Bizarre Patents
A new toilet tank assembly aquarium for housing aquatic creatures.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20100037880 | SLURRY FOR SLICING SILICON INGOT AND METHOD FOR SLICING SILICON INGOT USING THE SAME The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to... | 02/18/2010 |
| 20090320819 | CARBON NANOTUBE FIBER WIRE FOR WAFER SLICING A wire saw for cutting hard materials includes a carbon nanotube fiber wire spun from carbon nanotubes. The carbon nanotube fiber wire may be made from a plurality of fibers, each fiber being spun from carbon nanotubes, the fibers being twisted together to form the wire... | 12/31/2009 |
| 20090199836 | CARBON NANOTUBE REINFORCED WIRESAW BEAM USED IN WIRESAW SLICING OF INGOTS INTO WAFERS A wiresaw beam for use in an apparatus for slicing wafers from an ingot, such as semiconductor wafers from a single crystal ingot or a polycrystalline silicon ingot. The wiresaw beam may be made from a polymer composite material comprising a thermoset polymer resin and ... | 08/13/2009 |
| 20090166782 | WAFER PROCESSING Methods, devices, and systems for wafer processing are described herein. One method of wafer processing includes modifying a peripheral edge of a wafer to create a number of edge surfaces substantially perpendicular to a number of dicing paths and dicing the wafer along... | 07/02/2009 |
| 20090084373 | Method of Manufacturing (110) Silicon Wafer The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a ... | 04/02/2009 |
| 20080214094 | METHOD FOR MANUFACTURING SILICON WAFER A method for manufacturing a silicon wafer comprises a slicing step of a silicon single crystal ingot to obtain sliced wafers, a single-side grinding step to grind only one side of a wafer, and a smoothing step to smooth the other side of the wafer by controlling applic... | 09/04/2008 |
| 20070227521 | Processing tips and tools using the same A processing tip including a first processing part, and a second processing part attached to an upper surface of the first processing part and having a front portion and a rear portion, the front portion having an apex and a first width and the rear portion having a sec... | 10/04/2007 |
