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| Application No. | Application Title | Issue Date |
| 20120128499 | STRUCTURAL ADHESIVE COMPOSITIONS Disclosed herein are 2K structural adhesive compositions comprising (a) a first component comprising (i) an epoxy-adduct formed as a reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid; and (ii) a second epoxy comp... | 05/24/2012 |
| 20120103517 | HEAT-RESISTANT STRUCTURAL EPOXY RESINS Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake... | 05/03/2012 |
| 20120067519 | Nacre composites, methods of synthesis, and methods of use The present invention relates to a novel composite structure with enhanced toughness, which incorporates features mimicked from nacre (mother of pearl). The structure can be used in many industrial and clinical applications, including aeronautics (aircraft skin), the de... | 03/22/2012 |
| 20120067763 | CAN WITH BISPHENOL A CAPTURE SYSTEM The present technology provides a bisphenol A capture system for food and beverage containers which include BPA-containing coatings. The capture system is made of one or more materials which bind any BPA eluting from the BPA-containing coating. The present capture syste... | 03/22/2012 |
| 20120070670 | HYBRID COMPONENTS WITH REACTIVE HOTMELT ADHESIVES A description is given of the use of reactive hotmelt adhesives based on copolyamide and further comprising isocyanate and epoxide and also a functionalized polyolefin in hybrid components. These hybrid components find applications in vehicle construction and in aircraf... | 03/22/2012 |
| 20120024477 | ROOM TEMPERATURE CURING EPOXY ADHESIVE Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a... | 02/02/2012 |
| 20110315317 | METHOD FOR ASSEMBLING DISPLAY MODULE A display module includes a panel module and a frame and is able to be assembled to a cover to form a display device. At first, the panel module is provided that includes the first side and the second side and then a frame is provided, where the frame has an opening. Th... | 12/29/2011 |
| 20110315223 | COATING HAVING IMPROVED HYDROLYTIC RESISTANCE Coatings utilized in multilayer sheets such as laminated films used for photovoltaic backsheets can be prepared by adding epoxy and carbodiimide to a polyurethane mixture to be utilized as the adhesive, prior to application of the coating to a substrate. Such coatings c... | 12/29/2011 |
| 20110313082 | EPOXY ADHESIVE COMPOSITIONS WITH HIGH MECHANICAL STRENGTH OVER A WIDE TEMPERATURE RANGE A heat-curable adhesive composition comprising an epoxy-resin, a combination of core-shell toughening agents, a first curing agent being a linear aliphatic amined and a second curing agent being a cyclic aliphatic amine and a filler wherein the composition can be cured ... | 12/22/2011 |
| 20110297317 | ONE-PART STRUCTURAL EPOXY RESIN ADHESIVES CONTAINING DIMERIZED FATTY ACID/EPOXY RESIN ADDUCT AND A POLYOL Structural adhesives containing a non-rubber-modified epoxy resin, an elastomeric toughener and a curing agent further include an epoxy-functional fatty acid oligomer and a polyol. The presence of the epoxy-functional fatty acid oligomer and a semi-crystalline or crysta... | 12/08/2011 |
| 20110297316 | LOW TEMPERATURE METHOD AND SYSTEM FOR FORMING FIELD JOINTS ON UNDERSEA PIPELINES A method for forming a field joints between sections of coated or insulated pipe which are to be welded together and incorporated into an undersea pipeline for carrying single or multi-phase fluids such as oil, gas and water. The method includes the application of a liq... | 12/08/2011 |
| 20110297318 | METAL-TO-POLYMER BONDING USING AN ADHESIVE BASED ON EPOXIDES A process of bonding a metal substrate to a non-halogenated polymer, especially of bonding a polyolefin overcoat to a metallic tube or pipe, using an epoxy-based adhesive which comprises at least one salt of a metal ion M in an oxidation state of n which has a standard ... | 12/08/2011 |
| 20110284160 | 2-Component Adhesives The invention relates to 2-component adhesives comprising one or more epoxy resins as a first component (E) and one or more amphiphilic epoxy resin hardeners as a second component (H), wherein the first component (E) and the second component (H) are reacted in water in ... | 11/24/2011 |
