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| Application No. | Application Title | Issue Date |
| 20120103520 | APPARATUS OF ETCHING GLASS SUBSTRATE An apparatus for etching a glass substrate includes a vessel configured to contain an etchant; a first plate in the vessel and configured to receive a horizontally placed glass substrate thereon; and a circulating unit in the vessel facing the first plate and configured... | 05/03/2012 |
| 20120103522 | CLOSED CHAMBER FOR WAFER WET PROCESSING An improved design for a closed chamber process module for single wafer wet processing utilizes a combination lid and gas showerhead for sealing the chamber from above. One or more media arms dispense liquid onto a wafer in the chamber. The media arms are mounted inside... | 05/03/2012 |
| 20110309051 | APPARATUS AND METHOD FOR WET TREATMENT OF AN OBJECT AND FLUID DIFFUSION PLATE AND BARREL USED THEREIN An apparatus for wet treatment of an object includes a treatment bath in which an object to be treated is received and treated; a plurality of object supporting rods rotatably installed in the treatment bath and having a plurality of slots formed in surfaces thereof to ... | 12/22/2011 |
| 20110240601 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD A substrate treatment apparatus is provided, which includes: a seal chamber including a chamber body having an opening, a lid member provided rotatably with respect to the chamber body and configured to close the opening, and a first liquid seal structure which liquid-s... | 10/06/2011 |
| 20110223771 | Wet metal-etching method and apparatus used for MEMS The present invention provides a method of wet etching a silicon slice including a silicon substrate and a metal film layer thereon comprising steps of: performing lithographic process to the silicon slice forming a masked silicon slice comprising the silicon substrate ... | 09/15/2011 |
| 20110223741 | METHOD AND SYSTEM FOR STRIPPING THE EDGE OF A SEMICONDUCTOR WAFER A method and a system are described herein for applying etchant to edges of a plurality of wafers. The system includes a sump configured for holding etchant, a roller having an outer surface in fluid communication with the sump and configured to have etchant thereon, a ... | 09/15/2011 |
| 20110124145 | TEMPLATE FOR THREE-DIMENSIONAL THIN-FILM SOLAR CELL MANUFACTURING AND METHODS OF USE A template 100 for three-dimensional thin-film solar cell substrate formation for use in three-dimensional thin-film solar cells. The template 100 comprises a substrate which comprises a plurality of posts 102 and a plurality of trenches 104 ... | 05/26/2011 |
| 20100294742 | Modifications to Surface Topography of Proximity Head In an example embodiment, a wet system includes a proximity head and a holder for substrate (e.g., a semiconductor wafer). The proximity head is configured to cause a flow of an aqueous fluid in a meniscus across a surface of the proximity head. The surface of the proxi... | 11/25/2010 |
| 20100200163 | APPARATUS AND METHOD FOR WET TREATMENT OF DISC-LIKE ARTICLES Disclosed is an apparatus for wet treatment of a disc-like article, which comprises: a spin chuck for holding and rotating the disc-like article, and an inner edge nozzle dispensing treatment liquid directed towards a first peripheral region of the first surface of the ... | 08/12/2010 |
| 20100130020 | Substrate chucking member, substrate processing, apparatus having the member, and method of processing substrate using the member A substrate chucking member includes a substrate supporting member and a rotation adjustment unit. The supporting member includes a rotatable supporting plate to load a substrate, and chucking pins disposed at the supporting plate for spacing the substrate off the top o... | 05/27/2010 |
| 20100101725 | Apparatus for Making Epitaxial Film An apparatus for growing an epitaxial film and transferring it to an assembly substrate is disclosed. The film growth and transfer are made using an epitaxy lateral overgrowth technique. The formed epitaxial film on an assembly substrate can be further processed to form... | 04/29/2010 |
| 20100029087 | APPARATUS AND METHOD FOR ETCHING SEMICONDUCTOR WAFER An apparatus for etching a semiconductor wafer of the present invention includes a cylindrical inner bath 1 which stores an etchant, a blow-off nozzle 13 which supplies the etchant from a middle part of a bottom surface 7 of the inner bath 1 ... | 02/04/2010 |
| 20100012272 | Substrate etching apparatus A substrate etching apparatus includes a supporting unit for supporting substrate in a vertical position and an etching solution supply unit disposed above the substrate to supply an etching solution to the top of the substrate such that the etching solution runs down b... | 01/21/2010 |
