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| Application No. | Application Title | Issue Date |
| 20080264905 | METHODS AND SYSTEMS FOR MEASURING A CHARACTERISTIC OF A SUBSTRATE OR PREPARING A SUBSTRATE FOR ANALYSIS Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cr... | 10/30/2008 |
| 20080236745 | METHOD AND APPARATUS FOR FABRICATING OR ALTERING MICROSTRUCTURES USING LOCAL CHEMICAL ALTERATIONS A method and apparatus for fabricating or altering a microstructure use means for heating to facilitate a local chemical reaction that forms or alters the submicrostructure.... | 10/02/2008 |
| 20080242103 | Method of manufacturing semiconductor device and semiconductor manufacturing apparatus A method of manufacturing a semiconductor device having a process for cleaning a semiconductor substrate after the semiconductor substrate is etched for patterning includes a first process of preparing the semiconductor substrate having a first temperature, a second pro... | 10/02/2008 |
| 20080223826 | Reagent Delivery using a Membrane-Mediated Process Methods and apparatuses for using a semi-permeable membrane to deliver a reagent to a surface in a topographically selective manner are provided. The methods and apparatuses are particularly useful for removing sulfur-containing electrocatalysts from copper surfaces usi... | 09/18/2008 |
| 20080203058 | SUBSTRATE DEVELOPING METHOD AND DEVELOPING APPARATUS A method for developing a substrate includes a developing step for supplying a developer to the substrate, and a neutralizing and removing step for supplying a treating solution containing a neutralizing material to the substrate to neutralize the developer, and neutral... | 08/28/2008 |
| 20080142484 | Auxiliary method for wet etching by oscillation flow modification and device for the same The present invention provides an auxiliary method for wet etching by oscillation flow modification and an device for the same. The method for wet etching by oscillation flow modification includes steps of providing a metallic substrate, etching the metallic substrate w... | 06/19/2008 |
| 20080099430 | Method for connecting array of optical waveguides to an array of optical fibers with very small pitch A method and apparatus are provided to decrease the diameter of the end of an optical fiber in order to make it possible to arrange optical fibers in an array with very high pitch. Also provided is an optical device comprising a plurality of optical fibers, each fiber f... | 05/01/2008 |
| 20080096393 | Apparatus and method of etching a semiconductor substrate An apparatus for etching a semiconductor substrate may include a bath, a reaction preventing layer, and a nozzle. The bath may receive a chemical solution. Grooves may be formed at the inner wall of the bath. The reaction preventing layer may be formed on the inner wall... | 04/24/2008 |
| 20080073030 | Apparatus for manufacturing semiconductor device An apparatus according to the present invention, includes an etching solution tank which contains etching solution used for a wet etching process, a wet etching process to a semiconductor wafer being carried out in the etching solution tank; a nitrogen gas supply compon... | 03/27/2008 |
| 20080011713 | Substrate processing apparatus, substrate processing method and substrate manufacturing method A substrate processing apparatus of the invention has a self-propelled carrying mechanism 15 configured to enable a processing target substrate W to be carried to/from each of liquid processing apparatuses HB, COT and DEV where at least two liquid processing appa... | 01/17/2008 |
| 20070240824 | Liquid processing apparatus A liquid processing apparatus includes a substrate holding member configured to rotate along with a substrate held thereon in a horizontal state; a rotary cup configured to surround the substrate and to rotate along with the substrate; a liquid supply mechanism configur... | 10/18/2007 |
| 20070235132 | Photoresist stripping apparatus, method of recycling photoresist stripper, and method of manufacturing thin film transistor array panel using the photoresist stripping apparatus Provided is a photoresist (PR) stripping apparatus that enables the recycling of a photoresist stripper and utilizes a continuous filtering action during a filter operation. The PR-stripping apparatus includes a PR stripping tank for receiving a substrate having a PR pa... | 10/11/2007 |
| 20070227655 | Processing method for wafer and processing apparatus therefor A processing method for a wafer includes: preparing a wafer which has a device region having plural devices formed on a surface of the wafer; and a peripheral reinforcing portion which is integrally formed around the device region and has a projection projecting outward... | 10/04/2007 |
| 20070215572 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS A processing fluid is prepared by mixing purified water and methanol as a solvent with SCCO2, and the processing fluid is brought into contact with a surface of a substrate so as to form oxide film on the surface of the substrate. In this processing fluid, SCCO2 functio... | 09/20/2007 |
| 20070199655 | SUBSTRATE PROCESSING APPARATUS, METHOD FOR MODIFYING SUBSTRATE PROCESSING CONDITIONS AND STORAGE MEDIUM A substrate processing apparatus includes a setting unit for setting substrate processing conditions for a substrate in a substrate processing unit for performing a process on the substrate; a detection unit for detecting an abnormality of the substrate processing unit ... | 08/30/2007 |
| 20070187037 | Semiconductor development apparatus and method using same A knife edge ring apparatus is provided for use during semiconductor manufacturing which includes a ring-shaped body having an inner side wall, an outer side wall and a top surface having a predetermined width. A multi-staged inclined portion is formed in the outer side... | 08/16/2007 |
| 20070175863 | Single Wafer Etching Apparatus and Single Wafer Etching Method An object of the present invention is to provide a single wafer etching apparatus realizing a high flatness of wafers and an increase in productivity thereof. In the single wafer etching apparatus, a single thin disk-like wafer sliced from a silicon single crystal ingot... | 08/02/2007 |
| 20070169795 | Apparatus for cleaning substrates An apparatus for cleaning substrates includes a supporting member supporting substrates in an upright position, and a liquid supplying member including a first nozzle disposed at one side of a vertical centerline of the substrates, and a second nozzle is disposed at ano... | 07/26/2007 |
| 20070157947 | Substrate drying apparatus and method of substrate drying using the same A substrate drying apparatus, including a cleaning bath having a liquid supply unit, a drying tank having a gas supply unit and at least one nozzle in fluid communication with the gas supply unit, and a transfer unit for transferring a substrate from the cleaning bath t... | 07/12/2007 |
| 20070151950 | Etching apparatus for use in manufacture of flat panel display device and manufacturing method using the same Disclosed herein are an apparatus and method for manufacturing a flat panel display device. The apparatus and method for manufacturing a flat panel display device contribute to a compact apparatus for etching a substrate and damage or breakage prevention of the substrat... | 07/05/2007 |
