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| Application No. | Application Title | Issue Date |
| 20120103526 | HIGH PURITY ALUMINUM COATING HARD ANODIZATION The disclosure relates to a chamber component or a method for fabricating a chamber component for use in a plasma processing chamber apparatus. The chamber component includes a polished high purity aluminum coating and a hard anodized coating that is resistive to the pl... | 05/03/2012 |
| 20120103524 | PLASMA PROCESSING APPARATUS WITH REDUCED EFFECTS OF PROCESS CHAMBER ASYMMETRY Plasma processing apparatus that provide an asymmetric plasma distribution within the processing apparatus are provided herein. In some embodiments, a plasma processing apparatus may include a process chamber having a processing volume with a substrate support disposed ... | 05/03/2012 |
| 20120070988 | METHODS AND APPARATUSES FACILITATING FLUID FLOW INTO VIA HOLES, VENTS, AND OTHER OPENINGS COMMUNICATING WITH SURFACES OF SUBSTRATES OF SEMICONDUCTOR DEVICE COMPONENTS A method for removing material from surfaces of at least a portion of at least one recess or at least one aperture extending into a surface of a substrate includes pressurizing fluid so as to cause the fluid to flow into the at least one recess or at least one aperture.... | 03/22/2012 |
| 20120070996 | POLAR REGIONS FOR ELECTROSTATIC DE-CHUCKING WITH LIFT PINS An apparatus for electrostatic chucking and dechucking of a semiconductor wafer includes an electrostatic chuck with a number of zones. Each zone includes one or more polar regions around a lift pin that contacts a bottom surface of the semiconductor wafer. The apparatu... | 03/22/2012 |
| 20120048468 | SUPPORT FIXTURE FOR ACID ETCHING OF PCD INSERTS A fixture for etching PCD drill inserts is provided. The fixture design allows the fixture to be injection molded, significantly reducing costs and allowing the fixture to be disposed of after a single use. The fixture allows for faster use and more accurate etching of ... | 03/01/2012 |
| 20120043021 | ADJUSTABLE CONFINEMENT RING ASSEMBLY A plasma confinement assembly for a semiconductor processing chamber is provided. The assembly includes a plurality of confinement rings disposed over each other, and each of the plurality of confinement rings is separated by a space. A plunger moveable in a plane subst... | 02/23/2012 |
| 20120037316 | METHOD OF SUPPLYING ETCHING GAS AND ETCHING APPARATUS A method of supplying an etching gas includes: supplying a first etching gas used in an etching process into a processing container; and supplying a second etching gas used in the etching process into the processing container, in which, when the first etching gas and th... | 02/16/2012 |
| 20120031875 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS A plasma processing method includes: etching an anti reflection coating film with plasma generated from an etching gas by using a resist film that is patterned as a mask, in a deposited film in which an Si-ARC film constituting the anti reflection coating film is formed... | 02/09/2012 |
| 20120024479 | APPARATUS FOR CONTROLLING THE FLOW OF A GAS IN A PROCESS CHAMBER Apparatus for controlling the flow of a gas in a process chamber is provided herein. In some embodiments, an apparatus for controlling the flow of a gas in a process chamber having a processing volume within the process chamber disposed above a substrate support and a p... | 02/02/2012 |
| 20120006492 | PLASMA PROCESSOR AND PLASMA PROCESSING METHOD An etching chamber 1 incorporates a focus ring 9 so as to surround a semiconductor wafer W provided on a lower electrode 4. The plasma processor is provided with an electric potential control DC power supply 33 to control the electric potenti... | 01/12/2012 |
| 20120006491 | PLASMA TEXTURING APPARATUS FOR SOLAR CELL A plasma texturing apparatus for a solar cell includes a susceptor having engagement projections to prevent a wafer mounted therein from slipping outward or fluctuating back and forth when aligning the wafer over a cathode for plasma texturing; a focus ring functioning ... | 01/12/2012 |
| 20120000610 | Microwave Plasma Processing Apparatus In accordance with example embodiments, a plasma processing apparatus includes a chamber configured to perform a plasma process, an upper plate on the chamber, an antenna under the upper plate and the antenna is configured to generate plasma in the chamber, an upper ins... | 01/05/2012 |
| 20120000606 | PLASMA UNIFORMITY SYSTEM AND METHOD A plasma processing tool comprises a plasma chamber configured to generate a plasma from a gas introduced into the chamber where the generated plasma has an electron plasma frequency. A plurality of electrodes disposed within the chamber. Each of the electrodes configur... | 01/05/2012 |
