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| Application No. | Application Title | Issue Date |
| 20110005644 | COPPER ALLOY MATERIAL FOR ELECTRIC/ELECTRONIC PARTS A copper alloy material for an electric/electronic part, containing Co 0.5 to 2.5 mass % and Si 0.1 to 1.0 mass %, at a ratio of Co/Si of 3 to 5 in terms of mass ratio, with the balance of Cu and inevitable impurities, which is obtained by subjecting to a solution treat... | 01/13/2011 |
| 20100139822 | Cu-Ti-based copper alloy sheet material and method of manufacturing same Provided is a Cu—Ti-based copper alloy sheet material that satisfies all the requirements of high strength, excellent bending workability and stress relaxation resistance and has excellent sprig-back resistance. The copper alloy sheet material has a composition contai... | 06/10/2010 |
| 20100000860 | Copper Sputtering Target With Fine Grain Size And High Electromigration Resistance And Methods Of Making the Same The present invention generally provides a sputtering target comprising copper and a total of 0.001 wt %˜10 wt % alloying element or elements chosen from the group consisting of Al, Ag, Co, Cr, Ir, Fe, Mo, Ti, Pd, Ru, Ta, Sc, Hf, Zr, V, Nb, Y, and rare earth metals. An... | 01/07/2010 |
| 20060219328 | Process for producing a sliding bearing with a sliding surface, consisting of a copper multicomponent alloy The invention relates to a process for producing a sliding bearing with a sliding surface, consisting of a copper multicomponent alloy with at least two phase constituents, in which process at least one phase constituent at the sliding surface is dissolved by means of a... | 10/05/2006 |