| 20090280597 | Surface cleaning and texturing process for crystalline solar cells Methods for surface texturing a crystalline silicon substrate are provided. In one embodiment, the method includes providing a crystalline silicon substrate, wetting the substrate with an alkaline solution comprising a wetting agent, and forming a textured surface with ... | 11/12/2009 |
| 20090280649 | Topography reduction and control by selective accelerator removal Plating accelerator is applied selectively to a substantially-unfilled wide (e.g., low-aspect-ratio feature cavity. Then, plating of metal is conducted to fill the wide feature cavity and to form an embossed structure in which the height of a wide-feature metal protrusi... | 11/12/2009 |
| 20090227063 | Integrated method and system for manufacturing monolithic panels of crystalline solar cells A method for fabricating a photovoltaic (PV) cell panel wherein all PV cells are formed simultaneously on a two-dimensional array of monocrystalline silicon mother wafers affixed to a susceptor is disclosed. Porous silicon separation layers are anodized in the surfaces ... | 09/10/2009 |
| 20090194234 | SUBSTRATE TREATMENT APPARATUS, AND SUBSTRATE SUPPORT TO BE USED FOR THE APPARATUS The substrate treatment apparatus according to the present invention includes a substrate holding mechanism including a support member which supports a substrate, and an extension surface which laterally surrounds one major surface of the substrate supported by the supp... | 08/06/2009 |
| 20090159210 | Roll-to-roll substrate transfer apparatus, wet etching apparatus comprising the same and apparatus for manufacturing printed circuit board In one aspect, a roll-to-roll substrate transfer apparatus is provided that includes: a feed roll and a take-up roll between which a printed circuit board substrate extends; and a plurality of drive roller rows transmitting motive power to the substrate for moving the s... | 06/25/2009 |
| 20090145552 | Substrate supporting unit and apparatus for treating substrate using the substrate supporting unit Provided are a substrate supporting unit and a substrate treating apparatus using the substrate supporting unit. The substrate supporting unit comprises a base plate and a supporting portion formed on the base plate. The supporting portion comprises two supporting rods ... | 06/11/2009 |
| 20090114619 | WET ETCHING METHOD AND WET ETCHING APPARATUS A fine pattern is formed on a surface of a processing object without using photoresist. A wet etching for the processing object in an area to which ultraviolet light is applied is performed by bringing a solution in which nitrous oxide (N2O) is dissolved into... | 05/07/2009 |
| 20090095712 | Flattening method and flattening apparatus A flattening method, by utilizing the advantages of the CARE method and making up for the disadvantages, can perform removal processing of a surface of a workpiece at a sufficient processing rate and can provide a processed surface having enhanced flatness without leavi... | 04/16/2009 |
| 20090090467 | Spin head Provided is a spin head for supporting and rotating a substrate. The spin head includes a body, chuck pins disposed at the body and movable between supporting positions and rest positions, and a chuck pin moving unit configured to move the chuck pins straight. The chuck... | 04/09/2009 |
| 20090093126 | METHOD OF AND AN APPARATUS FOR PROCESSING A SUBSTRATE A method of processing a semiconductor substrate (3) comprises spinning the semiconductor substrate (3) while dispensing a reactive etching agent (7) onto a first surface of the spinning substrate (3) to etch a first region (8) of the ... | 04/09/2009 |
| 20090093123 | Spin head, chuck pin used in the spin head, and method for treating a substrate with the spin head Provided is a spin head for supporting a substrate. The spin head includes a rotatable body, and chuck pins protruding upward from the body and configured to support an edge of a substrate placed at the body when the body is rotated. Each of the chuck pins includes a ve... | 04/09/2009 |
| 20090071940 | MULTI-SPEED SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD After a development liquid on a substrate is washed away with a rinse liquid, the rotational speed of the substrate is reduced, so that a liquid layer of the rinse liquid is formed over a top surface of the substrate. Thereafter, the rotational speed of the substrate is... | 03/19/2009 |
| 20090061642 | NOZZLE ASSEMBLY, APPARATUS FOR SUPPLYING PROCESSING SOLUTIONS HAVING THE SAME AND METHOD OF SUPPLYING PROCESSING SOLUTIONS USING THE SAME In a nozzle assembly for supplying processing solutions, the nozzle assembly includes a housing, a plurality of supply units arranged in the housing and through which different processing solutions flow onto the substrate, and a plurality of nozzles connected to the sup... | 03/05/2009 |