| 20110318934 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS A substrate processing apparatus includes a chamber accommodating a wafer, a susceptor disposed inside the chamber and on which the wafer is held, an upper electrode facing the susceptor, and a second high frequency power source connected to the susceptor, wherein the u... | 12/29/2011 |
| 20110299164 | METHOD AND DEVICE FOR THE PRODUCTION OF A STRUCTURED OBJECT, AND STRUCTURED OBJECT The invention relates to a method for the production of a structured object, particularly an optical clement having a structure on an optically effective non-planar surface, preferably for structuring a non-planar surface of an object, and to objects produced according ... | 12/08/2011 |
| 20110297321 | SUBSTRATE SUPPORT STAGE OF PLASMA PROCESSING APPARATUS An object is to provide a substrate support stage of a plasma processing apparatus, in which electrical discharge from a connection terminal is prevented with a simple structure. In the substrate support stage of a plasma processing apparatus, an electrostatic attractio... | 12/08/2011 |
| 20110284497 | PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM A plasma processing apparatus includes a discharge window made of a dielectric material, a discharge chamber which is grounded and includes an opening formed at its one end and the discharge window provided at its other end facing the opening, a gas supply system which ... | 11/24/2011 |
| 20110277934 | METHODS OF SELECTIVELY DEPOSITING AN EPITAXIAL LAYER Apparatus for selectively depositing an epitaxial layer are provided herein. In some embodiments, an apparatus for processing a substrate may include a process chamber having a substrate support disposed therein; a deposition gas source coupled to the process chamber; a... | 11/17/2011 |
| 20110277932 | ELECTROSTATIC CHUCK CLEANING DURING SEMICONDUCTOR SUBSTRATE PROCESSING Methods and apparatus for cleaning electrostatic chucks in processing chambers are provided. The process comprises flowing a backside gas comprising a reactive agent into a zone in a process chamber, the zone defined by a space between a surface of an electrostatic chuc... | 11/17/2011 |
| 20110265951 | TWIN CHAMBER PROCESSING SYSTEM Methods and apparatus for twin chamber processing systems are disclosed, and, in some embodiments, may include a first process chamber and a second process chamber having independent processing volumes and a plurality of shared resources between the first and second pro... | 11/03/2011 |
| 20110253311 | SUBSTRATE PROCESSING APPARATUS FOR PERFORMING PLASMA PROCESS A substrate processing apparatus for performing a plasma process on a target substrate includes a process container configured to accommodate the target substrate. The apparatus includes a gas feed passage configured to supply a process gas into the process container an... | 10/20/2011 |
| 20110240598 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD A plasma processing apparatus 11 includes a reactant gas supply unit 13 for supplying a reactant gas for a plasma process into a processing chamber 12. The reactant gas supply unit 13 includes a first reactant gas supply unit 61 provid... | 10/06/2011 |
| 20110232847 | QUARTZ GLASS MEMBER FOR PLASMA ETCHING Provided is a doped quartz glass member for plasma etching, which is used in a plasma etching process and is free from any problematic fluoride accumulation during use. The quartz glass member for plasma etching is used as a jig for semiconductor production in a plasma ... | 09/29/2011 |
| 20110226419 | Process Chamber, Semiconductor Manufacturing Apparatus and Substrate Processing Method Having the Same Disclosed herein is a semiconductor manufacturing apparatus including a transfer chamber provided with a substrate moving device to move substrates, a load lock chamber to align the substrates and to load and unload the substrates into and out of the transfer chamber, a... | 09/22/2011 |
| 20110214687 | CONFIGURABLE BEVEL ETCHER A device for cleaning a bevel edge of a semiconductor substrate. The device includes: a lower support having a cylindrical top portion; a lower plasma-exclusion-zone (PEZ) ring surrounding the outer edge of the top portion and adapted to support the substrate; an upper ... | 09/08/2011 |
| 20110203736 | SURFACE ACTIVATION DEVICE A surface activation device comprises a holding compartment, a nozzle support, and a sealing assembly. The holding compartment defines a receiving chamber and defining a plurality of recesses for holding workpieces therein. The nozzle support is rotatably received in th... | 08/25/2011 |
| 20110192540 | TABLE FOR PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS An object of the present invention is to suppress damage of an electrostatic chuck, by controlling stress exerted on each part of a table, which includes an electrically conductive material, i.e., an electrode for generating plasma, a dielectric layer for enhancing the ... | 08/11/2011 |
