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Class 125/39 - Diamond


Subclass of Class 125 - Stone working
Definition: The cutting portion consists of a diamond rigidly held in
No. of applications: 11
Last issue date: 08/26/2010


Application No.Application TitleIssue Date
20100212650CUTTING MACHINE FOR BLOCKS OF NATURAL STONE AND SIMILAR INTO SLABS WITH DIAMOND WIRES
A machine for cutting blocks of natural or similar types of stone includes a plurality of diamond-wire loops, wound about an assembly for the support and transmission of the cutting motion to said diamond-wire loops and at least one assembly for supporting, tensioning a...
08/26/2010
20100175677Diamond wire saw
A diamond wire saw with an improved structure is provided. The diamond wire saw is capable of cutting operation along curved paths with small radii of curvature. In addition, the diamond wire saw is configured to prevent a diamond particle layer covering a surface there...
07/15/2010
20100170495METHOD AND SYSTEM FOR MANUFACTURING WAFER-LIKE SLICES FROM A SUBSTRATE MATERIAL
The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices.

The method comprises providing a slicing device ...

07/08/2010
20100031947Blade
A blade comprises a strip having a main body portion and an edge portion. Cutting medium in the form of a diamond grit is secured to the strip by braze material. The edge portion is thinner than the main body portion....
02/11/2010
20090139509CUTTING TIP, METHOD FOR MAKING THE CUTTING TIP AND CUTTING TOOL
The present invention relates to a cutting tip for a cutting tool, which is used in cutting or drilling a brittle workpiece such as stone, bricks, concrete, and asphalt and has an excellent cutting speed and a long lifetime, a method of manufacturing the cutting tip, an...
06/04/2009
20090071309Structure Of Low Noise Saw And Low Noise Diamond Saw
Disclosed is a diamond saw capable of reducing noise by installing a damper for absorbing vibration in a shank. The low noise diamond saw comprises: a shank formed of a circular metallic plate; and a diamond blade bonded to an outer circumferential surface of the shank,...
03/19/2009
20080308727Sample Preparation for Micro-Analysis
System and method for preparing a sample for micro-analysis, comprising: (a) sample precursor holding unit, for supporting and holding a sample precursor; (b) transporting and positioning unit, for transporting and positioning the sample precursor holding unit; (c) opti...
12/18/2008
20080302349STONE THICKNESS CORRECTING TOOL FOR HANDHELD MACHINES
A tool for creating uniform thickness around the edge of a stone slab for seaming or profiling thereof. The tool is used with portable routers or other handheld machines. A spindle side spacer, bearing assembly and blade side spacer establish a fixed depth at which the ...
12/11/2008
20080149575Quartz Glass Tool for Heat Treatment of Silicon Wafer and Process for Producing the Same
To provide a quartz glass tool, for silicon wafer heat treatment, having a transparent grooving face, which is free from the deposition of particles of a transition metal element foreign material derived from glass dust or diamond blade produced by breakdown of acute ir...
06/26/2008
20070004175Semiconductor wafer cutting blade and method
The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device singulation includes a step of sawing kerfs approximately coinciding with the peri...
01/04/2007
20050076897Material for diamond sintered body die and diamond sintered body die
To provide a diamond compact die semi-manufactured product and a diamond compact die that do not crack during die processing. A diamond compact die semi-manufactured product includes a diamond compact and a holding ring. The holding ring is a cylinder composed of a tung...
04/14/2005
 
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