| 20110274888 | Composite Material, Method for Producing a Composite Material and Adhesive or Binding Material The invention relates to a composite material made up of at least one ceramic layer or at least one ceramic substrate and at least one metallization formed by a metallic layer on a surface side of the at least one ceramic substrate.... | 11/10/2011 |
| 20110266788 | SECURITY LAMINATES WITH INTERLAMINATED TRANSPARENT EMBOSSED POLYMER HOLOGRAM A method for interlaminating a transparent embossed hologram, the transparent embossed hologram comprising a support having two sides, at least one of the two sides either itself being embossed or having a layer thereon which is embossed and a layer of a HRI-material co... | 11/03/2011 |
| 20110247757 | CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layer... | 10/13/2011 |
| 20110244245 | EPOXY ADHESIVE COMPOSITIONS COMPRISING AN ADHESION PROMOTER Curable adhesive compositions comprising
| 10/06/2011 |
| 20110227678 | MAGNETIC-DIELECTRIC ASSEMBLIES AND METHODS OF FABRICATION A method for making a composite magnetic-dielectric disc assembly includes forming a dielectric ceramic annular cylinder, forming a magnetic ceramic rod, assembling the magnetic ceramic rod coaxially inside the dielectric ceramic cylinder, joining the magnetic ceramic r... | 09/22/2011 |
| 20110228378 | ELECTROPHORETIC DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME A method of manufacturing is disclosed for an electrophoretic display apparatus that includes an array substrate and an electrophoretic film laminated to the array substrate. A thermally activated adhesive is used to adhesively attach the electrophoretic film to the arr... | 09/22/2011 |
| 20110221308 | METHOD FOR GLUING COMPONENTS, FORMING A TEMPERATURE-RESISTANT ADHESIVE LAYER A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ≧100° C. to ≦160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system i... | 09/15/2011 |
| 20110204616 | SECURITY LAMINATES WITH INTERLAMINATED TRANSPARENT EMBOSSED POLYMER HOLOGRAM A method for interlaminating a transparent embossed hologram, the transparent embossed hologram comprising a support having two sides, at least one of the two sides either itself being embossed or having a layer thereon which is embossed and a layer of a HRI-material co... | 08/25/2011 |
| 20110194118 | WAVELENGTH VARIABLE INTERFERENCE FILTER, OPTICAL SENSOR, ANALYZER AND PROCESS FOR PRODUCING WAVELENGTH VARIABLE INTERFERENCE FILTER A wavelength variable interference filter includes: a first substrate which has a light transmissive property; a second substrate which has a light transmissive property and is disposed to face one surface of the first substrate and is bonded thereto; a first reflection... | 08/11/2011 |
| 20110187029 | ALIPHATIC-AROMATIC POLYESTER The present invention provides an aliphatic aromatic polyester comprising:
| 08/04/2011 |
| 20110159307 | Method for Gluing Two Plastic Surfaces Together A method glues two plastic surfaces together via an adhesion produced by a heat-activatable adhesive. An adhesive, which is used as a heat-activatable adhesive, is based on i) at least one thermoplastic having a softening temperature or melting temperature in the region... | 06/30/2011 |
| 20110155320 | SILANE/UREA COMPOUND AS A HEAT-ACTIVATABLE CURING AGENT FOR EPOXIDE RESIN COMPOSITIONS Silanes of formula (I), or of substrates whose surface is coated or derivatized with a silane of formula (I), as a curing agent for epoxy resins which is activatable at elevated temperature. Such thermosetting epoxy resin compositions allow a large reduction in the curi... | 06/30/2011 |
| 20110143142 | HYBRID COMPONENTS CONTAINING REACTIVE HOTMELT ADHESIVES Reactive hotmelt adhesives based on copolyamide can be used in hybrid components. These hybrid components find application in, for example, vehicle construction and aircraft construction.... | 06/16/2011 |
| 20110126981 | ONE-PART STRUCTURAL EPOXY RESIN ADHESIVES CONTAINING ELASTOMERIC TOUGHENERS CAPPED WITH PHENOLS AND HYDROXY-TERMINATED ACRYLATES OR HYDROXY-TERMINATED METHACRYLATES Structural adhesives are prepared from an elastomeric toughener that contains urethane and/or urea groups, and have some terminal isocyanate groups that are capped with a phenol and other terminal isocyanate groups that are capped with a hydroxy-functional acrylate or a... | 06/02/2011 |