| 20110180388 | Plasma Processing Method and Plasma Processing Apparatus [Object] To provide a plasma processing method and a plasma processing apparatus having high coverage property and excellent in-plane uniformity. [Solving Means] When sputtered particles that are beat out from a target by plasma are deposit... | 07/28/2011 |
| 20110168330 | SUPPORT STRUCTURE, LOAD LOCK APPARATUS, PROCESSING APPARATUS AND TRANSFER MECHANISM A support structure for supporting a processing target object includes a support main body that supports a weight of the processing target object and recess-shaped supporting body accommodating portions formed on a top surface of the support main body. The support struc... | 07/14/2011 |
| 20110162803 | CHAMBER WITH UNIFORM FLOW AND PLASMA DISTRIBUTION Embodiments of the present invention provide a recursive liner system that facilitates providing more uniform flow of gases proximate the surface of a substrate disposed within an apparatus for processing a substrate (e.g., a process chamber). In some embodiments, a rec... | 07/07/2011 |
| 20110151675 | DEVICE AND PROCESS FOR LIQUID TREATMENT OF A WAFER SHAPED ARTICLE A spin chuck in an apparatus for single wafer wet processing has structures at its periphery that, in combination with a supported wafer, form a series of annular nozzles that direct flowing gas from a chuck-facing surface of the wafer, around the edge of the wafer, and... | 06/23/2011 |
| 20110151590 | APPARATUS AND METHOD FOR LOW-K DIELECTRIC REPAIR A method, a system and a computer readable medium for integrated in-vacuo repair of low-k dielectric thin films damaged by etch and/or strip processing. A repair chamber is integrated onto a same platform as a plasma etch and/or strip chamber to repair a low-k dielectri... | 06/23/2011 |
| 20110132874 | SMALL PLASMA CHAMBER SYSTEMS AND METHODS A plasma etch processing tool is disclosed. The plasma etch processing tool, comprising a substrate support for supporting a substrate having a substrate surface area, a processing head including a plasma microchamber having an open side that is oriented over the substr... | 06/09/2011 |
| 20110126984 | EDGE RING ASSEMBLY FOR PLASMA ETCHING CHAMBERS An edge ring assembly used in a plasma etching chamber includes a dielectric coupling ring and a conductive edge ring. In one embodiment, the dielectric coupling ring has an annular projection extending axially upward from its inner periphery. The dielectric coupling ri... | 06/02/2011 |
| 20110126852 | ELECTROSTATIC CHUCK WITH AN ANGLED SIDEWALL A substrate support for a plasma processing chamber has an angled sidewall at an upper periphery thereof. The substrate is surrounded by an edge ring which underlies a substrate supported on an upper substrate support surface of the substrate support during plasma proce... | 06/02/2011 |
| 20110091700 | MICROELECTRONIC PROCESSING COMPONENT HAVING A CORROSION-RESISTANT LAYER, MICROELECTRONIC WORKPIECE PROCESSING APPARATUS INCORPORATING SAME, AND METHOD OF FORMING AN ARTICLE HAVING THE CORROSION-RESISTANT LAYER A microelectronic processing component can include a substrate and a corrosion-resistant layer. The substrate can include a metal-containing material, and the corrosion-resistant layer can be adjacent to the surface region. The corrosion-resistant layer can include a fi... | 04/21/2011 |
| 20110056912 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD Uniformity in a plasma process can be increased by increasing a plasma confining effect by a cusp magnetic field over the whole circumference. There is provided a plasma processing apparatus which performs a process on a substrate by generating plasma of a processing ga... | 03/10/2011 |
| 20110056908 | METHOD AND APPARATUS FOR MANUFACTURING MAGNETIC RECORDING MEDIUM There is provided a method for manufacturing a magnetic recording medium which manufactures media by employing the same in-line apparatus and which is capable of reducing the contamination due to the handling and of enhancing the productivity, 03/10/2011 | |
| 20110049100 | SUBSTRATE HOLDER, SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD USING THE SAME Provided are a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substrate processing method. Particularly, there are provided a substrate holder, a substrate supporting apparatus, a substrate processing apparatus, and a substra... | 03/03/2011 |
| 20110031219 | CYLINDER BARREL INSIDE SURFACE TREATMENT APPARATUS AND METHOD A cylinder barrel inside surface treatment apparatus for providing a uniform treatment finish is disclosed. The treatment apparatus includes a pallet on which a cylinder block is placed with a gasket surface faced upward. A top opening of a cylinder barrel of the cylind... | 02/10/2011 |
