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| Application No. | Application Title | Issue Date |
| 20120031427 | Methods For Stabilizing Contact Surfaces of Electrostatic Chucks Methods for stabilizing a ceramic contact surface of an electrostatic chuck, wherein the electrostatic chuck can be disposed within a reaction chamber of a semiconductor wafer processing assembly including a radio frequency source and a coolant gas supply are described ... | 02/09/2012 |
| 20120024315 | METHOD FOR MEGASONIC PROCESSING OF AN ARTICLE A method for megasonic processing of an article. In one aspect, the invention may be a method of processing semiconductor wafers comprising: supporting the semiconductor wafer substantially horizontally; positioning a rod-like probe above an upper surface of the semicon... | 02/02/2012 |
| 20120012134 | METHOD FOR CLEANING ELECTRONIC MATERIAL AND DEVICE FOR CLEANING ELECTRONIC MATERIAL A resist on an electronic material is surely separated and removed in a short time. The electronic material is cleaned with a sulfuric acid solution containing persulfuric acid to separate and clean the resist, and thereafter wet cleaning is performed with gas dissolved... | 01/19/2012 |
| 20120015524 | Process for Enhancing Solubility and Reaction Rates In Supercritical Fluids Processes for enhancing solubility and the reaction rates in supercritical fluids are provided. In preferred embodiments, such processes provide for the uniform and precise deposition of metal-containing films on semiconductor substrates as well as the uniform and preci... | 01/19/2012 |
| 20110290277 | Methods and Apparatus for Cleaning Semiconductor Wafers A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor subst... | 12/01/2011 |
| 20110230054 | SEMICONDUCTOR SUBSTRATE CLEANING METHOD In one embodiment, a semiconductor substrate cleaning method is disclosed. The method can clean a semiconductor substrate by using a chemical of 80° C. or above. The method can rinse the semiconductor substrate by using pure water of 40° C. or above after the cleaning... | 09/22/2011 |
| 20110155169 | ULTRASONIC CLEANING FLUID, METHOD AND APPARATUS A cleaning fluid including dispersed gas avoids using ultrasonic energy to induce cavitation by subjecting a liquid containing dissolved gas to a pressure reduction in a bubble machine, to generate a gas/liquid dispersion. The cleaning fluid can be used to clean article... | 06/30/2011 |
| 20110088719 | Method and Apparatus for Cleaning a Semiconductor Substrate Disclosed are systems and methods for cleaning semiconductor substrates, wherein a nucleation structure having nucleation sites is mounted facing a surface of the substrate to be cleaned. The substrate and structure are brought into contact with a cleaning liquid, which... | 04/21/2011 |
| 20110041874 | POLYMER REMOVING APPARATUS AND METHOD A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounti... | 02/24/2011 |
| 20110000504 | Method and Apparatus for Controlling Optimal Operation of Acoustic Cleaning Methods and apparatuses for cleaning a surface of a substrate are presented. The method comprises positioning a substrate at a controllable distance from a piezoelectric transducer, supplying a cleaning liquid between the substrate and the transducer, applying an oscill... | 01/06/2011 |
| 20100294306 | METHOD AND SOLUTION FOR CLEANING SEMICONDUCTOR DEVICE SUBSTRATE Provided is a method for cleaning a semiconductor device substrate, which is excellent in removability and re-adhesion-preventing properties of contaminations of fine particles or organic matter, metal contamination and combined contamination of organic matter and metal... | 11/25/2010 |
| 20100275951 | SEMICONDUCTOR PROCESSING METHOD A process for treating the surface of a substrate in the manufacture of a semiconductor device. The process comprises providing a concentrated acid or base, a peroxide and water, and delivering the acid or base, the peroxide and the water to the surface of the substrate... | 11/04/2010 |
| 20100258142 | APPARATUS AND METHOD FOR USING A VISCOELASTIC CLEANING MATERIAL TO REMOVE PARTICLES ON A SUBSTRATE The embodiments provide apparatus and methods for removing particles from a substrate surface, especially from a surface of a patterned substrate (or wafer). The cleaning apparatus and methods have advantages in cleaning patterned substrates with fine features without s... | 10/14/2010 |
| 20100261054 | Lithium Primary Cells A method for treating a cathode electrode assembly. The method includes providing an electrode including iron disulfide and contacting the electrode with a solution including acid to remove impurities from the electrode. The electrode may then be dried under various con... | 10/14/2010 |