| 20110126980 | TWO-PART EPOXY-BASED STRUCTURAL ADHESIVES A two-part epoxy-based structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and an oil-displacing agent. The structural adhesive may optionally include reactive liquid modifiers, fillers, secondary curatives, react... | 06/02/2011 |
| 20110128624 | Reflective object and the production process thereof The present invention is related to a reflective object, which comprises the structure with the following layers sequentially: an adhesive layer embedded with optical components; a color layer; and a reflective layer; wherein the reflective object is characterized that ... | 06/02/2011 |
| 20110120646 | TWO-PART EPOXY-BASED STRUCTURAL ADHESIVES A two-part structural adhesive composition comprising a curable epoxy resin, an amine curing agent, a toughening agent, and a reactive liquid modifier. The structural adhesive may also include secondary curatives, initiators, reactive diluents and combinations thereof. ... | 05/26/2011 |
| 20110100709 | SPD FILMS AND LIGHT VALVE LAMINATES WITH IMPROVED BUS-BAR CONNECTIONS A connection between a power bus and a conducting layer of a suspended particle device in accordance with an embodiment of the present application includes an adhesive combined with metallic particles to impart both good adhesion and electrical conductivity. The adhesiv... | 05/05/2011 |
| 20110095490 | COATED SEAL FOR SEALING PARTS IN A VEHICLE ENGINE A coated seal for sealing parts in a vehicle engine is disclosed herein. The seal includes a seal body portion including glass fiber-filled polytetrafluoroethylene, carbon-filled polytetrafluoroethylene, molybdenum disulfide-filled polytetrafluoroethylene, bronze-filled... | 04/28/2011 |
| 20110088935 | CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND JOINING METHOD The present invention aims to provide conductive particles which can reduce the stress while maintaining high hardness (hardly causing cracks even in a state of being crushed in connection process) by improving rolling properties and can ensure adequate conductive relia... | 04/21/2011 |
| 20110073344 | GASKET CONTAINING CARBON NANOTUBES A composition for forming a gasket comprises a curable elastomer material and 0.1-20 weight % (e.g., 4-10 weight %) carbon nanotubes dispersed throughout the elastomer material. A dispensed bead of elastomer material exhibits a Slump ratio of at least 0.7. The compositi... | 03/31/2011 |
| 20110067813 | HEAT-CURING EPOXY RESIN COMPOSITION COMPRISING AN ACCELERATOR HAVING HETEROATOMS A heat-curing epoxy resin composition that includes an epoxy resin, a curing agent, an accelerator, and an optional toughener. The epoxy resin compositions are suitable in particular for use as bodyshell adhesives and for preparation of structural foams. An accelerator ... | 03/24/2011 |
| 20110067812 | CURE ACCELERATORS An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the im... | 03/24/2011 |
| 20110064953 | Assemblies and Methods for Reducing Warp and Bow of a Flexible Substrate During Semiconductor Processing Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexib... | 03/17/2011 |
| 20110048640 | METHOD FOR PRODUCING CIRCUIT CARRIERS A method for the automated production of circuit carriers, comprising providing a substrate for accommodating electronic components, applying an electrically conductive, metal-containing base structure on the substrate. Electronic components are also provided on the sub... | 03/03/2011 |
| 20110043733 | ADHESIVE POLARIZATION PLATE, IMAGE DISPLAY AND METHODS FOR MANUFACTURING ADHESIVE POLARIZATION PLATE AND IMAGE DISPLAY Provided is a pressure-sensitive adhesive polarizing plate, including: a polarizer (P); a transparent protective film (E) provided on only one side of the polarizer (P) with an adhesive layer (G) interposed therebetween; a pressure-sensitive adhesive layer (B) provided ... | 02/24/2011 |
| 20110039108 | HIGH STRENGTH EPOXY ADHESIVE AND USE THEREOF A heat-curable adhesive composition comprising an epoxy-resin, a toughening agent, a curing agent and an acetoacetoxy-functionalized compound wherein the composition can be cured to form structural adhesives of high impact strength.... | 02/17/2011 |
