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| Application No. | Application Title | Issue Date |
| 20120006312 | SELF-CLEANING WIRESAW APPARATUS AND METHOD The present invention provides a self-cleaning wiresaw cutting apparatus including a cleaning mechanism adapted to clean the components of the wiresaw before, during, or after a cutting process or to humidify the cutting region of the apparatus. The apparatus contains a... | 01/12/2012 |
| 20110303210 | WIRESAW CUTTING METHOD The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical prope... | 12/15/2011 |
| 20110253122 | SAW DRIVE ARRANGEMENT Saws (1) for cutting or sawing harder materials, such as concrete, concrete structures, brick and stone, have an endless cutting member (4) that is driven through a transmission assembly (11, 20) being supported in the saw and having a drive member ... | 10/20/2011 |
| 20110240002 | CUTTING FLUID COMPOSITION FOR WIRESAWING The present invention provides an aqueous wiresaw cutting fluid composition that reduces the amount of hydrogen produced during a wiresaw cutting process. The composition is comprised of an aqueous carrier, a particulate abrasive, a thickening agent, and a hydrogen supp... | 10/06/2011 |
| 20110240001 | WIRESAW APPARATUS AND METHOD FOR CONTINUOUS REMOVAL OF MAGNETIC IMPURITIES DURING WIRESAW CUTTING The invention provides a method and apparatus for removing magnetic or magnetized contaminants from a wiresaw cutting slurry during a wiresaw cutting process. The apparatus comprises a recirculating slurry dispensing system that defines the slurry flow pathway. The reci... | 10/06/2011 |
| 20110192389 | ENVIRONMENTALLY-FRIENDLY CUTTING APPARATUS USING A WIRE SAW, AND CUTTING METHOD USING SAME The present invention relates to an apparatus and to a method for cutting a concrete structure using a diamond wire saw. More particularly, the present invention relates to an environmentally-friendly cutting apparatus using a wire saw and to a cutting method using the ... | 08/11/2011 |
| 20110174285 | INGOT CUTTING APPARATUS AND INGOT CUTTING METHOD An ingot cutting apparatus having at least one coolant pocket storing the coolant to be supplied to the blade, wherein the blade-abrasive-grain portion is brought into contact with the coolant stored in the at least one coolant pocket by causing the blade-abrasive-grain... | 07/21/2011 |
| 20110163326 | SUBSTRATE, EPITAXIAL LAYER PROVIDED SUBSTRATE, METHOD FOR PRODUCING SUBSTRATE, AND METHOD FOR PRODUCING EPITAXIAL LAYER PROVIDED SUBSTRATE The present invention provides a substrate formed at a low cost and having a controlled plate shape, an epitaxial layer provided substrate obtained by forming an epitaxial layer on the substrate, and methods for producing them. The method for producing the substrate acc... | 07/07/2011 |
| 20110126814 | BAND SAW CUTTING APPARATUS AND INGOT CUTTING METHOD The present invention is a band saw cutting apparatus including: a cutting table on which an ingot is horizontally placed; an endless-belt blade provided in a tensioned state between pulleys, the blade having a blade-abrasive-grain portion and a blade base; and a coolan... | 06/02/2011 |
| 20110120441 | WIRE SAWING DEVICE The wire saw for sawing a work piece, e.g. to make silicon wafers for electronic applications, has two or more sawing fields (10, 20) each having a number of saw wires (11, 21) stretched between respective wire guiding cylinders (3, 4; 5, 6). The sa... | 05/26/2011 |
| 20110100346 | ABRASIVE GRAIN POWDER Abrasive grain powder, in particular intended for machining silicon ingots, such that the granulometric fraction D40-D60 comprises more than 15% and less than 80%, as percentages by volume, of grains having circularity of less than 0.85.... | 05/05/2011 |
| 20110100348 | Mounting Plate For A Wire Sawing Device, Wire Sawing Device Comprising The Same, And Wire Sawing Process Carried Out By The Device The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide... | 05/05/2011 |