| 20100240204 | METHODS FOR FORMING METAL GATE TRANSISTORS A method for cleaning a diffusion barrier over a gate dielectric of a metal-gate transistor over a substrate is provided. The method includes cleaning the diffusion barrier with a first solution including at least one surfactant. The amount of the surfactant of the firs... | 09/23/2010 |
| 20100210104 | METHOD FOR FORMING COPPER WIRING IN A SEMICONDUCTOR DEVICE A process for forming a copper wiring and the prevention of copper ion migration in a semiconductor device is disclosed herein. The process includes conducting a post-cleaning process for a copper layer that is to form the cooper wiring after already having undergone a ... | 08/19/2010 |
| 20100192974 | METHOD FOR ULTRASONIC CLEANING OF CONTAMINATION ATTACHED TO A SURFACE OF AN OBJECT An ultrasonic cleaning method in which ultrasonic cleaning of a contamination attached to a surface of an object to be cleaned is performed by directing toward the object to be cleaned, a cleaning liquid to which ultrasonic waves are applied by alternately focusing firs... | 08/05/2010 |
| 20100170531 | Methods of Removing Particles From Over Semiconductor Substrates Some embodiments include methods of removing particles from over surfaces of semiconductor substrates. Liquid may be flowed across the surfaces and the particles. While the liquid is flowing, electrophoresis and/or electroosmosis may be utilized to enhance transport of ... | 07/08/2010 |
| 20100108093 | ACOUSTIC ASSISTED SINGLE WAFER WET CLEAN FOR SEMICONDUCTOR WAFER PROCESS A method for cleaning a substrate is provided that includes applying a liquid medium to a surface of the substrate such that the liquid medium substantially covers a portion of the substrate that is being cleaned. One or more transducers are used to generate acoustic en... | 05/06/2010 |
| 20100043823 | METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMOSITIONS The present invention relates to aqueous compositions comprising amidoxime compounds and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The compositions of the invention may optionally contain one or more ... | 02/25/2010 |
| 20100043822 | REMOVING BUBBLES FROM A FLUID FLOWING DOWN THROUGH A PLENUM In an example embodiment, a top proximity head for depositing fluids on a semiconductor wafer includes a delivery bore which receives fluid. The top proximity head includes a plenum that is connected to the delivery bore by numerous input channels into which fluid flows... | 02/25/2010 |
| 20100000569 | CONTAMINATION MONITORING AND CONTROL TECHNIQUES FOR USE WITH AN OPTICAL METROLOGY INSTRUMENT A technique is provided for monitoring and controlling surface contaminants on optical elements contained within the optical path (or sub-path) of an optical metrology instrument. The technique may be utilized in one embodiment in such a manner as to not require that ad... | 01/07/2010 |
| 20090320875 | DUAL CHAMBER MEGASONIC CLEANER Embodiments described herein relate to semiconductor device manufacturing, and more particularly to a vertically oriented dual megasonic module for simultaneously cleaning multiple substrates. In one embodiment, an apparatus for cleaning multiple substrates is provided.... | 12/31/2009 |
| 20090301518 | Substrate Processing Apparatus and Substrate Processing Method A substrate processing apparatus includes: a polishing device 30A for polishing the surface of a substrate; and at least one of an ultrasonic cleaning device 42 for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, a... | 12/10/2009 |
| 20090277472 | Photoresist Stripping Method and Apparatus The present invention pertains to methods for removing unwanted material from a work piece. More specifically, the invention pertains to stripping photoresist material from, e.g., a semiconductor wafer during semiconductor manufacturing. Methods involve implementing a p... | 11/12/2009 |
| 20090241988 | PHOTORESIST AND ANTIREFLECTIVE LAYER REMOVAL SOLUTION AND METHOD THEREOF An aqueous solution composition may include an organic base hydroxide, potassium hydroxide, a compound selected from the group of compounds consisting of 2-mercaptobenzimidazole, 1-Phenyl-1H-tetrazole-5-thiol and 2-MerCaptoBenzoThiazole, hydrogen peroxide and deionized ... | 10/01/2009 |
| 20090139542 | APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE An apparatus for manufacturing a semiconductor device, includes: an application section configured to apply a force to a defect present on a surface of a substrate; a defect inspector configured to detect a position of the defect; a position comparator configured to com... | 06/04/2009 |