| 20090038641 | Substrate Cleaning Apparatus, Substrate Cleaning Method, Substrate Processing System, and Storage Medium A substrate cleaning apparatus 40 includes: a cleaning tank 70; a holding table 51 rotatably disposed in the cleaning tank 70, for holding a substrate to be processed W; and a rotary drive mechanism 52 for rotating the holding table 02/12/2009 | |
| 20090042401 | COMPOSITIONS AND METHODS FOR SUBSTANTIALLY EQUALIZING RATES AT WHICH MATERIAL IS REMOVED OVER AN AREA OF A STRUCTURE OR FILM THAT INCLUDES RECESSES OR CREVICES Methods for preventing isotropic removal of materials at corners formed by seams, keyholes, and other anomalies in films or other structures include use of etch blockers to cover or coat such corners. This covering or coating prevents exposure of the corners to isotropi... | 02/12/2009 |
| 20090032188 | SINGLE-WAFER PROCESSOR The present invention provides a single wafer processor structured such that similar immersion treatment to the conventional immersion treatment can be performed in the spin treatment, that a consumption of the chemical solutions can be reduced in the chemical solution ... | 02/05/2009 |
| 20090029560 | Apparatus and method for single substrate processing In a method for treating a semiconductor substrate, a single substrate is positioned in a single-substrate process chamber and subjected to wet etching, cleaning and/or drying steps. The single substrate may be exposed to etch or clean chemistry in the single-substrate ... | 01/29/2009 |
| 20080295962 | METHOD AND SYSTEM FOR MASK HANDLING IN HIGH PRODUCTIVITY CHAMBER A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extension... | 12/04/2008 |
| 20080293253 | Wet etching of the edge and bevel of a silicon wafer An apparatus and method used to selectively etch materials from the edge and bevel areas of a silicon wafer are provided. In one configuration, a bevel etch spin chuck, for use in a device for removing unwanted material from an edge and bevel area of a wafer, includes a... | 11/27/2008 |
| 20080236746 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE MOUNTING STAGE ON WHICH FOCUS RING IS MOUNTED A substrate processing apparatus that can prevent a heat transfer sheet from becoming attached to a focus ring mounting surface of a substrate mounting stage. The substrate mounting stage is disposed in a housing chamber of the substrate processing apparatus, and a subs... | 10/02/2008 |
| 20080196835 | Device and Method For Liquid Treatment of Wafer-Shaped Articles Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W1, a second surface plane W2 and an edge surface. The device includes a support for holding the wafer-shaped article; liquid dispens... | 08/21/2008 |
| 20080176002 | SUBSTRATE TREATMENT METHOD, COATING FILM REMOVING APPARATUS, AND SUBSTRATE TREATMENT SYSTEM According to the present invention, during the photolithography processing of a substrate, exposure processing is performed immediately after removal of a coating film on the rear surface of the substrate, and a coating film is formed on the rear surface of the substrat... | 07/24/2008 |
| 20080149594 | APPARATUS AND PROCESS FOR FORMING AND HANDLING POROUS MATERIALS An apparatus and process for producing a porous particulate media, such as nano-porous silicon (npSi). The apparatus has a rigid etching chamber configured to contain an etching reagent, an inlet for introducing the etching reagent into the etching chamber, and an outle... | 06/26/2008 |
| 20080128085 | Surface Treating Apparatus For Square Wafer For Solar Battery According to the present invention, when performing spin treatment on a square wafer for a solar battery, it is possible to prevent the treatment medium, which is caused to flow down onto the surface of the wafer and scattered to the outside of the wafer from the four s... | 06/05/2008 |
| 20080115891 | Laser beam machining system A laser beam machining system includes: a chuck table for holding a wafer; a laser beam irradiation unit for irradiating the wafer held by a chuck table with a laser beam; a machining feeding unit for machining feed of the chuck table; and an indexing feeding unit for i... | 05/22/2008 |
| 20080083700 | Method and Apparatus for Maximizing Cooling for Wafer Processing Methods for processing wafers, wafer processing apparatus, micro-fluid ejection head substrates, and etching process are provided. One such method includes applying a clamping voltage to an electrostatic chuck sufficient to hold a wafer in a substantially planerized ori... | 04/10/2008 |
| 20080044956 | Apparatus for etching substrate and method of fabricating thin-glass substrate An apparatus for etching a substrate includes (a) a nozzle system including at least one nozzle through which acid solution containing at least hydrofluoric acid is sprayed onto the substrate, (b) a mover which moves at least one of the nozzle system and the substrate r... | 02/21/2008 |
