, a thermoelectric module (Peltier device) between th...
09/08/2011
20110209856COOLING APPARATUS HAVING LOW PROFILE EXTRUSION AND METHOD OF MANUFACTURE THEREFOR
A cooling apparatus for removing heat having a low profile unitary member. The low profile unitary member has an evaporator portion and a condenser portion. The evaporator portion is thermally exposed to a heat generating component. The condenser portion is disposed at ...
09/01/2011
20110205703GIMBAL SYSTEM WITH FORCED FLOW OF EXTERNAL AIR THROUGH A CHANNEL TO REMOVE HEAT
Gimbal system, including apparatus and methods, with forced flow of external air through a channel to remove heat. The system may comprise a support portion including at least one electronic component and defining a channel, a gimbal assembly pivotably connected to and ...
08/25/2011
20110198060Heat Dissipation Apparatus for Data Center
The present invention discloses a heat dissipation apparatus that comprises at least a boiling houses, a condenser and an air channel. Each boiling house is provided to receive heat from at least a server, and is connected with a loop pipe filled with a first fluid. Eac...
08/18/2011
20110192571WATER-COOLING HEAT DISSIPATION SYSTEM FOR LED SIGNBOARD
A water-cooling heat dissipation system for LED signboard includes a frame, at least one water pipe system, and at least one water-cooling unit. At least one heat receiving section and at least one LED module in contact with one another are mounted to the frame. The wat...
08/11/2011
20110186283Constant Temperature Circulator
An constant temperature circulator for maintaining a liquid at a constant temperature including a housing that encapsulates a controller, a display, a heating element, a temperature sensor, and an electric motor having an impeller. The housing includes a first port and ...
08/04/2011
20110186266Heat transfer device with anisotropic thermal conducting structures
An isotropic thermal conducting material are arranged in a heat dissipating device to create directional adiabatic heat transfer. In one embodiment, a preferential heat conduction is provided between a heat source and an absorption layer, an absorption layer and a cooli...
08/04/2011
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