| 20090139541 | Gas dissolved water producing apparatus and method thereof and ultrasonic cleaning equipment and method thereof A gas dissolved water producing apparatus includes a gas dissolving section, a gas channel for guiding a gas into the dissolving section, a first water channel for guiding water into the dissolving section, a gas dissolved water discharge channel, and a second water cha... | 06/04/2009 |
| 20090114246 | Methods For Treating Surfaces Some embodiments include methods for treating surfaces. Beads and/or other insolubles may be dispersed within a liquid carrier to form a dispersion. A transfer layer may be formed across a surface. The dispersion may be directed toward the transfer layer, and the insolu... | 05/07/2009 |
| 20090107519 | METHOD AND SYSTEM FOR CHEMICALLY ENHANCED LASER TRIMMING OF SUBSTRATE EDGES An apparatus for processing a peripheral portion of a substrate includes a housing and a spin chuck mounted within the housing and configured to support the substrate in a substantially horizontal orientation. The apparatus also includes a fluid dispense nozzle coupled ... | 04/30/2009 |
| 20090095320 | Composition for Removing Photresist Layer and Method for Using it A new composition for removing a photoresist layer and a method for using the same are disclosed. The composition comprises a polar solvent and an oxidant. The composition according to the present invention comprises chemical substances with less toxicity and flammabili... | 04/16/2009 |
| 20090095321 | METHOD FOR CLEANING SILICON WAFER A method for cleaning a silicon wafer includes (S11) cleaning surfaces of a silicon wafer using an SC-1 cleaning solution according to standard clean 1; (S12) rinsing the surfaces of the silicon wafer, cleaned in the step S11, using deionized water;... | 04/16/2009 |
| 20090071506 | Debris removal in high aspect structures A method of debris removal is provided. The method includes positioning a nanometer-scaled tip adjacent to a piece of debris on a substrate. The method also includes adhering the piece of debris to the tip. In addition, the method also includes removing the piece of deb... | 03/19/2009 |
| 20090065027 | SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND SUBSTRATE TREATMENT APPARATUS A substrate cleaning apparatus is capable of cleaning an entire periphery of a substrate end portion at a time by simple control without polishing the end portion and without generating plasma. The substrate cleaning apparatus has a mounting table 204 on which a ... | 03/12/2009 |
| 20090056744 | WAFER CLEANING COMPOSITIONS AND METHODS Compositions and methods of removing debris including organic debris from a hydrophobic surface during semiconductor processing are disclosed. The method includes exposing a semiconductor wafer having debris, including organic debris, thereon to a cleaning solution incl... | 03/05/2009 |
| 20090050176 | Method for Removing Particles From a Semiconductor Surface Method for cleaning a surface is disclosed comprising a cleaning step with an aqueous cleaning medium, which is supplied to said semiconductor surface wherein the cleaning medium comprises cleaning particles suspended in a colloidal form and mechanical agitation is appl... | 02/26/2009 |
| 20090038638 | MEGASONIC CLEANING SYSTEM A system for cleaning semiconductor packages is provided which comprises a pickhead that is configured to hold the semiconductor packages in an array arrangement and a plurality of nozzles, each of which is constructed and arranged to project a separate jet of cleaning ... | 02/12/2009 |
| 20090032056 | CONTAMINANT REMOVING METHOD, CONTAMINANT REMOVING MECHANISM, AND VACUUM THIN FILM FORMATION PROCESSING APPARATUS A contaminant removing method of this invention has a step of emitting, in a vacuum, a directional beam to at least one of the lower surface edge and circumferential surface of a substrate to be processed having a thin film formed on its upper surface.... | 02/05/2009 |
| 20090020137 | CLEANING APPARATUS AND METHOD, EXPOSURE APPARATUS HAVING THE CLEANING APPARATUS, AND DEVICE MANUFACTURING METHOD A cleaning apparatus includes an irradiation unit configured to irradiate onto a substrate a laser beam having a pulse width of a picosecond-level or femtosecond-level range, and to clean the substrate via the laser beam.... | 01/22/2009 |
| 20090023303 | METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A sealed type container accommodating a semiconductor substrate is positioned to a load port of a semiconductor manufacturing apparatus. The semiconductor substrate is taken out of the container. An ionizer is used for static-charge-eliminating the semiconductor substra... | 01/22/2009 |