| 20110100347 | Wire and Methodology for Cutting Materials With Wire Wire for cutting feedstock and a method for cutting feedstock with the wire. The wire may include an iron based alloy comprising at least 35 at % iron, nickel and/or cobalt in the range of about 7 to 50 at %, at least one non-metal or metalloid selected from the group c... | 05/05/2011 |
| 20110094490 | Method for The Manufacture of Reinforced Diamond-Coated Cables and Cable Obtained Using Such Method The method relates to the manufacture of a reinforced diamond-coated cable for cutting structures and materials of steel, concrete, steel and concrete, stone materials or the like, in which such diamond-coated cable comprises a plurality of outer strands (101) of... | 04/28/2011 |
| 20110083655 | MOUNTING PLATE FOR A WIRE SAWING DEVICE, WIRE SAWING DEVICE COMPRISING THE SAME, AND WIRE SAWING PROCESS CARRIED OUT BY THE DEVICE The device (1) for wire sawing of a piece (10) to be sawed that is mounted on a support table (20) comprises fastening means (15, 26, 40) for fastening said piece (10) to be sawed to a carriage (18) apt to cooperate with a guide... | 04/14/2011 |
| 20110061639 | AGGREGATE CUTTING SAW CHAIN Embodiments of the disclosure provide an aggregate cutting saw chain having a pitch in the range of approximately 0.440 to approximately 0.450. Embodiments also include tie straps and/or other components having fluid distribution features.... | 03/17/2011 |
| 20110059679 | METHOD FOR SLICING WORKPIECE The present invention is a method for slicing a workpiece into wafers by pressing a cylindrical workpiece held with a workpiece holder against a wire row formed by a wire spirally wound between a plurality of wire guides and making the wire travel while supplying a slur... | 03/10/2011 |
| 20100300423 | Compound semiconductor substrate production method A method of making a compound semiconductor substrate includes providing a GaN compound semiconductor single crystal ingot, and cutting the ingot with a cutter to form a GaN single crystal substrate. The cutting is performed while controlling a temperature in a contact ... | 12/02/2010 |
| 20100258103 | METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW The present invention is a wire saw in which a wire is wound around a plurality of grooved rollers, the workpiece is sliced into wafers by causing the wire to travel and pressing the workpiece against the wire while a slurry is supplied to the grooved rollers, the wire ... | 10/14/2010 |
| 20100252017 | METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a workpiece is sliced simultaneously at a plurality of points arranged in an a... | 10/07/2010 |
| 20100212650 | CUTTING MACHINE FOR BLOCKS OF NATURAL STONE AND SIMILAR INTO SLABS WITH DIAMOND WIRES A machine for cutting blocks of natural or similar types of stone includes a plurality of diamond-wire loops, wound about an assembly for the support and transmission of the cutting motion to said diamond-wire loops and at least one assembly for supporting, tensioning a... | 08/26/2010 |
| 20100206286 | Cutting Chain A cutting chain for cutting concrete and other similar materials having wear and stretch resistant features. In one embodiment, the cutting chain can include chain links having a debris trap for hindering the entry of debris onto bearing surfaces. In one embodiment, sid... | 08/19/2010 |
| 20100170495 | METHOD AND SYSTEM FOR MANUFACTURING WAFER-LIKE SLICES FROM A SUBSTRATE MATERIAL The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device ... | 07/08/2010 |
| 20100163010 | SLICING METHOD AND A WIRE SAW APPARATUS The present invention is a slicing method and a wire saw apparatus including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the ... | 07/01/2010 |
| 20100126490 | METHOD AND APPARATUS FOR CUTTING AND CLEANING WAFERS IN A WIRE SAW A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are... | 05/27/2010 |
| 20100126488 | METHOD AND APPARATUS FOR CUTTING WAFERS BY WIRE SAWING A method and apparatus of cutting wafers by wire sawing is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located sub... | 05/27/2010 |
| 20100089377 | SLICING METHOD AND WIRE SAW APPARATUS The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which w... | 04/15/2010 |
| 20100071681 | APPARATUS FOR CUTTING A STONE WHILE IN THE GROUND AND METHOD FOR MANUFACTURE Embodiments of stone cutting apparatus may include at least one sheave, which is coupled to a stone cutting belt to drivingly engage the stone cutting belt. Belt may include an endless cable, numerous abrasive segments disposed along the length of the cable, and a flexi... | 03/25/2010 |
| 20100051009 | WIRE MONITORING A sawing device for sawing silicon blocks comprises at least one cutting element for sawing silicon blocks, the cutting element being drivable by means of a drive device, at least one guide device, with the at least one cutting element being alignable along a predetermi... | 03/04/2010 |
| 20100043769 | WIRE SAW AND METHOD FOR PRODUCING A WIRE SAW A wire saw (S) for separating a plurality of ceramic components (11-16) from a ceramic component block (1) has a roller system (2), the roller system has a plurality of deflecting rollers (3-5) guiding a wire (6) to form ... | 02/25/2010 |
| 20100037881 | Slicing method The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wh... | 02/18/2010 |
| 20090293856 | UNDERWATER DIAMOND WIRE SAW ASSEMBLY A wire saw assembly having a slide frame, support frames, a tensioning carriage, and a diamond wire cutting saw. The slide frame has a mounting plate attached slidably to mounting plate rails. The mounting plate engages a lead screw so that rotation of the lead screw mo... | 12/03/2009 |
| 20090288651 | MULTIWIRE SAWING MACHINE FOR THE CUTTING OF MATERIAL IN BLOCK FORM The sawing machine comprises a guide pulley composed of a plurality of wheels of the same diameter, coaxial and mutually juxtaposed side by side in a pack on a corresponding shaft or the like According to the invention, in said wheel pack o... | 11/26/2009 |
| 20090199836 | CARBON NANOTUBE REINFORCED WIRESAW BEAM USED IN WIRESAW SLICING OF INGOTS INTO WAFERS A wiresaw beam for use in an apparatus for slicing wafers from an ingot, such as semiconductor wafers from a single crystal ingot or a polycrystalline silicon ingot. The wiresaw beam may be made from a polymer composite material comprising a thermoset polymer resin and ... | 08/13/2009 |
| 20090126712 | Stone Saw Blade A stone saw blade (1) includes an elongated base body (2) and a plurality of teeth (3). The teeth (3) are designed and arranged to be unset and to include geometrically defined cutting portions (11). The teeth (3) include a form... | 05/21/2009 |
| 20090126713 | Slurry composition containing non-ionic polymer and method for use A wiresaw cutting fluid composition of the present invention comprises about 25 to about 75% by weight of a particulate abrasive suspended in an aqueous carrier containing a polymeric viscosity modifier that comprises a polymer including a majority of non-ionic monomer ... | 05/21/2009 |
| 20090120422 | Electrodeposited wire tool A plating layer 18 of Ni or the like is formed around the outer peripheral face 14 of a wire tool 10, and super abrasive grains 16 are electrodeposited so as to be embedded in the plating layer 18. A coating layer 20 is formed o... | 05/14/2009 |
| 20090090344 | MONOFILAMENT METAL SAW WIRE Monofilament metal saw wire for a wire saw, wherein the saw wire being provided with a plurality of crimps. The crimps are arranged in at least two different planes, such that, when measured, between measuring rods of a micrometer, over a length comprising crimps in at ... | 04/09/2009 |
| 20090084373 | Method of Manufacturing (110) Silicon Wafer The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a ... | 04/02/2009 |
| 20090064983 | Methods, Wires, and Apparatus for Slicing Hard Materials Methods, wires, and apparatus for use in cutting (e.g., slicing) hard, brittle materials is provided. The wire can be a super-abrasive wire that includes a wire core and super-abrasive particles bonded to the wire core via a metal bonding layer. This wire, or another ty... | 03/12/2009 |
